ClassID:

104081

C09J2463/006 - CPC Classification

Classification description:

Presence of epoxy resin in the substrate

Recent Application in this class:
#1
20240294809
2024-09-05

LIGHTWEIGHT RF SHIELDING CONDUCTIVE ELASTOMERIC TAPE

#2
20240182752
2024-06-06

THERMOSETTING ADHESIVE FILMS

#3
20230392045
2023-12-07

Thermosetting adhesive films

#4
20230039482
2023-02-09

SUBSTRATE-CONVEYING SUPPORT TAPE AND ELECTRONIC APPARATUS/DEVICE PRODUCTION METHOD

#5
20230036300
2023-02-02

Adhesive film

#6
20220325163
2022-10-13

COMPOSITION, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE SHEET

#7
20220098401
2022-03-31

Polymer composition

#8
20220073793
2022-03-10

Adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite body

#9
20210301180
2021-09-30

COMPOSITION, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER

#10
20210212197
2021-07-08

Adhesive film for printed wiring board

#11
20210016319
2021-01-21

Composite coatings having improved UV and paint stripping resistivity and methods for making same

#12
20200198313
2020-06-25

Surface treatment to enhance bonding of composite materials

#13
20200172764
2020-06-04

Preparation method for composite material

#14
20200140722
2020-05-07

CURABLE COMPOSITIONS

#15
20200079977
2020-03-12

THERMOSETTING ADHESIVE FILMS

#16
20200010739
2020-01-09

Lightweight RF shielding conductive elastomeric tape

#17
20190276711
2019-09-12

Multilayer adhesive article

#18
20190225839
2019-07-25

Method for producing a single-sided adhesive film and single-sided adhesive film

#19
20190153268
2019-05-23

Method for producing a single-sided adhesive film for securing a load and single-sided adhesive film for securing a load

#20
20190062612
2019-02-28

Urethane acrylate hybrid structure adhesives

#21
20180230338
2018-08-16

Adhesive printable films

#22
20180208801
2018-07-26

Electrostatic dissipative surface coating and high temperature label employing same

#23
20180117876
2018-05-03

Supporting frame and display device including the same

#24
20180001572
2018-01-04

Bonding of composite materials

#25
20170349789
2017-12-07

Sheet adhesive and adhesion process using the same

#26
20170323820
2017-11-09

Surface protective sheet

#27
20170275506
2017-09-28

Adhesive composition for electrochemical device, adhesive layer for electrochemical device, and electrochemical device

#28
20170166783
2017-06-15

Coating sheet for preventing adhesion of advertising material

#29
20160160092
2016-06-09

Thermosetting adhesive films including a fibrous carrier

#30
20160160087
2016-06-09

Relating to thermosetting adhesive films

#31
20160137892
2016-05-19

Hydrophobic polyurethane adhesive

#32
20160121591
2016-05-05

Bonding of composite materials

#33
20140319497
2014-10-30

Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same

#34
20140290829
2014-10-02

Swelling tape for filling gap

#35
20140248488
2014-09-04

4-methyl-1-pentene polymer, resin composition containing 4-methyl-1-pentene polymer, masterbatch thereof, and formed product thereof

#36
20140124135
2014-05-08

Method for pretreating molded articles made of plastic matrix-fiber composites

#37
20140106207
2014-04-17

Swelling tape for filling gap

#38
20130306221
2013-11-21

Swelling tape for filling gap

#39
20130305526
2013-11-21

Tape

#40
20130299064
2013-11-14

Swelling tape for filling gap

#41
20130280570
2013-10-24

Electrode assembly

#42
20130078452
2013-03-28

QUICK DRYING SEMI-SOLID GLUES

#43
20130034729
2013-02-07

Base material film for dicing sheet and dicing sheet

#44
20120244351
2012-09-27

MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CURED MULTILAYER RESIN SHEET, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING THE SAME

#45
20120202036
2012-08-09

Wafer processing base

#46
20120168074
2012-07-05

Sheet for forming hard coating

#47
20110311783
2011-12-22

Multilayer adhesive for thermal reversible joining of substrates

#48
20110256396
2011-10-20

METHOD OF MINIMIZING RESIDUE ADHESION FOR THERMO-REVERSIBLE DRY ADHESIVES

#49
20110165416
2011-07-07

4-methyl-1-pentene polymer, resin composition containing 4-methyl-1-pentene polymer, masterbatch thereof, and formed product thereof

#50
20110053346
2011-03-03

DICING/DIE BONDING FILM

#51
20100147451
2010-06-17

USE OF SILANES AS ADHESION PROMOTERS BETWEEN TWO ORGANIC SURFACES

#52
20090280330
2009-11-12

Shape memory polymer and adhesive combination and methods of making and using the same

#53
20090133823
2009-05-28

Method for improving mechanical strength of bondings made with an adhesive based on curable resin by chain polymerization

#54
20090090461
2009-04-09

Method of minimizing residue adhesion for thermo-reversible dry adhesives

#55
20080292848
2008-11-27

Multilayer adhesive for thermal reversible joining of substrates