Thermoplastic polyurethane composition with high insulation resistance

Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition

Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers

Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers

Spin-on protective coatings for wet-etch processing of microelectronic substrates

Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers

ENDOSCOPIC DEVICE

Modified polyamide acrylate oligomers

EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL

Compositions and methods to produce triazine-arylhydroxy-aldehyde condensates with improved solubility

STABILIZERS FOR POLYMERS CONTAINING ALIPHATICALLY-BOUND BROMINE

USE OF POLYMERISABLE RESINS WITH LOW VACUUM OUTGASSING FOR THE MANUFACTURE OF COMPOSITE MATERIALS FOR USE IN SPACE

PHENOL NOVOLAC RESIN, PHENOL NOVOLAC EPOXY RESIN AND EPOXY RESIN COMPOSITION

ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND DIE ATTACH FILM

Varnish, prepreg, and substrate thereof

Adhesive formulation and also method for the treatment of reinforcing inserts

Varnish, prepreg, and substrate thereof

THERMOSETTING EPOXY COMPOSITION WITH LOW EXPANSIBILITY

Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers

Phosphorus-containing compounds useful for making halogen-free ignition-resistant polymers

Reacting compound having H-P=O, P-H or P-OH group with functional group-containing organic compound

Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate

Thermoplastic resin composition and shaped article therefrom

THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE WITH THE SAME.

Film-like adhesive, adhesive sheet, and semiconductor device using same

Thermosetting resin composition and prepreg and laminate obtained with the same

Semiconductor chip laminate and adhesive composition for semiconductor chip lamination

HEAT-ACTIVABLE ADHESIVE TAPE PARTICULARLY FOR BONDING ELECTRONIC COMPONENTS AND CONDUCTOR TRACKS

Bituminous products, the mixture thereof with aggregates and the use thereof

CURABLE HIGH REFRACTIVE INDEX RESINS FOR OPTOELECTRONIC APPLICATIONS

Spin-on protective coatings for wet-etch processing of microelectronic substrates

Coating compositions containing a carbinol functional silicone resin or an anhydride functional silicone resin

Polyester molding compositions

Waterborne adhesives for elastomers

Non-Halogen Flame Retardant and Highly Heat Resistant Phosphorous-Modified Epoxy Resin Compositions

Phosphorus Containing Compounds Useful for Making Halogen-Free, Ignition-Resistant Polymer

Polyamide resin composition

Medical devices containing radiation resistant polymers

Fire Resisting Composition

Polyester resin composition for profile extrusion molding and molded article comprising the same

Thermosetting resin composition

Curable high refractive index resins for optoelectronic applications

Powder coating fluoropolymer compositions with aromatic materials

Process for producing resin composition, modifier for polyester resin, and process for producing modified polyester resin

Rocket booster casings made with semipreg having a thermoplastic toughened novolac-based epoxy resin matrix

Epoxy grout systems for standard and chemically resistant installations