99673 ⎘
Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups - ; Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors; Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
Sub-classes:PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE
#2BISMALEIMIDE COMPOUND, RESIN COMPOSITION INCLUDING SAME, CURED OBJECT THEREFROM, SEMICONDUCTOR ELEMENT AND DRY FILM RESIST
#3PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM
#4CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE
#5NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE
#6POLYIMIDE PRECURSOR SOLUTION, POROUS POLYIMIDE MEMBRANE, AND INSULATED ELECTRIC WIRE
#7Resin composition, preparation method thereof and article made therefrom
#8Remoldable bismaleimide resin and application thereof
#9Negative photosensitive resin composition, production method for polyimide, production method for cured relief pattern, and semiconductor device
#10MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM
#11THERMOSETTING RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME
#12POLY(AMIDE-IMIDE) COPOLYMER, COMPOSITION AND POLYMER FILM COMPRISING THEREOF
#13Siloxane compound and polyimide precursor composition comprising same
#14Polyimide, laminate, and electronic device including same
#15Reversible crosslinking reactant composition
#16COMPOUND, RESIN, COMPOSITION, AND FILM FORMING MATERIAL FOR LITHOGRAPHY USING THE SAME
#17Transparent polyimide film
#18Reversible crosslinking reactant composition
#19Resin composition and uses of the same
#20Furan-modified compound and oligomer
#21Polyimide precursor composition
#22Alkenylphenoxy-substituted 1,1-diphenylethylenes, processes for their preparation, and their use
#23Resin composition and uses of the same
#24Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film
#25Fluorine-containing modified bismaleimide resin
#26Polyamic acid, varnish comprising same and polyimide film
#27Polyimide oligomers
#28Chain extended epoxy to improve adhesion of conductive die attach film
#29Insulating layer composition for substrate, and prepreg and substrate using the same
#30Friction material and resin composition for friction material
#31Optical film and image display device
#32Positive-type photosensitive resin composition
#33Photosensitive polyimides
#34REACTIVE MONOMER AND RESIN COMPOSITION CONTAINING SAME
#35Optical film, image display device, diethynylfluorene, and polymer thereof
#36Photosensitive polyimides
#37Thermally curable composite resin composition, prepreg, composite film and laminated material for circuit having the same
#38Bismaleimide resin with high temperature thermal stability
#39Self-sensitizing negative polyimide precursor and method for preparing the same, and use thereof