99232 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Amines together with other curing agents
Sub-classes:Liquid Ejecting Head And One-Liquid Type Glue
#2SOLUTION OF POLYPHENOLS IN AMINE
#3EPOXY RESIN CURABLE COMPOSITION AND ADHESIVE CONTAINING THE SAME
#4EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER
#5TWO COMPONENT (2K) EPOXY FORMULATION
#6LATENT AMINE COMPOSITIONS FOR FLAME RESISTANT EPOXY SYSTEM
#7REINFORCING RESIN COMPOSITION AND MOUNTED STRUCTURE
#8Epoxy Resin Adhesives
#9WATERBORNE EPOXY CURING AGENT
#10AMINE COMPOSITION, EPOXY SYSTEM PREPARED FROM THE AMINE COMPOSITION AND AN EPOXY RESIN, AND USE OF THE EPOXY SYSTEM
#11BIO-BASED AMINE CURING AGENT FOR CURABLE COMPOSITIONS
#12CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE
#13CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE
#14RAPID-CURING RESIN COMPOSITION AND COMPOSITE MATERIAL CONTAINING THE SAME
#15USE OF SPECIAL THIOL COMPOUNDS TO IMPROVE THE STORAGE STABILITY OF COMPOSITIONS BASED ON EPOXY RESINS CONTAINING AMINE COMPOUNDS
#16Epoxy resin curing agent, epoxy resin composition, and use of amine composition
#17Use of salts as accelerators in an epoxy resin compound for chemical fastening
#18COATING COMPOSITION FOR ELECTRICAL STEEL SHEET, ADHESIVE SURFACE-COATED ELECTRICAL STEEL SHEET AND LAMINATED CORE
#19LIQUID MIXTURES OF PROPOXYLATED PARA-TOLUIDINES
#20Curing agent for epoxy resins
#21AQUEOUS COATING COMPOSITION CONTAINING AN EPOXY-AMINE SYSTEM AND AN AROMATIC CARBOXYLIC ACID AS CURING CATALYST
#22Curing agent for epoxy resins
#23EPOXY RESIN COMPOSITION
#24Waterborne epoxy curing agent
#25Epoxy resin systems
#26Curable resin composition
#27THERMOSETTING RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MOLDED BODY AND METHOD FOR PRODUCING SAME
#28Solvent-less ionic liquid epoxy resin
#29Use of special thiol compounds to improve the storage stability of compositions based on epoxy resins containing amine compounds
#30Thiol-containing composition
#31COMPOSITION, CURED PRODUCT, METHOD FOR MANUFACTURING CURED PRODUCT, METHOD FOR MANUFACTURING COATING FILM, AND METHOD FOR MANUFACTURING COMPOSITION
#32Use of functionalized alpha-angelica lactones
#33Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure
#34Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
#35Use of salts as accelerators in an epoxy resin compound for chemical fastening
#36Curing agent composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system
#37Field device of automation technology and method for its manufacture
#38Two-part adhesive composition that undergoes a visual change when cured
#39THIOL-CONTAINING COMPOSITION
#40Curing composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system
#41USE OF HETEROCYCLIC AMINES CONTAINING PRIMARY OR SECONDARY AMINES AS A POLYMER CATALYST OR HARDENER
#42FAST CURING EPOXY SYSTEM FOR PRODUCING RIGID FOAM AND USE OF THE FOAM IN COMPOSITES OR AS INSULATION MATERIAL
#43Multi-component epoxy resin compound with leakage indicator, and curing component for the epoxy resin compound
#44HEAT-DISSIPATING COMPOSITION, HEAT-DISSIPATING MEMBER, AND FILLER AGGREGATE FOR HEAT-DISSIPATING MEMBER
#45Curing agent composition and curing agent coating formula thereof
#46Resin composition for fiber-reinforced plastic, cured product of same, and fiber-reinforced plastic comprising said cured product
#47N,N'-DIALKYL METHYLCYCLOHEXANEDIAMINE AS REACTIVE DILUENT WITHIN EPOXY RESIN SYSTEMS
#48Cycloaliphatic amines for epoxy formulations: a novel curing agent for epoxy systems
#49Epoxy resin material, preparation method therefor and application thereof
#50Thermosetting resin composite and metal clad laminate using the same
#51Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same
#52Storage stable epoxy prepregs from dicyandiamide solutions and methods for making the same
#53Hardener composition for epoxy resin based coating compositions, process for their preparation and use thereof
#54IMPROVEMENTS IN RESIN CURATIVE SYSTEMS
#55ADHESIVE COMPOSITION, COMPONENT, AND METHOD OF FORMING THE COMPONENT
#56Epoxy resin adhesive with high compressive strength
#57Thermosetting resin composition
#58GAS BARRIER FILM
#59Curing agent for epoxy resins
#60Curing agent for epoxy resins
#61Method for preparing fluorine-silicon-containing polyphosphate ester and flame retardant epoxy resin
#62Composition including a polythiol, a polyepoxide, a photolatent base, and an amine and methods relating to the composition
#63Compositions including a photolatent amine, camphorquinone, and coumarin and related methods
#64Resin composition and method for manufacturing thermally conductive material
#65Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same
#66Curing agent for low-emission epoxy resin compositions
#67Method of making structured hybrid adhesive articles including lightning strike protection sheets
#68Thermosetting resin composition, and prepreg and substrate using same
#69Two-component epoxy resin paint
#70Epoxy resin curing agent, epoxy resin composition, and carbon fiber-reinforced composite material
#71Amine compound, amine composition, and epoxy resin curing agent
#72Blend for curing epoxy resin composistions
#73Epoxy resin systems
#74Composite panel material
#75MEDICAL DEVICE AND THERMOSETTING ADHESIVE FOR MEDICAL DEVICE
#76Fast cure epoxy resin compositions
#77FLAME-RETARDANT, HIGH TEMPERATURE RESISTANT THERMOSETS ON THE BASIS OF NAPHTHALENE-BASED EPOXY RESINS AND CYANATE ESTERS
#78ANTI-BIOFOULING COATING BASED ON EPOXY RESIN AND AMINE-FUNCTIONAL POLYSILOXANE
#79Formulation methodology for distortional thermosets
#80Aqueous adhesive composition based on epoxy resin with improved adhesion and storage stability
#81Floor coating composition
#82Amine for low-emission epoxy resin compositions
#83Reaction-curable adhesive, adhesive kit, and method of using reaction-curable adhesive
#84Curable compositions
#85Latent epoxy resin formulations for liquid impregnation processes for production of fibre composite materials
#86Epoxy resin system for making carbon fiber composites
#87Diene/dienophile couples and thermosetting resin compositions having reworkability
#88Epoxy resin composition, molded article, prepreg, fiber-reinforced composite material and structure
#89Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering
#90COMPOSITION INCLUDING A POLYTHIOL AND A POLYEPOXIDE AND METHODS RELATING TO THE COMPOSITION
#91RESINS AND COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS
#92Cyclic carbonates
#93Method of making a polymer network from a polythiol and a polyepoxide
#94Intumescent coating composition
#95Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device
#96Resin composition, copper clad laminate and printed circuit board using same
#97Semiconductor device and image sensor module
#98Production method for inclusion compound
#99Reinforced building block made of autoclaved aerated concrete (AAC)
#100Epoxy resin composition, prepreg, cured resin, and fiber reinforced composite material (as amended)
#101EPOXY RESIN COMPOSITION COMPRISING 2-(3,3,5-TRIMETHYLCYCLOHEXYL)PROPANE-1,3-DIAMINE AS HARDENER
#102One component epoxy curing agents comprising hydroxyalkylamino cycloalkanes
#103Accelerated and Toughened Two-Part Epoxy Adhesives
#104Epoxy systems for composites
#105Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof
#106Suspension polymerization compositions, methods and uses thereof
#107Epoxy resin composition for fiber-reinforced composite material, method for producing epoxy resin composition for fiber-reinforced composite material, prepreg, and honey-comb panel
#108High-CTI and halogen-free epoxy resin composition for copper-clad plates and use thereof
#109Crystal polymorphism of inclusion compound and method for producing same, and curable resin composition
#110Conductive coating material for shielding electronic component package and method for producing shielded package
#111Uspension polymerization compositions, methods and uses thereof
#112Epoxy curing agents, compositions and uses thereof
#113Thiol group-containing polymer and curable composition thereof
#114CURING AGENTS FOR LOW-EMISSION EPOXY RESIN PRODUCTS
#115Optical-device surface-sealing composition, optical-device surface-sealing sheet, display, and display manufacturing method
#116Latent epoxy resin formulations for liquid impregnation processes for production of fibre-reinforced composites
#117Epoxy resin compositions for production of storage-stable composites
#118Curing agent for epoxy coatings
#119Nitrogen-containing heterocyclic epoxy curing agents, compositions and methods
#120STRUCTURAL HYBRID ADHESIVES
#121Formulation methodology for distortional thermosets
#122Resin composition
#123Two-part liquid shim compositions
#124Polyurethane-acrylate epoxy adhesive
#125Thermosetting resin composition and prepreg and laminate both made with the same
#126Thiol group-containing polymer, curable composition thereof and method of producing same
#127Flame-retardant, high temperature resistant thermosets on the basis of naphthalene-based epoxy resins and cyanate esters
#128IMPROVEMENTS IN OR RELATING TO FIBRE REINFORCED COMPOSITES
#129Fast cure epoxy resin compositions
#130Epoxy-based substance for fixing purposes, the use thereof and the use of specific components
#131Curing agent composition
#132Epoxy systems having improved fracture toughness
#133Curable epoxy composition, film, laminated film, prepreg, laminate, cured article, and composite article
#134Epoxy systems for composites
#135Resin composition, copper clad laminate and printed circuit board using same
#136MULTI-COMPONENT EPOXY RESIN COMPOSITION
#137One-component curable resin composition
#138Curing agent for epoxy coatings
#139Use of an epoxide-amine-based multicomponent mortar composition
#140High modulus epoxy adhesives for shimming applications
#141Structural member for electronic devices
#142Epoxy resin formulations
#143Fast epoxy resin for repairing glazed surfaces by manual lamination
#144Thermosetting resin composition
#145COMPOSITION AND METHOD OF MAKING WATER BORNE EPOXY HARDENER FOR USE IN TWO-COMPONENT EPOXY SELF LEVELLING COMPOUNDS WITH LONG POT LIFE, FAST CURE AND LOW SHRINKAGE CHARACTERISTICS
#146Diene/dienophile couples and thermosetting resin compositions having reworkability
#147Curable composition with high fracture toughness
#148Anticorrosive coating composition, anticorrosive coating film, and method for preventing corrosion of substrate
#149Amine for low-emission epoxy resin products
#150Curing agents for low-emission epoxy resin products
#151Thiol group-containing polymer and curable composition thereof
#152Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition
#153Curable resin composition and short-cure method
#154Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
#155Curable composition for hard disk drive
#156Aromatic aldehyde, and epoxy resin curing agent and epoxy resin composition comprising the aromatic aldehyde
#157Thermosetting resin composition, thermosetting adhesive sheet, and method of producing thermosetting adhesive sheet
#158Epoxy liquid curing agent compositions
#159Curable composition
#160Curing agent for epoxy resin coatings
#161One component epoxy curing agents comprising hydroxyalkylamino cycloalkanes
#162Curing agent for low temperature cure applications
#163Thermosetting composition and process for preparing fiber-reinforced composites
#164Curable resin compositions
#165Corrosion-inhibiting microgels and non-chromated primer compositions incorporating the same
#166Curable resin compositions
#167Epoxy resin compositions using solvated solids
#168Hardener for epoxy resins
#169Low-emission hardener for epoxy resins
#170Shape memory polymer which functions as a dry adhesive clamp and methods of making and using the same
#171Photocurable film-forming composition and manufacturing method for cured film
#172Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same
#173Curable resin composition and short-cure method
#174Curable compositions
#175Curable and cured compositions
#176Etheramines containing flexible and rigid segments and their use as intermediates for polymer synthesis
#177ONE COMPONENT EPOXY RESIN COMPOSITION
#178Halogen-free resin composition and its application for copper clad laminate and printed circuit board
#179Adhesive film and electronic device including the same
#180Accelerators for polymerization of epoxy resins
#181Composition for the preparation of organic electronic (OE) devices
#182Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate
#183Epoxy Resin Compositions
#184THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND SEMICONDUCTOR DEVICE
#185ETHERAMINES CONTAINING FLEXIBLE AND RIGID SEGMENTS AND THEIR USE AS INTERMEDIATES FOR POLYMER SYNTHESIS
#186Compositions comprising polymeric binders
#187Etheramines and their use as intermediates for polymer synthesis
#188Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties
#189EPOXY RESIN COMPOSITION
#190High pH process resistant coating for metal food containers
#191Epoxy resin based core filler material developing low exothermic heat
#192Curable compositions containing cyclic diamine and cured products therefrom
#193EPOXY SYSTEMS FOR COMPOSITES
#194Blends comprising epoxy resins and mixtures of amines with guanidine derivatives
#195Epoxy resin curing compositions and epoxy resin systems including same
#196Epoxy resin curing compositions and epoxy resin systems including same
#197HIGH THERMAL CONDUCTIVITY AND LOW DISSIPATION FACTOR ADHESIVE VARNISH FOR BUILD-UP ADDITIONAL INSULATION LAYERS
#198Curing system and coatings obtained thereof
#199Carbon/epoxy resin composition, and carbon-epoxy dielectric film produced by using the same
#200Phenalkamine and salted amine blends as curing agents for epoxy resins
#201THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE WITH THE SAME.
#202Epoxy-amine composition modified with hydroxyalkyl urethane
#203EPOXY COMPOSITIONS WITH IMPROVED MECHANICAL PERFORMANCE
#204Coating system
#205CROSS-LINKED SILICONE PARTICLES AND METHOD OF MANUFACTURING THEREOF
#206TWO-PART LIQUID SHIM COMPOSITIONS
#207ACCELERATORS FOR POLYMERIZATION OF EPOXY RESINS
#208Coating system
#209Curing agents for epoxy resins
#210Curing agent for low temperature cure applications
#211Low temperature, moisture curable coating compositions and related methods
#212Epdxy resin for prepreg, prepreg, fiber-reinforced composite material, and methods for production thereof
#213COATING SYSTEM
#214Epoxy resin composition for fiber-reinforced composite material
#215Prepreg
#216CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION
#217RESIN COMPOSITION FOR COMPOSITE MATERIAL PARTS
#218Reaction product of polyamine, acyclic carbonate and cyclic carbonate
#219Two-part epoxy composition
#220Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board
#221Epoxy resin for prepreg, prepreg, and fiber-reinforced composite material and methods for production thereof
#222Epoxy resin for prepreg, prepreg, fiber-reinforced composite material and methods for production thereof
#223EPOXY RESIN FOR PREPREG, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND PROCESSES FOR PRODUCING THESE
#224Intumescing, multi-component epoxide resin-coating composition for fire protection and its use
#225Polyepoxide, amine and mercaptan-terminated polyoxyalkylene
#226Multi-component epoxy-amine primer systems comprising a polythioether
#227Hardeners for coating compositions (IV)
#228Epoxy-acrylate/amine adhesive composition
#229Reaction product of polyamine and acyclic carbonate
#230Epoxy resin composition
#231Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
#232Silicone modified acrylics and epoxies
#233Silicone modified acrylics and epoxies
#234Method for producing a fiber-reinforced composite material plate
#235Infiltrant system for rapid prototyping process
#236Pigment dispersant for cathodic electrocoating composition
#237Terpolymers from lactide