C08G59/60 - CPC Classification Index

ClassID:

99234 ⎘

C08G59/60 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Amines together with other curing agents with amides

Recent Application in this class:

20250101281

2025-03-27

FAST CURABLE CRASH RESISTANT ADHESIVE COMPOSITION

20220153923

2022-05-19

THERMOSETTING RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MOLDED BODY AND METHOD FOR PRODUCING SAME

20210171703

2021-06-10

Insulation product comprising mineral fibers and a binder

20210139659

2021-05-13

Prepregs and production of composite material using prepregs

20210102061

2021-04-08

Curable compositions and related methods

20190194525

2019-06-27

COMPOSITION FOR RECOVERING HYDROCARBON FLUIDS FROM A SUBTERRANEAN RESERVOIR

20190185612

2019-06-20

Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same

20190119521

2019-04-25

Two-component epoxy resin paint

20180319929

2018-11-08

Epoxy resin composition, prepreg for fiber-reinforced composite material, and fiber-reinforced composite material

#10

20180251617

2018-09-06

Epoxy resin composition, prepreg, and fiber reinforced material

#11

20180237603

2018-08-23

Prepregs and production of composite material using prepregs

#12

20180211735

2018-07-26

Encapsulation composition for storage or confinement of waste which is toxic to health and/or the environment

#13

20180179423

2018-06-28

APCHA as a building block in curing agent formulations for structural adhesives

#14

20180079856

2018-03-22

Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device

#15

20170275416

2017-09-28

Epoxy resin, method for producing epoxy resin, curable resin composition, cured product, fiber reinforced composite material, and molded article

#16

20170247501

2017-08-31

Epoxy curing agents, compositions and uses thereof

#17

20170137562

2017-05-18

Nitrogen-containing heterocyclic epoxy curing agents, compositions and methods

#18

20170121451

2017-05-04

Epoxy resin, method for producing epoxy resin, curable resin composition and cured product thereof, fiber-reinforced composite material, and molded article

#19