C09J165/02 - CPC Classification Index

ClassID:

103765 ⎘

C09J165/02 - CPC Classification

Classification description:

Adhesives based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain ; Adhesives based on derivatives of such polymers Polyphenylenes

Recent Application in this class:

20230227702

2023-07-20

Methods for enhancing the bonding strength of thermoset adhesives and sealants via disulfide dynamic chemistry

20210009872

2021-01-14

METHODS FOR ENHANCING THE BONDING STRENGTH OF THERMOSET ADHESIVES AND SEALANTS VIA DISULFIDE DYNAMIC CHEMISTRY

20180334598

2018-11-22

Polyarylether ketone imide sulfone adhesives

20170260432

2017-09-14

Polyarylether ketone imide sulfone adhesives

20160108295

2016-04-21

Low surface energy adhesive

20160083626

2016-03-24

SOFT MAGNETIC THERMOSETTING ADHESIVE FILM, MAGNETIC FILM LAMINATE CIRCUIT BOARD, AND POSITION DETECTION DEVICE

20160075182

2016-03-17

TIRE

20160040017

2016-02-11

Composite optical reflective film and preparation method therefor

20150270188

2015-09-24

Under-fill material and method for producing semiconductor device

#10

20150140343

2015-05-21

ADHESIVE, AND TRANSPARENT SUBSTRATE USING SAME

#11

20140378019

2014-12-25

UV-CROSSLINKABLE, RESIN-MODIFIED ADHESIVE

#12

20130209822

2013-08-15

Process for the acetylation of wood elements

#13

20110104486

2011-05-05

LOW SURFACE ENERGY ADHESIVE

#14

20050276972

2005-12-15

Electroconductive adhesive and adhesive article using the same