RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE

RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE

Underwater Curable Thermoset Composition

MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

RESIN COMPOSITION FOR MOLDING, AND ELECTRONIC COMPONENT DEVICE

EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER

COATING COMPOSITIONS

RESIN COMPOSITION FOR ENCAPSULATION AND METHOD FOR PRODUCING SINGLE-SIDED ENCAPSULATION STRUCTURE

LOW-DIELECTRIC RESIN COMPOSITION

THERMOSETTING RESIN COMPOSITION, COVERLAY FILM, ADHESIVE SHEET, AND FLEXIBLE PRINTED CIRCUIT BOARD

PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, TUBULAR BODY MADE OF FIBER-REINFORCED COMPOSITE MATERIAL, GOLF CLUB SHAFT, AND FISHING ROD

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM HAVING SACCHARIN SKELETON

COPOLYMER, SURFACTANT, RESIN COMPOSITION, AND HEAT DISSIPATION SHEET

Low Temperature Curable One Component Epoxy Compositions containing Resin-Blocked Urea Curatives

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

FIRE RETARDANT EPOXY RESIN

Sealing resin composition

PHENOLIC RESIN, EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED PRODUCT

FORMALDEHYDE FREE SAFE TO USE BINDER FORMULATION FOR WOVEN, NONWOVEN AND GRANULAR MATERIALS

CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT

METHOD FOR PRODUCING ENCAPSULATED STRUCTURE AND EPOXY RESIN COMPOSITION

EPOXY RESIN FOR SEMICONDUCTOR ADHESIVE, PREPARING METHOD THEREOF AND COMPOSITION COMPRISING THE SAME

ACRYLATE-EPOXY RESIN COMPOSITIONS

RESIN COMPOSITION, RESIN CURED PRODUCT, AND FIBER REINFORCED RESIN

Coating compositions

Foundry mix including resorcinol

MULTIFUNCTIONAL POLYOL RESINS, CURABLE COMPOSITIONS, AND METHODS THEREOF

Coating compositions

NOVEL HARDENER FORMULATION FOR COLD CURING EPOXY SYSTEMS

EPOXY RESIN, PREPARING METHOD THEREOF, EPOXY COMPOSITION COMPRISING THE SAME, AND USE THEREOF

Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring board

Novolak Resin, Epoxy Resin, Photosensitive Resin Composition, Curable Resin Composition, Cured Substance, Electronic Device, Production Method for Novolak Resin, and Production Method for Epoxy Resin

CURABLE COMPOSITION, CURED PRODUCT, ELECTRONIC DEVICE, DISPLAY DEVICE, OPTICAL MEMBER, POLYMER, PHOTOSENSITIVE COMPOSITION, PATTERN, AND COMPOUND

ACTIVE ESTER RESIN, METHOD FOR PRODUCING THEREOF, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, PREPREG, LAMINATED BOARD, AND MATERIAL FOR CIRCUIT SUBSTRATE

Low Density Flame Retardant Two-Component Composition for Structural Void Filling

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD

RESIN COMPOSITION, LAYERED BODY INCLUDING RESIN COMPOSITION LAYER, LAYERED BODY, FLEXIBLE COPPER-CLAD LAMINATE, FLEXIBLE FLAT CABLE, AND ELECTROMAGNETIC WAVE SHIELDING FILM

Thermosetting resin composition and prepreg

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

Curable resin composition, dry film and cured product thereof, and electronic component including cured product

RESIN COMPOSITION, BONDING FILM, LAYERED BODY INCLUDING RESIN COMPOSITION LAYER, LAYERED BODY, AND ELECTROMAGNETIC WAVE SHIELDING FILM

ANHYDROUS ALCOHOL-ALKYLENE GLYCOL COMPOSITION, ANHYDROUS ALCOHOL-BASED URETHANE-MODIFIED POLYOL COMPOSITION, AND USES OF SAME FOR EXPOXY RESIN COMPOSITION

Aqueous resin dispersion and aqueous coating composition containing said resin dispersion

PHENOLIC HARDENER FOR EPOXY POWDER COATINGS

PREPREG AND METHOD OF PRODUCING A FIBER-REINFORCED COMPOSITE MATERIAL

Fire-Retardant Resins and Composite Materials

BIODEGRADABLE POLYESTER AND METHOD FOR PREPARING THE SAME

EPOXY RESIN COMPOSITION, CURED PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND TOW PREPREG

Flux resin composition, electronic component, method for manufacturing the electronic component, mounting structure, and method for manufacturing the mounting structure

Foundry mix including resorcinol

Resin composition, prepreg containing same, laminate, and printed circuit board

Curable epoxy composition and its use in prepregs and core filling

THERMOSETTING RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MOLDED BODY AND METHOD FOR PRODUCING SAME

RESIN COMPOSITION, PREPREG CONTAINING SAME, AND LAMINATE BOARD AND PRINTED CIRCUIT BOARD

Prepreg manufacturing method and manufacturing apparatus

Phenoxy resin, resin composition including same, cured object obtained therefrom, and production method therefor

Aromatic polysulfone resin, epoxy resin composition, prepreg, and molded body

Resin composition comprising a specific crosslinking agent

FIRE RETARDANT EPOXY RESIN

Thermoplastic resin composition for laser welding, molded article made of same, and composite molded article

Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure

Epoxy compositions

RESIN COMPOSITION

RESIN COMPOSITIONS AND RESIN INFUSION PROCESS

Thermosetting epoxy resin composition having low curing temperature and good storage stability

Formaldehyde free safe to use binder formulation for woven, nonwoven and granular materials

Epoxy resin composition for fiber-reinforced composite materials, epoxy resin cured product, preform and fiber-reinforced composite material

Multiaxial textile resin base material and method of production thereof

THERMOPLASTIC POLYESTER RESIN COMPOSITION AND MOLDED ARTICLE THEREOF

EPOXY COMPOSITE FORMULATION

Encapsulating or filling composition for electronic devices and electronic apparatus

Fire-retardant resins and composite materials

Treated porous material

USE OF BORON NITRIDE NANOSHEETS TO INCREASE COMPOSITE MODULUS AND DECREASE VISCOSITY AND PHASE SEPARATION IN COMPOSITES WITH HYDROPHOBIC MONOMERS

TOUGHENED EPOXY COMPOSITIONS

PHOTORESIST COMPOSITION, LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE HEAD MANUFACTURING METHOD

Epoxy resin formulations

Multi-component epoxy resin compound with leakage indicator, and curing component for the epoxy resin compound

Epoxy resin composition and cured object obtained therefrom

RUBBER COMPOSITION BASED ON EPOXY RESIN AND AN AMINOBENZOATE DERIVATIVE

Epoxy-fiber reinforced composites, method to form the composites and epoxy resin composition used therefor

Composition of alkoxysilyl-functionalized epoxy resin and composite thereof

High temperature epoxy adhesive formulations

Bio-based epoxy resins, compositions, and methods thereof

Electrophotographic photoreceptor, method of manufacturing the photoreceptor, and electrophotographic device

Cationically curable compositions with latent reducing agent demonstrating low cure temperature

THERMALLY CONDUCTIVE SHEET PRECURSOR, THERMALLY CONDUCTIVE SHEET OBTAINED FROM THE PRECURSOR, AND PRODUCTION METHOD THEREOF

RESIN COMPOSITION AND MATERIALS CONTAINING A RESIN COMPOSITION

Thermoplastic polyester resin composition and molded article

Coating compositions

Prepreg and fiber-reinforced composite material

Heat-curable resin composition, prepreg, and fiber-reinforced composite material

Phenolic epoxy system

Epoxy based composition

Epoxy-functionalized novolak resin composition

Curable composition for fireproofing

CURABLE EPOXY COMPOSITIONS

HOT MELT EPOXY RESIN SYSTEM AND PROCESS FOR MAKING THE SAME

Epoxy-functionalized polyorganosiloxane toughener

Sealant sheet

RESIN COMPOSITION

SOLID HOMOGENEOUS AMORPHOUS HIGH HEAT EPOXY BLENDS, ARTICLES, AND USES THEREOF

Resin composition for acoustic matching layer, cured product, acoustic matching sheet, acoustic probe, acoustic measuring apparatus, method for producing acoustic probe, and acoustic matching layer material set

Curable epoxy resin composition and fiber-reinforced composite material using same

Foundry mix including resorcinol

DUAL CURE EXTENDED POT LIFE EPOXY COMPOSITION

Heat-dissipating resin composition, cured product thereof, and method of using same

High Tg epoxy formulation with good thermal properties

THERMOPLASTIC POLYESTER RESIN COMPOSITION AND MOLDED ARTICLE

Epoxy resin composition, electronic component mounting structure, and method for producing the same

RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR FABRICATING THE METAL-CLAD LAMINATE

Epoxy resin composition, prepreg, and fiber-reinforced composite material

THERMOSETTING RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREFORM, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL

STABILIZERS FOR BROMINATED POLYMERIC FLAME RETARDANTS

CATALYST-FREE CURABLE EPOXY COMPOSITIONS

Halogen-free epoxy resin composition and a prepreg and a laminate using the same

EPOXY RESIN, PRODUCTION METHOD, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

Flexible abrasive article

Curable epoxy resin composition, and fiber-reinforced composite material using same

Method for manufacturing fine-pitch anisotropic conductive adhesive and fine-pitch anisotropic conductive adhesive manufactured by same method

Method for producing compounds having oxazolidinone groups

Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor

Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board

Friction material composition, friction material, and friction member

Hardener for cold hardening epoxy resin adhesives having fast hardening

REINFORCED DYNAMICALLY CROSSLINKED POLYESTER NETWORK

Epoxy resin composition

LOW-LOSS INSULATING RESIN COMPOSITION AND INSULATING FILM USING THE SAME

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND INTEGRATED CIRCUIT PACKAGE, AND PRODUCT USING THE SAME

Resin varnish, prepreg, laminate, and printed wiring board

CURABLE EPOXY COMPOSITIONS

Two part adhesive composition

CATIONICALLY CURABLE SEALANT COMPOSITION

High temperature dry film lubricant

Resin composition, molded product and production method thereof

Resin composition for semiconductor package, prepreg, and metal clad laminate using the same

Resin composition for dense fuel cell separators

Rubber composition comprising an epoxide resin and a specific amine hardener

Systems, compositions and methods for curing leakages in pipes

Systems, compositions and methods for curing leakages in pipes

Piezo-resistive materials

Epoxy resin composition, prepreg, and fiber-reinforced composite material

Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

Epoxy resin, production method, epoxy resin composition and cured product of same

Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same

Resin compositions and resin infusion process

SEALANT COMPOSITION FOR ORGANIC SOLAR CELL, SEALANT FOR ORGANIC SOLAR CELL, ELECTRODE FOR ORGANIC SOLAR CELL AND ORGANIC SOLAR CELL

Low DK phosphorous containing hardener useful for halogen free, flame retardant polymers and use

Resin composition

Thermoplastic polyester resin composition and molded article

Reactive epoxy compounds and method for producing the same, core-shell type epoxy resin particles, waterborne epoxy resin composition, and coating composition containing the reactive epoxy compounds

Systems chemistry approach to polyhexahydrotriazine polymeric structures

Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, molded article, and cured molded article

EPOXY-FIBER REINFORCED COMPOSITES, METHOD TO FORM THE COMPOSITES AND EPOXY RESIN COMPOSITION USED THEREFOR

Curable coating compositions using succinic acid

High Tg epoxy formulation with good thermal properties

PRECURSORS FOR CARBON-CARBON COMPOSITES

THERMALLY CONDUCTIVE POLYMER COMPOSITION

Fuel cell separator

Foundry mix including resorcinol

Method for Preparing a Simultaneous Interpenetrating Network Comprising Epoxy and Vinyl Polymers for Epoxy Thermosets with Extended Outdoor Ultraviolet Weatherability

Semipreg with thermoplastic toughened novolac-based epoxy resin matrix

Resin composition, article of manufacture made therefrom and method of making the same

Carbon paste and capacitor element for a solid electrolytic capacitor using carbon paste

RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET AND PRINTED WIRING BOARD

Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same

Adhesive composition

Epoxy novolac composites

Treated porous material

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING CIRCUIT SUBSTRATE

Resin composition and product made therefrom

EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

MOLDING MATERIAL, MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED ARTICLE

Carbon fibre-containing prepregs

Thermosetting resin composition and method of producing same

Thermal barrier film, thermal barrier paint, and optical instrument

Silicone-based coating composition and silicone-based release film comprising the same

High-CTI and halogen-free epoxy resin composition for copper-clad plates and use thereof

Halogen-free epoxy resin composition, prepreg and laminate using same

Resin composition for high speed curing prepreg for car body parts through press method and a prepreg product containing the same

Resin composition for semiconductor encapsulation and semiconductor device

HALOGEN-FREE AND FLAME RETARDANT COMPOSITIONS WITH LOW THERMAL EXPANSION FOR HIGH DENSITY PRINTED WIRING BOARDS

Method of manufacturing cured phosphorus-containing flame-retardant epoxy composite

THERMOSETTING COMPOSITION FOR USE AS LOST CIRCULATION MATERIAL

Halogen free resin composition and prepreg and laminated board prepared therefrom

Systems chemistry approach to polyhexahydrotriazine polymeric structures

Method for making composite structure with a surfacing film thereon

Photo-imprinting resin composition, photo-imprinting resin film and patterning process

THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED WITH THE SAME

Systems chemistry approach to polyhexahydrotriazine polymeric structures

Polyolefin-based adhesive composition

HEAT-CURABLE RESIN COMPOSITION

Composites and epoxy resins based on aryl substituted compounds

Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same

HEAT-CURABLE EPOXY RESIN COMPOSITION

Thermosetting resin composition and prepreg and laminate both made with the same

Resin composition, backing material for ultrasonic vibrator, ultrasonic vibrator, and ultrasonic endoscope

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Fast curing high glass transition temperature epoxy resin system

HALOGEN FREE EPOXY FORMULATIONS WITH LOW DIELECTRIC CONSTANT

Thermoplastic polyester resin composition and molded article

Heat-curable resin composition, prepreg, and method for producing fiber-reinforced composite using each of same

A CURABLE EPOXY RESIN COMPOSITION

AN EPOXY RESIN COMPOSITION, AND PREPREG AND COPPER-CLAD LAMINATE MADE BY USING SAME

Halogen-free resin composition, and a prepreg and a laminate used for printed circuit using the same

Flame retardant for epoxy resin containing phosphonate and phosphinate functionality

Curable epoxy compositions

Phosphine-catalyzed, michael addition-curable sulfur-containing polymer compositions

Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same

Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same

Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device

Compound containing phosphonium ion, epoxy resin composition containing same, and device manufactured by using same

1K THERMOSET EPOXY COMPOSITION

RESIN COMPOSITION AND LAMINATE FOR PRINTED CIRCUIT BOARD COMPRISING SAME

Stabilizers for polymers containing aliphatically-bound bromine

COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL

Low-dielectric phosphorus-containing polyester composite and method of manufacturing the same

CYANATE RESIN COMPOSITION AND USE THEREOF

CYANATE RESIN COMPOSITION AND USE THEREOF

HMF-based phenol formaldehyde resin

Epoxy resin composition for encapsulating semiconductor device and semiconductor package encapsulated using the same

High Tg epoxy formulation with good thermal properties

Thermosetting resin composition

Phosphor-containing phenol formaldehyde resin compound and flame-retardant epoxy resin hardener made from thereof

Halogen-free resin composition, and prepreg and laminate for printed circuits using the same

AMINIC HARDENERS WITH IMPROVED CHEMICAL RESISTANCE

Furfural derivatives as a vehicle

Two-component-type primer, primer coating film, layered antifouling coating film, and method for preventing base material from being fouled

Brominated Flame Retardants and their use in Thermoplastic and Thermosetting Flammable Materials

Photosensitive resin composition and photosensitive film using same

Printing form and process for preparing the printing form with curable composition having solvent-free epoxy resin

Methods for making lignocellulose composite products

Methods for making lignocellulose composite products with oxidative binders and complexed metal catalyst

Curable epoxy composition and a composite made therefrom

Phosphine-catalyzed, michael addition-curable sulfur-containing polymer compositions

Waterborne adhesives for elastomers

THERMOSETTING RESIN COMPOSITION AND ITS USAGE

SELF-EXTINGUISHING EPOXY RESIN FOR EPOXY MOLDING COMPOUND, METHOD OF PREPARING THE SAME, AND EPOXY RESIN COMPOSITION FOR EPOXY MOLDING COMPOUND.

Liquid thermosetting resin composition for insulating stator coil of rotating electric machine

Curable epoxy resin compositions

Polymer particle dispersions with polyols

Novolac-based epoxy compound, production method for same, composition and cured article comprising same, and use for same

PHOSPHORUS-CONTAINING COMPOUNDS USEFUL FOR MAKING HALOGEN-FREE, IGNITION-RESISTANT POLYMERS

Epoxy Resin Composition, Prepreg, and Fiber-Reinforced Composite Material

Flame retardant with compositions

CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

Poly(phenylene ether)/epoxy homogeneous solid and powder coating composition incorporating same

Molding composition for semiconductor package and semiconductor package using the same

Phosphor-containing phenol formaldehyde resin and flame-retardant epoxy resin hardener containing thereof

Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the Same

Epoxy Resin Composition and Prepreg and Copper Clad Laminate Manufactured by Using the Same

Carbon fiber forming raw material, formed material, and carbon fiber-reinforced composite material

Composites and epoxy resins based on aryl substituted compounds

Fixing resin composition, rotor, automobile, and method of manufacturing rotor

Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same

Epoxy resin compound and radiant heat circuit board using the same

Resins, Resin/Fibre Composites, Methods of Use and Methods of Preparation

Carboxyl-containing resin, resin composition for solder mask, and method of preparing carboxyl-containing resin

Silicone Resins Comprising Metallosiloxane

Carbon fiber-reinforced thermoplastic resin composition, molding material, prepreg, and methods for producing same

COMPOSITIONS USEFUL FOR PREPARING COMPOSITES AND COMPOSITES PRODUCED THEREWITH

Blends of polysulfones and polyphenylene sulfide resins

Blends of polyphenylene sulfones and polyphenylene sulfide resins

Resin composition, copper-clad laminate and printed circuit board for use therewith

Epoxy resin compositions using solvated solids

Oxazolidone ring containing vinyl ester resin and products therefrom

Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate

EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD

Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same

Epoxy resin composition, prepreg, fiber-reinforced composite material, and housing for electrical or electronic equipment

Phosphorus-atom-containing oligomer composition, curable resin composition, cured product thereof, and printed circuit board

EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL

Epoxy resin composition for resin transfer molding of fiber-reinforced composite material, fiber-reinforced composite material, and method for producing same

Hot-formable and recyclable epoxy anhydride thermosetting resins and thermosetting composites

Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same

Epoxy resin composition for fiber reinforced composite material, prepreg, and fiber reinforced composite material

Printing form and process for preparing the printing form with curable composition having solvent-free epoxy resin

Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same

Fixing resin composition for use in rotor

Resin composition and uses of the same

Thermosetting resin composition, cured product thereof, and printed wiring board using the same

Photosensitive resin composition and cured product thereof

BLENDS OF POLYETHERIMIDE SULFONE AND POLY(ARYLENE SULFIDE) AND METHODS OF MAKING

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same

Method of manufacturing esterified substance

Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same

One component epoxy resin composition

PROCESS FOR PRODUCTION OF MICROFIBRILLATED CELLULOSE FIBER DISPERSION

Epoxy resin composition with reduced toxicity

Monofunctional, bifunctional, and multifunctional phosphinated phenols and their derivatives and preparation method thereof

MOLDING MATERIAL HAVING VIBRATION-DAMPING PROPERTY AND MOLDED ARTICLE

Compositions having phosphorus-containing compounds

Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same

Aluminum phosphorus acid salts as epoxy resin cure inhibitors

PRINTING FORM AND PROCESS FOR PREPARING THE PRINTING FORM WITH CURABLE COMPOSITION HAVING EPOXY NOVOLAC RESIN

Halogen free, flame retardant compositions for wire and cable applications

Thermoplastic Polymer Blends Comprising Crosslinked Polar Olefin Polymers in a Thermoplastic Polyurethane Matrix

Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers

Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers