ClassID:

99672

C08G73/125 - CPC Classification

Classification description:

Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups  - ; Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors; Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain

Recent Application in this class:
#1
20250136761
2025-05-01

MODIFIED BISMALEIMIDE PREPOLYMER, RESIN COMPOSITION AND APPLICATION OF RESIN COMPOSITION

#2
20210188881
2021-06-24

Siloxane compound and polyimide precursor composition comprising same

#3
20170096530
2017-04-06

Composition for the production of polyimide film for flexible board of photoelectronic device

#4
20170051111
2017-02-23

Aliphatic polyimides from a 1:2 molar ration of diamine and unsaturated monoanhydride or unsaturated diacid

#5
20170044319
2017-02-16

Aliphatic polyimides from unsaturated monoanhydride or unsaturated diacid reacted with both monoamine and diamine

#6
20160369056
2016-12-22

POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF AND POLYIMIDE MADE THEREFROM

#7
20130330563
2013-12-12

Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same

#8
20130306916
2013-11-21

Chain extended epoxy to improve adhesion of conductive die attach film

#9
20130296501
2013-11-07

Polyimidothioethers-inorganic nanoparticle hybrid material, intermediate thereof and their preparation

#10
20130099149
2013-04-25

Insulating layer composition for substrate, and prepreg and substrate using the same

#11
20120228784
2012-09-13

SEMICONDUCTOR DEVICE

#12
20110319582
2011-12-29

Curable composition comprising inorganic oxide microparticles that are surface-modified with maleimide groups

#13
20110130485
2011-06-02

Imide-linked maleimide and polymaleimide compounds

#14
20100099041
2010-04-22

Positive-type photosensitive resin composition

#15
20090062480
2009-03-05

Heat-curable polyimide silicone resin composition

#16
20080075961
2008-03-27

Imide-linked maleimide and polymaleimide compounds