POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME

PROCESSABLE POLYIMIDE-PHTHALONITRILE APPLICATION FORMS AND METHODS THEREOF

POLYIMIDE RESIN, POLYIMIDE VARNISH, POLYIMIDE FILM, AND TEMPORARY FIXING MATERIAL COMPOSITION

THERMALLY STABLE MONOMERS AND METHODS OF USE THEREOF

ADHESIVE COMPOSITION

ADHESIVE AND MULTILAYER STRUCTURE

HIGH TEMPERATURE STABLE CURABLE BONDING COMPOSITIONS

ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE

DOUBLE-SIDED ADHESIVE

Multifunctional Adhesion Promoter for Semiconductor Device Packages

PROTECTIVE MASKING TAPE FOR CIRCUIT BOARD TABS

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION

POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE

HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS

RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELECTROSTATIC CHUCK, AND PLASMA PROCESSING EQUIPMENT

ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING MULTILAYERED WIRING BOARD, AND MULTILAYERED WIRING BOARD

RESIN COMPOSITION, POLYIMIDE PREPARATION METHOD AND RELATED PRODUCTS

HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED RESIN FILM, PREPREG, SUBSTRATE, ADHESIVE AND SEMICONDUCTOR ENCAPSULATION MATERIAL USING SAME

POLYAMIC ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMINATE

POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE, AND LAMINATE

THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE

APPLICATION OF LASER-RELEASABLE COMPOSITION

CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, ADHESIVE, ADHESIVE FILM, PREPREG, INTERLAYER INSULATING MATERIAL, AND PRINTED-WIRING BOARD

Fluorinated poly(imide-phthalonitrile) adhesive formulations and related methods

PROVISIONAL FIXATION MATERIAL AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

Method for producing cured product of heat-curable maleimide resin composition

CURABLE RESIN COMPOSITION, TEMPORARY FIXING MATERIAL, AND ELECTRONIC COMPONENT MANUFACTURING METHOD

TEMPORARY ADHESION METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE FOR TEMPORARY ADHESION, AND LAMINATE FOR DEVICE WAFER PROCESSING

CYCLIC IMIDE RESIN COMPOSITION, LIQUID ADHESIVE, FILM, PREPREG, COPPER-CLAD LAMINATE AND PRINTED-WIRING BOARD

Poly(etherimide-phthalonitrile) adhesives and related methods

MULTILAYER STRUCTURE FOR TRANSPORTING OR STORING HYDROGEN

AMIDE COMPOUND, NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AND CROSSLINKED PRODUCT

REACTIVE POLYAMIDEIMIDE OLIGOMERS, METHODS, AND ARTICLES

Fluoropolymer adhesives and methods thereof

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING, LEAD FRAME WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATION MOLDED BODY WITH TEMPORARY PROTECTIVE FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Insulated wire and preparation method thereof, coil and electronic/electrical device

ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD (FPC), AND HEAT-CURABLE RESIN FILM, PREPREG AND FPC SUBSTRATE CONTAINING SAME

Heat-curable citraconimide resin composition

Polyimide resin composition, polyimide resin adhesive layer, laminate, and manufacturing method of electronic component

ONE-PART ADHESIVE FOR THERMOPLASTIC URETHANES

PHENOLIC FUNCTIONALIZED POLYIMIDES AND COMPOSITIONS THEREOF

Heat-curable maleimide resin composition

ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PROCESSING ELECTRONIC COMPONENT

RESIN SHEET

HEATER FOR CIGA-LIKE ELECTRONIC CIGARETTE WITH EXCELLENT HEAT TRANSFER EFFICIENCY AND MANUFACTURING METHOD THEREOF

Thick polyimide film having improved surface quality and method of manufacturing same

Composite encapsulating material and photovoltaic module including the same

Manufacturing method of wavelength-converting component

Metal particle-containing composition and electrically conductive adhesive film

Adhesive composition and semiconductor device production method

Thermosetting polyimide resin and manufacturing method thereof, composition, prepolymer, film, adhesive, and use thereof

Resin composition, resin layer, permanent adhesive, adhesive for temporary bonding, laminated film, processed wafer, and method for manufacturing electronic component or semiconductor device

Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board

Polyimides for temporary bonding adhesives, methods for manufacturing of thermoplastic polyimide materials, and methods for thin wafer bonding using the same

Temporary bonding composition, temporary bonding film, composite film, temporary bonding method and semiconductor wafer package

Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board

Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same

Interior member for aircraft, manufacturing method of the same, and replacement method of the same

Fluoropolymer adhesives and methods thereof

Enhanced adhesive materials and processes for 3D applications

Composition for forming a coating film for removing foreign matters

CASE, PREPARATION METHOD THEREOF AND ELECTRONIC PRODUCT

METHOD OF PRODUCING JOINED BODY, COMPOSITION FOR TRANSIENT LIQUID PHASE SINTERING, SINTERED BODY, AND JOINED BODY

COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PRODUCING JOINED BODY

COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PRODUCING JOINED BODY

Polyarylether ketone imide adhesives

Wavelength-converting component, projection apparatus and manufacturing method of the wavelength-converting component

Method for temporary bonding workpiece and adhesive

Fiber optic connector sub-assemblies and fiber optic connectors including the same

Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion

A-staged thermoplastic-polyimide (TPI) adhesive compound containing flat inorganic particle fillers and method of use

Materials for use as adhesive and for surface sealing

Electrically conductive adhesive film and dicing-die bonding film using the same

Electrically conductive adhesive film and dicing-die bonding film using the same

Adhesive composition using polyamide-imide resin

DEBONDABLE ADHESIVES AND THE HIGH TEMPERATURE USE THEREOF

A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use

Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same

Adhesive systems for preparing composites of rubber and polar thermosets

Enhanced adhesive materials and processes for 3D applications

Polyarylether ketone imide adhesives

MIXED BINDERS

LAMINATE FILM FOR TEMPORARY BONDING, METHODS FOR PRODUCING SUBSTRATE WORKPIECE AND LAMINATE SUBSTRATE WORKPIECE USING THE LAMINATE FILM FOR TEMPORARY BONDING, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME

Methods of making fiber optic connector sub-assemblies

METHODS OF MAKING FIBER OPTIC CONNECTOR SUB-ASSEMBLIES

Process of making polyimide micronized particles, particles formed therefrom, and articles prepared therefrom

Film and flexible metal-clad laminate

Adhesive composition with high frequency characteristics and application thereof

Electrically conductive composition

Surface mounting using partially cured B staged and fully cured C staged thermoplastic polyimide TPI adhesive compounds

Polyarylether ketone imide adhesives

Multi-layer film adhesive

Resin composition and electronic component

ELECTRODE BINDER, CATHODE ELECTRODE MATERIAL AND LITHIUM ION BATTERY

Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition

Enhanced adhesive materials and processes for 3D applications

MALEIMIDE FILM

Robust interface bonding with B-staged thermoplastic polyimide adhesive

Poly(imide-amide) copolymer, a method for preparing a poly(imide-amide) copolymer, and an article including a poly(imide-amide) copolymer

ULTRA-THIN POLYIMIDE FILM, AND MANUFACTURE AND ASSEMBLY THEREOF

Fiber optic connector sub-assemblies and related methods

PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

ADHESIVE COMPOSITION USING POLYAMIDE-IMIDE RESIN

Polyimide resin, resin composition using same, and laminated film

CURABLE RESIN COMPOSITION FOR SEALING LIQUID CRYSTAL

Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same

A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use

Semiconductor resin composition, semiconductor resin film, and semiconductor device using the same

Adhesive film and flexible metal laminate

Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board

POLYIMIDE RESIN COMPOSITION, AND HEAT-CONDUCTIVE ADHESIVE FILM PRODUCED USING SAME

Method for producing film and flexible metal-clad laminate

Polyimide resin composition, and (polyimide resin)-fiber composite material

Polyimide resin

Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device

Solvent soluble polyimide copolymer

Method for producing polyimide resin powder, and thermoplastic polyimide resin powder

Polyimide copolymer oligomer, polyimide copolymer, and method for producing each of same

Composition for preparing polyimide-inorganic particle composite, article prepared therefrom, and optical device comprising same

Poly(amide-imide) block copolymer, article including same, and display device including the article

Photosensitive polyimide composition, base agent thereof, method of making the base agent, and solder-resistant polyimide thin film made from the composition

Composition for preparing polyimide-inorganic composite material, and article prepared by using same

Polyetherimides, methods of manufacture, and articles formed therefrom

Adhesive composition and adhesive sheet, and hardened article and semiconductor device using same

Adhesive agent having a polyimide and acid modified rosin

Polyimide composition

Resin composition, cured film, laminated film, and method for manufacturing semiconductor device

Polyimide precursor composition, method of producing polyimide precursor composition, method of producing polyimide molded article, polyimide molded article, liquid crystal alignment film, passivation film, wire coating material, and adhesive film

Structural polyurethane adhesive

Robust interface bonding with B-staged thermoplastic polyimide adhesive

Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release

POLYIMIDE RESIN, RESIN COMPOSITION AND LAMINATED FILM THAT USE SAME

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

Amide-extended crosslinking compounds and methods for use thereof

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND INTERLAMINAR ADHESIVE FILM USED FOR PRINTED WIRING BOARD

Production method for polyamide acid particles, production method for polyimide particles, polyimide particles and bonding material for electronic component

POLYIMIDE RESIN COMPOSITION AND LAMINATE INCLUDING POLYIMIDE RESIN COMPOSITION

ADHESIVE COMPOSITION, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE ADHESIVE COMPOSITION OR THE ADHESIVE SHEET

Resin composition and semiconductor device produced by using the same

Polyetherimides, methods of manufacture, and articles formed therefrom

Polyimide film

Adhesive agent, adhesive material using the same, and method of use thereof

Adhesive agent, adhesive material using the same, and method of use thereof

Adhesive agent, adhesive material using the same, and method of use thereof

Poly(amide-imide) block copolymer, article including same, and display device including the article

Method of producing semiconductor device with patterned photosensitive adhesive

Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device

MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CURED MULTILAYER RESIN SHEET, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING THE SAME

Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate

Polyamideimide adhesives for printed circuit boards

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE SAME

Thermosetting resin composition and cured product of the same

PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PHOTOSENSITIVE ADHESIVE, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE, WHICH ARE MADE USING SAME

ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE BOTH PRODUCED USING THESE, AND PROCESSES FOR PRODUCING THESE

LINEAR POLYIMIDE PRECURSOR, LINEAR POLYIMIDE AND HEAT-CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING THEM

Resin composition and semiconductor device produced by using the same

THERMOSETTING POLYIMIDE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE

THERMOSETTING ADHESIVE TAPE OR SHEET

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

Two-stage cure polyimide oligomers

METHOD OF MOUNTING ELECTRICAL CONDUCTORS ON A PLASTIC PART

DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME

Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT

Amide-extended crosslinking compounds and methods for use thereof

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION

Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition

PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

Photosensitive adhesive

Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device

HIGHLY ADHESIVE POLYIMIDE COPPER CLAD LAMINATE AND METHOD OF MAKING THE SAME

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto

PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, METHOD FOR FORMING ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER

Adhesive composition and adhesive film using the same

Film-like adhesive, adhesive sheet, and semiconductor device using same

Copper foil with primer resin layer and laminated sheet using the same

Structural adhesives containing maleimide terminated polyimides

Primer resin for semiconductor device and semiconductor device

Conductive paste as well as conductive coating and conductive film prepared from same

Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board

ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME

Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste

ASYMMETRIC LINEAR POLYIMIDES AND THEIR POLYIMIDE PRECURSORS, AND THEIR MANUFACTURING METHODS

PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them

Semiconductor electronic component and semiconductor device using the same

FILM AND FLEXIBLE METAL-CLAD LAMINATE

Adhesive tape and semiconductor device using the same

Flame-retardant adhesive resin composition and adhesive film using the same

RESIN COMPOSITION, RESIN FILM, COVER LAY FILM, INTERLAYER ADHESIVE, METAL-CLAD LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD

Novel polyimide film with improved adhesiveness

Multi-layer film adhesive

Thermocurable Polyimide Resin Composition

Polyimide resin

Adhesive film

Polyimide resin

Enamel varnish composition for enamel wire and enamel wire using same

Polyimide film and adhesive film and flexible metal-clad laminate both obtained with the same

HIGHLY ADHESIVE POLYIMIDE COPPER CLAD LAMINATE AND METHOD OF MAKING THE SAME

Heat-resistant adhesive sheet

Polyamide acid containing ultrafine metal particle

Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device

Process for producing multilayer polymide film

Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device

Low temperature bonding electronic adhesives

Partially rigid flexible circuits and method of making same

Polyimide resin, polyimide film, and polyimide laminate

Adhesive Film

RESIN COMPOSITION EXCELLENT IN HEAT RESISTANCE AND ADHESIVENESS, AND METHOD FOR PRODUCING SAME

Solution, component for plating, insulating sheet, laminate, and printed circuit board

Adhesive film and use thereof

Water-entrained-polyimide chemical compositions for use in high-performance composite fabrication

POLYIMIDE FILM WITH IMPROVED ADHESION, PROCESS FOR ITS FABRICATION AND LAMINATED BODY

Reactive Hot Melt Adhesive

High Temperature Heat Resistant Adhesive Tape, with Low Electrostatic Generation, Made with a Polyetherimide Polymer

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Adhesive Film and Method for Manufacturing Semiconductor Device Using Same

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

Polyamideimide compositions having multifunctional core structures

Polyimide Multilayer Adhesive Film And Method For Producing The Same

VACUUM ENVELOPE FOR IMAGE DISPLAY DEVICE AND SEALANT FOR IMAGE DISPLAY DEVICE

Novel Polyimide Film With Improved Adhesiveness

Adhesive film, flexible metal-clad laminate including the same with improved dimensional stability, and production method therefor

Anisotropic conductive adhesives

Metal-clad white laminate

Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto

Resin Paste for Die Bonding

Adhesive film, flexible metal-clad laminate, and processes for producing these

Resin composition and semiconductor device produced by using the same

Polyimide film having high adhesiveness and method for producing same

Process for producing adhesive film

Polymerizable compositions in non-flowable forms

Adhesive composition and sheet having an adhesive layer of the composition

Thermosetting resin composition containing modified polyimide resin

Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same

Novel polymer compound, precursor for the same and thin film-forming method using the same polymer precursor

Novel polymer compound, precursor for the same and thin film-forming method using the same polymer precursor

Two-stage cure polyimide oligomers

Polyimide film with improved adhesion, process for its fabrication and laminated body

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Film adhesive and semiconductor package using the same

Vacuum envelope for image display device and sealant for image display device

Polymer compound, precursor for the same and thin film-forming method using the same polymer precursor

Polyamideimide compositions having multifunctional core structures

Flexible metal foil-polyimide laminate and making method

Sensor device

Adhesive resin and film adhesive made by using the same

Polymerizable compositions in non-flowable forms

Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto

Adhesive composition and adhesive film

Methods of disassembling apparel products having imine adhesives

Reversible thermoset adhesives