C08G59/628 - CPC Classification Index

ClassID:

99240 ⎘

C08G59/628 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Alcohols or phenols; Hydroxyacids Phenolcarboxylic acids

Recent Application in this class:

20260152600

HEAT-CURABLE COMPOSITION, CURED ARTICLE, ADHESIVE AGENT, AND HEAT-CURABLE COMPOSITION PRODUCTION METHOD

20250326885

SOLUTION OF POLYPHENOLS IN AMINE

20250109242

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM CONTAINING HYDROXYCINNAMIC ACID DERIVATIVE

20240192597

POLYMER, PHOTOSENSITIVE COMPOSITION, DRY FILM PHOTORESIST, AND LITHOGRAPHY METHOD

20200183282

Protective film-forming composition

20180112032

Cured film formation composition, orientation material, and retardation material

20170137564

NOVEL INCLUSION COMPOUND

20120153009

Method for surface mounting using cleaning-free activated resinous composition

20110031300

CLEANING-FREE ACTIVATED RESINOUS COMPOSITION AND METHOD FOR SURFACE MOUNTING USING THE SAME

20060217499

Liquid epoxy resin composition and semiconductor device

20050064336

Unsaturated group-containing multi-branched compounds, curable compositions containing the same, and cured products thereof