DIELECTRIC MATERIALS BASED ON HETEROAROMATIC-EXTENDED BISMALEIMIDES

THERMOSETTING BISCITRACONIMIDE RESIN COMPOSITION

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN

RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

PHOTOSENSITIVE RESIN COMPOSITION

FIBER REINFORCED POLYMER COMPOSITE STRUCTURES AND ELECTROMAGNETIC INDUCTION PROCESS FOR MAKING SAME

PHOTOSENSITIVE RESIN COMPOSITION, CURED ARTICLE, METHOD FOR MANUFACTURING CURED ARTICLE, ORGANIC EL DISPLAY DEVICE, AND DISPLAY DEVICE

RESIN COMPOSITION, CURED OBJECT, SHEET, LAYERED PRODUCT, AND PRINTED WIRING BOARD

TRIAZOLYL CROSS-LINKING AGENT AS WELL AS PREPARATION METHOD AND USE THEREOF

RESIN COMPOSITION

NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE

RESIN COMPOSITION

RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE

Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure

POLYIMIDES HAVING LOW DIELECTRIC LOSS

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

RESIN COMPOSITION AND ADHESIVE

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED SURFACE OF SUBSTRATE WITH SEMICONDUCTOR ELEMENT MOUNTED THEREON OR SEMICONDUCTOR ELEMENT-FORMING SURFACE OF WAFER WITH SEMICONDUCTOR ELEMENT FORMED THEREON, AND USE THEREOF

PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF AND MULTILAYER MATERIAL

POLYIMIDE PRECURSOR, PREPARATION METHOD THEREOF, PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT

THERMOSET COMPOSITE COMPRISING A CROSSLINKED IMIDE EXTENDED COMPOUND

POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED USING THE SAME

Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

FIBER REINFORCED POLYMER COMPOSITE STRUCTURES AND ELECTROMAGNETIC INDUCTION PROCESS FOR MAKING SAME

Remoldable bismaleimide resin and application thereof

MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM

Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Modified allyl compound, modified bismaleimide prepolymer

BISMALEIMIDE COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION USING SAME, CURED PRODUCT THEREOF, AND SEMICONDUCTOR ELEMENT

FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN

FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN

Polyimides

MALEIMIDE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF

POLY(AMIDE-IMIDE) COPOLYMER, COMPOSITION AND POLYMER FILM COMPRISING THEREOF

Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board

Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component

Thermosetting resin composite and metal clad laminate using the same

Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same

Polyimides

Semipreg, prepreg, resin composite material, and production methods thereof

Modified bismaleimide resin and preparation method thereof

Bismaleimide-based solution for inkjet ink for three dimensional printing

Vinylbenzyl imide resin, method of preparing vinylbenzyl imide resin, vinylbenzyl imide prepolymer, resin composition and article made therefrom

Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts

Resin, composition, cured film, method for manufacturing cured film and semiconductor device

Precursor for polyimide and use thereof

Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them

Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device

Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

Oligomer additive and lithium battery

Liquid crystal display element

LIQUID CRYSTAL DISPLAY ELEMENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL ALIGNMENT TREATMENT AGENT

Method for preparing vinyl chloride copolymer and vinyl chloride copolymer produced by the same

Dispersant additives and additive concentrates and lubricating oil compositions containing same

LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT

Thermoplastic polymers comprising oxygen scavenging molecules

Resin composition for sealing semiconductor and semiconductor device

Resistive grid elements having a thermosetting polymer

Curable mixtures based on xylylene bismaleimide

Resin composition, and prepreg and laminate using the same

Thermoplastic polymers comprising oxygen scavenging molecules

Photoalignment polyimide copolymer and liquid crystal alignment layer

Polyimidothioethers-inorganic nanoparticle hybrid material, intermediate thereof and their preparation

Base generator

Polyimide precursor composition and preparation method and use thereof

Resin composition and semiconductor device produced by using the same

Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate

HEAT SEALABLE SUBSTRATE AND A PROCESS FOR MAKING THE SAME

Polymer derivatives comprising an imide branching point

Resin composition and semiconductor device produced by using the same

THERMOSETTING POLYIMIDE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE

Particle-toughened fiber-reinforced polymer composites

Photosensitive resin composition and cured film

Curable composition comprising inorganic oxide microparticles that are surface-modified with maleimide groups

Liquid crystal alignment agent, film and display element

Pixel electrode panel, a liquid crystal display panel assembly and methods for manufacturing the same

Pixel electrode panel, a liquid crystal display panel assembly and methods for manufacturing the same

Liquid crystal display and method for producing the same

Thermoplastic polymers comprising oxygen scavenging molecules

Imide-linked maleimide and polymaleimide compounds

Aromatic dicyanate compounds with high aliphatic carbon content

Particle-toughened fiber-reinforced polymer composites

Polyamide-imide resin, process for production of polyamide resin, and curable resin composition

Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate

Precursor composition for polyimide and use thereof

Water soluble photosensitive polymide polymer, its preparation and photoresist containing the same

Proton exchange membrane composition

Thermosetting resin composition and prepreg and laminate obtained with the same

CURATIVES FOR EPOXY ADHESIVE COMPOSITIONS

Optical film and image display device

SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE

Liquid crystal display device

REACTIVE MONOMER AND RESIN COMPOSITION CONTAINING SAME

Method and formula for forming hyper-branched polymer

Optical film, image display device, diethynylfluorene, and polymer thereof

THERMOSETTING POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF

Photoalignment material, display substrate having an alignment layer formed using the same, and method of manufacturing the display substrate

Compositions comprising biscitraconimide, bisitaconimide, and/or citraconimido-itaconimide

Photosensitive polyimides

METAL-CLAD LAMINATES HAVING IMPROVED PEEL STRENGTH AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF

Metal-clad laminates having improved peel strength and compositions useful for the preparation thereof

Polymer Derivatives Comprising an Imide Branching Point

Nonaqueous electrolyte having maleimide additives and secondary cells employing the same

Tailorable polyimide prepolymer blends, crosslinked polyimides, and articles formed therefrom

Imide-linked maleimide and polymaleimide compounds

Non-gelled curable compositions containing imide functional compositions

Resin composition and semiconductor device produced by using the same

Resin composite copper foil, printed wiring board, and production processes thereof

Wafer-level processing of chip-packaging compositions including bis-maleimides

Bismaleimide prepreg systems

Bismaleimide resin with high temperature thermal stability

Phase transfer catalyzed method for preparation of polyetherimides

Method to prepare bis(haloimides)

Method for the preparation of bis(haloimides)

Non-gelled curable compositions containing imide functional compounds

Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them

Curable resin composition and its use

Maleimide compounds in liquid form

Approach to reduce cyclics formation in 3-CIPA based polyetherimide polymers

Compound containing epoxide and maleimide groups, cured resin prepared from said compound