103804 ⎘
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
Sub-classes:Electroadhesive Polymers and Clutch Using the Johnsen-Rahbek Effect
#2CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE
#3Highly soluble tris-(2,3-epoxypropyl)-isocyanurate and method for producing same
#4SYNTHESIS, PURIFICATION, AND PROPERTIES OF RING-OPENED BENZOXAZINE THERMOPLASTIC
#5ELECTROCHEMICALLY DEBONDABLE ADHESIVE COMPOSITION
#6SYNTHESIS AND USE OF MULTI-FUNCTIONAL DIAZIRINE ADHESIVES FOR ELASTOMER BONDING
#7AMINE TERMINATED PREPOLYMER AND COMPOSITION COMPRISING THE SAME
#8AMINE TERMINATED PREPOLYMER AND COMPOSITION COMPRISING THE SAME
#9SILYL TERMINATED PREPOLYMER AND COMPOSITION COMPRISING THE SAME
#10SILYL TERMINATED PREPOLYMER AND COMPOSITION COMPRISING THE SAME
#11Highly flame-retardant adhesive for high polymer materials
#12Sulfurized benzoxazine for use in the synthesis of a polybenzoxazine
#13Enhanced adhesive materials and processes for 3D applications
#14POLYAMIDES BASED ON AMINOALKYLPIPERAZINE OR AMINOARYLPIPERAZINE FOR HOT-MELT ADHESIVES
#15High performance adhesives; methods of making; and use
#16Polybenzoxazine that can be used for coating metal and for the bonding of same to rubber
#17Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layer
#18THERMOSET 3-OXO-ISOINDOLINE DIPHTHALONITRILE POLYMERS, METHOD OF MANUFACTURE, AND USES THEREOF
#19Semiconductor-bonding resin composition, semiconductor-bonding sheet, and semiconductor device using semiconductor-bonding sheet
#20Highly soluble tris-(2, 3-epoxypropyl)-isocyanurate and method for producing same
#21Photosensitive adhesive composition
#22USE OF NICKEL AND NICKEL-CONTAINING ALLOYS AS CONDUCTIVE FILLERS IN ADHESIVE FORMULATIONS
#23Enhanced adhesive materials and processes for 3D applications
#24Polyester/primer/metal composite film that is cohesive and impermeable to gas, method for the production thereof and the primer utilized in said method
#25Solvent-free light-curable adhesive composition
#26BISMALEIMIDE RESINS FOR ONE DROP FILL SEALANT APPLICATION
#27Cyanate ester compound, curable resin composition containing the compound, and hardened product thereof
#28Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device
#29Adhesive film and process for producing the same
#30Resin composition and electronic component
#31Enhanced adhesive materials and processes for 3D applications
#32Polyamides based on aminoalkylpiperazine or aminoarylpiperazine for hot-melt adhesives
#33Thermosetting resin composition
#34Polymer and composition including same, and adhesive composition
#35Cyanate ester compound, curable resin composition containing said compound, and cured product of said composition
#36Primer compositions for injection molding
#37Method for manufacturing composite body and composition
#38Process for preparing poly(benzoxazines)
#39Benzoxazine Curable Composition Containing Polysulfone-Based Tougheners
#40Latent thickeners, rheology control kit and multi-component systems
#41HIGHLY SOLUBLE TRIS- (2, 3-EPOXYPROPYL)- ISOCYANURATE AND METHOD FOR PRODUCING SAME
#42Polymerizable composition including a benzoxazine and an acid-forming peroxide catalyst, article, and method
#43WOOD ADHESIVE, METHOD FOR ADHERING WOOD MATERIALS USING THE SAME, AND COMPOSITE WOOD STRUCTURE USING THE SAME
#44Polybenzoxazine composition
#45ADHESIVE COMPOSITION OR UNDERFILL COMPOSITION
#46Flame-retardant benzoxazine-containing composition
#47Low radio frequency loss, static dissipative adhesives
#48Curable composite manufacturing adhesive
#49SEALING RESIN, SEMICONDUCTOR DEVICE, AND PHOTOCOUPLER
#50Anticorrosion coatings
#51Cyanate ester compound and method for producing the same, and curable resin composition comprising the compound, and cured product thereof composition
#52Amine/thiol curing of benzoxazines
#53Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive
#54Hybrid adhesive and the use thereof in engineered wood boards
#55Curable resin composition and cured product thereof
#56Anticorrosion coatings
#57Benzoxazine-thiol adducts
#58Solventless one liquid type cyanate ester-epdxy composite resin composition
#59ADHESIVE FILM LAYER FOR PRINTED CIRCUIT BOARD APPLICATIONS
#60INPUT DEVICE
#61Ionic liquid epoxy resin monomers
#62INPUT DEVICE
#63Benzoxazine-thiol adducts
#64Low radio frequency loss, static dissipative adhesives
#651,3-DIPOLAR CYCLOADDITION OF AZIDES TO ALKYNES
#66Ionic liquid epoxy resins
#67RESIN COMPOSITION EXCELLENT IN HEAT RESISTANCE AND ADHESIVENESS, AND METHOD FOR PRODUCING SAME
#68Polymeric materials via click chemistry
#69Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
#70Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
#71Composite adhesive