103764 ⎘
Adhesives based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain ; Adhesives based on derivatives of such polymers
Sub-classes:HOT MELT ADHESIVE COMPOSITION
#2CURABLE RESIN COMPOSITION
#3OLEFINIC COMPOSITIONS COMPRISING HYDROCARBON RESINS
#4COMPOUND, METHOD FOR PRODUCING COMPOUND, ADHESIVE COMPOSITION AND ADHESIVE TAPE
#5Michael-addition-hardening synthetic resin for chemical fixing technology
#6CO-EXTRUDED RUBBER-BASED MULTILAYER ADHESIVE ASSEMBLY
#7Polarizing plate, polarizing plate adhesive composition for same, and optical display apparatus comprising same
#8TEMPORARY BONDING OF SUBSTRATES WITH LARGE ROUGHNESS USING MULTILAYERS OF POLYELECTROLYTES
#9LIQUID HYDROCARBON COPOLYMERS COMPRISING TWO ALKOXYSILANE END GROUPS, AND PRODUCTION METHOD THEREOF
#10Stabilization of hot melt adhesives
#11Package structure and method of manufacturing the same
#12Polyarylether ketone imide adhesives
#13HYDROCARBON-BASED POLYMERS BEARING TWO ALKOXYSILANE END GROUPS
#14Polybenzoxazine that can be used for coating metal and for the bonding of same to rubber
#15NEW HYDROCARBON POLYMERS WITH EXO-VINYLENE CYCLOCARBONATE END GROUPS
#16Methods for sealing microcell containers with phenethylamine mixtures
#17Polyarylether ketone imide sulfone adhesives
#18Hot melt adhesive composition
#19Polyarylether ketone imide adhesives
#20Polymerizable sulfonamide compounds and polymers thereof
#21Adhesives comprising polyindane resins
#22Stabilization of hot melt adhesives
#23Composition for bonding windings or core laminates in an electrical machine, and associated method
#24Membrane surface activation to eliminate fouling and concentration polarization in water purification systems
#25Hydrocarbon-based polymers bearing dithiocyclocarbonate end groups
#26HYDROCARBONATED POLYMERS WITH TWO ALCOXYSILANE END GROUPS
#27HYDROCARBON-CONTAINING POLYMERS WITH TWO ALKOXYSILANE END GROUPS
#28Photocurable composition and anthracene derivative used with the same
#29Methods of forming structures for downhole applications
#30Polyarylether ketone imide sulfone adhesives
#31Surface protective film, making method, and substrate processing laminate
#32Wafer laminate and making method
#33Methods for sealing microcell containers with phenethylamine mixtures
#34Hot-melt adhesive composition for elastic attachments
#35Stack, method for treating substrate material, temporary fixing composition, and semiconductor device
#36Resin material and resin film
#37Metathesis-active adhesion agents and methods for enhancing polymer adhesion to surfaces
#38Hydrocarbon-based polymers bearing two alkoxysilane end groups
#39Hot melt adhesive
#40PRESSURE SENSITIVE ADHESIVE AND IMAGE DISPLAY DEVICE USING THE SAME
#41Polymerizable composition, cycloolefin-based polymer, cycloolefin-based resin molded body, and laminate
#42Curable composition for electrical machine, and associated method
#43Composition for bonding windings or core laminates in an electrical machine, and associated method
#44Adhesive body comprising conductive polymer-metal complex and substrate and method for forming the same, conductive polymer-metal complex dispersion liquid, method for manufacturing the same and method for applying the same, and method for filling hole using conductive material
#45Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material
#46Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
#47Light emitting composition and device
#48Ultraviolet cured optic binder
#49Reactive two-component hotmelt adhesive composition
#50Functionalized resins obtained via olefin metathesis
#51Conductive adhesive composition, electronic device, positive electrode laminate, and method for manufacturing electronic device
#52ADHESIVE AGENT, ADHESION METHOD AND MANUFACTURING METHOD OF ADHERED MATERIAL
#53METHODS OF BONDING ARTICLES TOGETHER AND THE ARTICLES FORMED THEREBY
#54Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
#55CROSS-LINKING FILM ADHESIVES
#56Polymerizable Composition, Thermoplastic Resin Composition, Crosslinked Resin, And Crosslinked Resin Composite Materials
#57Encapsulated Michael addition catalyst
#58Crosslinkable resin composition and resin formed body produced therefrom
#59Surface promoted Michael cure compositions
#60Biomass based Michael addition compositions
#61Electroconductive adhesive and adhesive article using the same
#62Electrostatically-assisted two-step conductive polymer applique (CPA) paint removal process
#63Electrostatically-assisted two-step conductive polymer applique (CPA) paint removal process