C08G59/625 - CPC Classification Index

ClassID:

99238 ⎘

C08G59/625 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Alcohols or phenols Hydroxyacids

Sub-classes:

C08G59/626 » {Lactones} 4
C08G59/628 » {Phenolcarboxylic acids} 9

Recent Application in this class:

20260152600

HEAT-CURABLE COMPOSITION, CURED ARTICLE, ADHESIVE AGENT, AND HEAT-CURABLE COMPOSITION PRODUCTION METHOD

20250289985

HIGH-STRENGTH ADHESIVES FROM SUSTAINABLE COMPONENTS

20220229368

RESIST UNDERLAYER FILM-FORMING COMPOSITION

20220194912

ELASTOMER GEL FROM EPOXIDIZED VEGETABLE OIL AND USES THEREOF

20200165381

Lactide copolymers and ring-opened lactide copolymers

20200055979

Sheet-shaped prepreg

20200055975

Crosslinkable composition and crosslinked product

20190153153

Lactide copolymers and ring-opened lactide copolymers

20180258221

Lactide copolymers and ring-opened lactide copolymers

20170327629

Polyphenolic condensates and epoxy resins thereof

20130096243

Resin composition and resin molded article

20120184647

Epoxy resin compositions

20110195195

Water-borne paints based on epoxy resins

20110097669

Photocurable composition

20080233386

Thermosetting resin composition, resin sheet and resin sheet for insulated substrate

20070231582

Aging-resistant coatings and adhesive composites

20050004288

Resin composition, composition for solder resist, and cured article obtained therefrom