104077 ⎘
Presence of epoxy resin
Sub-classes:ANISOTROPIC CONDUCTIVE BONDING MATERIAL AND BONDED STRUCTURE USING THE SAME
#2EXPANDED CURE WINDOW CRASH DURABLE EPOXY ADHESIVES
#3STRUCTURE, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING STRUCTURE
#4THERMALLY CONDUCTIVE DIE ATTACH FILM
#5EDGE SEALED SLOT LINER
#6BONDING SHEET
#7BONDING A TERAHERTZ IMAGER TO A LENS TO PROVIDE AN OPTIMAL INTERFACE
#8EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE
#9BONDED STRUCTURE
#10ADHESIVE SHEET, ADHESIVE AGENT COMPOSITION, AND STRUCTURE
#11ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
#12APPLYING STRUCTURAL ADHESIVE
#13ROOFING ADHESIVE SYSTEMS AND METHODS
#14EPOXY-BASED STRUCTURAL ADHESIVE CAPABLE OF CURING AT ROOM TEMPERATURE AND RAPID BONDING AND PREPARATION METHOD THEREFOR
#15CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, CURABLE PRESSURE-SENSITIVE ADHESIVE TAPE, AND BATTERY PACK
#16COMPOSITE STRUCTURAL ADHESIVE COMPOSITIONS AND RELATED METHODS
#17FILM ADHESIVE, DICING AND DIE-BONDING INTEGRAL FILM, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME
#18LAYER-ADDING ADHESIVE FILM CONTAINING MODIFIED BENZOCYCLOBUTENE FOR FC-BGA PACKAGE CARRIER, PREPARATION METHOD, AND APPLICATION THEREOF
#19LAMINATED FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#20SOLID POLYMERIC ADHESIVE COMPOSITIONS HAVING HIGH USE TEMPERATURE, AND ARTICLES AND METHODS THEREOF
#21CURABLE ADHESIVE AND ARTICLES FOR BONDING PAVEMENT AND CONCRETE
#22VEHICULAR CAMERA WITH ADHESIVELY BONDED CONSTRUCTION
#23HOT MELT ADHESIVE SHEET
#24ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#25ADHESIVE COMPOSITION
#26Method of underwater bonding
#27THERMALLY-CONDUCTIVE ELECTRICAL CONDUCTING LAYER
#28COMPOSITE MATERIAL, METHOD OF PRODUCTION AND METHOD FOR THE ENERGY-EFFICIENT SEPARATION OF THE COMPOSITE
#29FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING/DIE BONDING FILM, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
#30EPOXY RESIN COMPOSITIONS COMPRISING DICYANDIAMID CURING AGENT
#31BONDED BODY, MANUFACTURING METHOD OF BONDED BODY, IMAGING MODULE, ELECTRONIC DEVICE, AND RESIN COMPOSITION
#32CATIONICALLY POLYMERIZABLE FLAME RETARDANT COMPOSITIONS
#33Silver Pastes Used for Manufacturing a Printed Antenna
#34FAST CURABLE CRASH RESISTANT ADHESIVE COMPOSITION
#35FILLER-CONTAINING FILM
#36ADHESIVE COMPOSITION AND PREPARATION METHOD THEREOF, AND OPTICAL ADHESIVE FILM AND APPLICATION THEREOF
#37MULTIFUNCTION ADHESIVE PRODUCT FOR UBIQUITOUS REALTIME TRACKING
#38ANAEROBIC CURING ADHESIVE COMPOSITION, BONDED LAMINATED BODY, AND MOTOR
#39ADHESIVE FOR MEDICAL DEVICE, CURED SUBSTANCE, MEDICAL DEVICE MEMBER, MEDICAL DEVICE, AND MANUFACTURING METHOD OF MEDICAL DEVICE
#40MICROCAPSULE-TYPE CURABLE RESIN COMPOSITION
#41NOVEL POLYMER, RESIN COMPOSITION INCLUDING SAME, AND MOLDED BODY THEREOF
#42RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELECTROSTATIC CHUCK, AND PLASMA PROCESSING EQUIPMENT
#43CHEMICAL-RESISTANT REACTIVE PRESSURE-SENSITIVE ADHESIVE TAPE
#44RAPID CURING EPOXY REPAIR COMPOSITION AND USE THEREOF
#45STRUCTURAL ADHESIVE COMPOSITIONS
#46LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD
#47CURABLE, ONE-PART, DUAL-STAGE THIOL-ENE-EPOXY LIQUID ADHESIVES AND METHODS
#48Methods and Systems for Attaching Detectors to Electronic Readout Substrates
#49EPOXY RESIN COMPOSITION
#50EXPANDABLE ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION
#51Vegetable oil-derived epoxy compositions having improved performance
#52ADHESIVE SHEET AND METHOD FOR MANUFACTURING SAME, ARTICLE, AND METHOD FOR MANUFACTURING ARTICLE
#53METHOD FOR PRODUCING BONDED BODY
#54STRUCTURAL ADHESIVES AND PREPARATION METHODS THEREOF
#55OPTICAL UNIT AND METHOD FOR MANUFACTURING THE SAME
#56RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RESIN SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
#57RESIN COMPOSITION AND APPLICATION THEREOF
#58BONDING SHEET AND METHOD FOR PRODUCING SAME
#59ACCELERATOR FOR EPOXY RESINS
#60REACTIVE ADHESIVE TAPE THAT CAN BE STAMPED
#61HIERARCHICAL COMBINATION OF DISTRIBUTED STATISTICS IN A MONITORING NETWORK
#62Epoxy based reinforcing patches having improved damping loss factor
#63THERMOSETTING RESIN COMPOSITION AND INSULATING ADHESIVE FILM THEREOF
#64SEAM TAPE, COMPONENT MATERIAL, AND ACCESSORY MATERIAL WITH EPOXY ADHESIVE FOR INFLATABLE SAFETY PRODUCTS
#65ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION FOR BONDING SOLAR CELLS
#66Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
#67THERMOSETTING ADHESIVE FILMS
#68TWO-COMPONENT CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
#69REINFORCEMENT MATERIAL AND REINFORCEMENT STRUCTURE
#70ADHESIVE COMPOSITION AND FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USING FILM ADHESIVE AND PRODUCING METHOD THEREOF
#71Seal Coated Devices
#72Hierarchical combination of distributed statistics in a monitoring network
#73Adhesive tape and method for jacketing elongated items, especially leads
#74METHODS OF BONDING METAL ARTICLES AND ARTICLES FORMED THEREBY
#75Visible-Laser-Curable or Infrared-Laser-Curable Cationically Polymerizable Epoxy Resin Composition
#76ADHESIVE COMPOSITION, FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USING FILM ADHESIVE AND PRODUCING METHOD THEREOF
#77COMPOSITION
#78Colloidal lignin-epoxy formulations
#79HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR PRE-CURING PROCESSES WITHOUT ADDITIONAL METAL JOINING TECHNIQUES
#80EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE
#81ADHESION PROMOTERS AND COMPOSITIONS FOR CONTAINERS AND OTHER ARTICLES
#82POLYMERIZING COMPOSITION, METHOD OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME
#83ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION AT HIGH TEMPERATURES
#84Corona Shielding Strip for a High-Voltage Rotating Electrical Machine
#85BONDING METHOD
#86ADHESIVE SHEET
#87A DIAMOND ASSEMBLY
#88Wireless sensor networks installation, deployment, maintenance, and operation
#89EPOXY RESIN ADHESIVE FOR MEDICAL DEVICE AND CURED PRODUCT OF THE SAME, AND MEDICAL DEVICE MEMBER AND MEDICAL DEVICE
#90VULCANIZED RUBBER SURFACE TREATMENT AGENT, METHOD OF PRODUCING ADHESIVE STRUCTURE, ADHESIVE STRUCTURE, AND TIRE
#91Thermosetting adhesive films
#92CRASH DURABLE, STRESS DURABLE AND WELDABLE EPOXY ADHESIVES
#93UV-CURABLE SEMI-STRUCTURAL ADHESIVE, AND UV-CURABLE SEMI-STRUCTURAL ADHESIVE TAPE
#94LOW STRESS LOCA ADDITIVE AND LOCA PROCESSING FOR BONDING OPTICAL SUBSTRATES
#95Epoxy based reinforcing patches having improved damping loss factor
#96HIGH-STRENGTH ACRYLIC ADHESIVES INCORPORATING POLYVINYL BUTYRAL
#97ADHESIVE FOR ELECTRICAL STORAGE DEVICE PACKAGING MATERIAL, ELECTRICAL STORAGE DEVICE PACKAGING MATERIAL, ELECTRICAL STORAGE DEVICE CONTAINER, AND ELECTRICAL STORAGE DEVICE
#98MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METHOD FOR FORMING CONDUCTIVE LAYER
#99RESIN COMPOSITION FOR FLEXIBLE DEVICE, FILM-LIKE ADHESIVE FOR FLEXIBLE DEVICE, ADHESIVE SHEET FOR FLEXIBLE DEVICE, AND METHOD OF PRODUCING FLEXIBLE DEVICE
#100BONDING DISSIMILAR MATERIALS USING RADIO FREQUENCY WAVE CURING
#101CURABLE COATING COMPOSITIONS
#102Thermosetting adhesive film and coverlay film comprising same
#103Vehicular camera with adhesively bonded construction
#104COATING COMPOSITION FOR ELECTRICAL STEEL SHEET, ADHESIVE SURFACE-COATED ELECTRICAL STEEL SHEET AND LAMINATED CORE
#105DIMERS FROM BIOREACHABLE MOLECULES AS COPOLYMERS
#106Wireless communications and transducer based event detection platform
#107CURING AGENT, ADHESIVE COMPOSITION FOR SEMICONDUCTOR COMPRISING SAME, ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR PACKAGE USING SAME
#108AMINIMIDE COMPOUND, AMINIMIDE COMPOSITION, CURING AGENT, EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING AMINIMIDE COMPOUND, ENCAPSULANT, AND ADHESIVE
#109MULTILAYER TAPE INCLUDING PLURALITY OF MAGNETIC METAL PARTICLES AND ELECTRONIC ASSEMBLY INCLUDING THE SAME
#110ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR PRODUCING CONNECTED STRUCTURE
#111Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring board
#112Vehicle centric logistics management
#113RESIN COMPOSITION
#114Package sealing tape types with varied transducer sampling densities
#115EPOXY COMPOSITION CONTAINING COPOLYAMIDE AND BLOCK COPOLYMER WITH POLYAMIDE AND POLYETHER BLOCKS
#116HIGH Tg ACRYLATE COPOLYMERS WITH NITROGEN-CONTAINING AROMATIC HETEROCYCLIC GROUP
#117UV-CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND UV-CURABLE PRESSURE-SENSITIVE ADHESIVE TAPE
#118HIGH TEMPERATURE RESISTANT B-STAGEABLE EPOXY ADHESIVE AND ARTICLE MANUFACTURED THEREFROM
#119ADHESIVE COMPOSITION
#120Wake circuit for flexible adhesive product
#121Adhesive film
#122UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SAME
#123Roll-to-roll method of fabricating a wireless multi-layer laminate
#124One component (1K) curable adhesive composition
#125TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION
#126Epoxy based reinforcing patches having improved damping loss factor
#127ADHESIVE COMPOSITIONS FOR ANCHORING FASTENERS
#128COMPRESSIBLE PRESSURE-SENSITIVE STRUCTURAL ADHESIVE FILM BASED ON A LATENT REACTIVE COMPOSITION
#129RESIN COMPOSITION FOR PROVISIONAL FIXATION, SUPPORT TAPE FOR SUBSTRATE CONVEYANCE AND METHOD FOR PRODUCING ELECTRONIC DEVICE
#130A METHOD FOR BONDING COMPONENTS OF A FUEL CELL
#131ADHESIVE FOR ENDOSCOPE, CURED PRODUCT THEREOF, ENDOSCOPE, AND METHOD FOR PRODUCING THE SAME
#132ADHERABLE ELEMENT WITH PRESSURE-ACTIVATED ADHESIVE SYSTEM
#133Wireless sensor networks installation, deployment, maintenance, and operation
#134ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE SHEET, AND PRINTED WIRING BOARD
#135Methods of bonding substrates together
#136Correlated asset identifier association
#137METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES
#138PHOTOCURABLE ADHESIVE
#139METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES
#140THERMO-PRINTABLE TAPE
#141CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, CURABLE PRESSURE-SENSITIVE ADHESIVE TAPE, AND BATTERY PACK
#142Impregnating Formulation, Insulation Material, Method for Producing an Insulation Material, and Electrical Machine with an Insulation Material
#143ATTACHABLE SELF-RESISTANCE HEATING/SUPER-HYDROPHOBIC INTEGRATED GRADIENT FILM MATERIAL
#144Preinstalled sealant for prefab components
#145ADHESIVE TAPE AND MOBILE TERMINAL
#146Toughened two-component epoxy composition
#147ADHESIVE SHEET AND ELECTRONIC COMPONENT
#148Structural adhesive compositions
#149ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
#150Structural adhesive compositions
#151Structural adhesive compositions
#152ADHESIVE AGENT AND METHOD FOR PRODUCING ADHESIVE AGENT
#153Epoxy patch having improved adhesion characteristics
#154Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
#155STRUCTURAL BONDING TAPE WITH EPOXIDE MICROCAPSULES
#156Curable Adhesive Sheet and Production Method of Curable Adhesive Sheet
#157CURABLE COATING COMPOSITIONS
#158Elastic one-part structural adhesive tape
#159TWO COMPONENT COATING COMPOSITIONS
#160Resin Composition and Production Method of Bonded Structure
#161Vacuum insulating glazing
#162TWO-COMPONENT COMPOSITION WITH A HIGH DEGREE OF STRENGTH
#163Method of forming first protective film
#164Laminate Structure
#165Thermally reworkable adhesives for electronic devices
#166Reworkable Optical Clear Adhesive
#167RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RESIN SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
#168Adhesive resin laminate, laminate, and method of producing same
#169Hierarchical combination of distributed statistics in a monitoring network
#170Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same
#171ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
#172COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISING CURED PRODUCT THEREOF, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
#173COMPOSITION MADE FROM EPOXY RESIN AND POLYURETHANE
#174ADHESIVE FILM THAT CAN BE WOUND AND STAMPED
#175Adhesive film for display
#176LOW MODULUS, HIGH ELONGATION STRUCTURAL ADHESIVES AND ASSOCIATED BONDED SUBSTRATES
#177Reinforcement member comprising a structural adhesive on a polyester carrier
#178Electrical steel sheet and method for manufacturing same
#179Structural adhesive tape and method of manufacturing the same
#180CURING AGENT FOR EPOXY RESIN ADHESIVES
#181LATENTLY REACTIVE ADHESIVE FILM
#182Anisotropic conductive film and connected structure
#183Single Layer Self-Adhering Reinforcing Patch
#184Tire
#185Hot-melt adhesive resin film and production method thereof
#186Curable resin composition and curable sheet
#187Adhesion method, adhesion-structure, and adhesion kit
#188Vehicular camera with adhesively bonded construction
#189Solid polymeric adhesive compositions having high use temperature, and articles and methods thereof
#190Method for the production of a laminated core
#191Vegetable oil-derived epoxy compositions having improved performance
#192Two-part adhesive composition that undergoes a visual change when cured
#193PRESSURE-SENSITIVE STRUCTURAL ADHESIVE FILM BASED ON EPOXY RESIN COMPOSITION
#194ADHESIVE GRIPPER COMPRISING A SHAPE MEMORY POLYMER FOR PICK-AND-PLACE APPLICATIONS
#195Thermosetting epoxy resin composition having low curing temperature and good storage stability
#196WATER ACTIVATED EYELASH
#197Wireless communications and transducer based event detection platform
#198CONDUCTIVE ADHESIVE AND A BONDING METHOD OF CIRCUIT BOARD
#199ONE-PART THERMALLY CURABLE COMPOSITION
#200CURABLE EPOXIDE COMPOSITION
#201HEAT AND HUMIDITY RESISTANT ADHESIVE COMPOSITION
#202CARTRIDGE COVERING ELEMENT FOR SEALING OFF A MICROFLUIDIC CARTRIDGE
#203Electrical steel strip or sheet, method for producing such an electrical steel strip or sheet, and lamination stack made therefrom
#204BIOFABRICATED LEATHER ARTICLES, AND METHODS THEREOF
#205Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same
#206Adhesive composition, film-like adhesive and production method thereof, and semiconductor package using film-like adhesive and production method thereof
#207Adhesive composition
#208Adhesive composition
#209Adhesive composition
#210Adhesive composition
#211Fire-retardant resins and composite materials
#212ADHESIVE COMPOSITION, CURED PRODUCT, AND ARTICLE
#213Method for manufacturing semiconductor device, heat-curable resin composition, and dicing-die attach film
#214Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same
#215Methods for conductive adhesives based on graphene and applications thereof
#216Reactive Adhesives for Filtration Applications
#217Adhesive composition
#218ADHESIVE TAPE THAT CAN BE WOUND AND STAMPED FOR SELECTIVE UV ACTIVATION
#219ADHESIVE PRINTING FORM ATTACHMENT LAYER, METHOD FOR ITS MANUFACTURE, AND PRINTING FORM ATTACHMENT CYLINDER COMPRISING THE SAME
#220Adhesive film for printed wiring board
#221Adhesive sheet
#222Acrylic-epoxy adhesive composition
#223Structural adhesive compositions
#224MULTILAYERED POLYETHERKETONEKETONE ARTICLES AND METHODS THEREOF
#225Method for manufacturing polarizing plate and adhesive composition for polarizing plate
#226RADICAL-POLYMERIZABLE ADHESIVE COMPOSITION FOR LAMINATING AND BONDING STEEL PLATES, ADHESIVE LAMINATE, MOTOR, AND METHOD FOR MANUFACTURING ADHESIVE LAMINATE
#227Methods and systems for attaching detectors to electronic readout substrates
#228Method for joining dissimilar materials
#229Method for manufacturing multilayer printed wiring board
#230Package sealing tape types with varied transducer sampling densities
#231THERMOSETTING SHEET AND DICING DIE BONDING FILM
#232THERMOSETTING SHEET AND DICING DIE BONDING FILM
#233Methods of bonding substrates together
#234Glass film-resin composite
#235Wake circuit for flexible adhesive product
#236Low-temperature heat-curable adhesive composition for structure
#237Curable compositions and related methods
#238Method and apparatus for fabrication of composite tooling
#239Battery box
#240Structure for fiber attachment with adhesive material
#241CURABLE ADHESIVE COMPOSITION FOR DIE ATTACH
#242Honeycomb core splice adhesive with improved fire retardancy
#243ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE SHEET, AND PRINTED WIRING BOARD
#244Conductive adhesive and cured product thereof
#245Vehicular camera with adhesively bonded construction
#246ADHESIVE COMPOSITION, AND ADHESIVE LAYER-EQUIPPED LAYERED PRODUCT USING SAME
#247Hot-melt adhesive resin film and production method thereof
#248Adhesive for endoscope, cured product, endoscope, and method for producing endoscope
#249Phenolic epoxy system
#250LAYERED PRODUCT
#251Laminate material for reinforcement, reinforcing method, and reinforcing structural body for structure
#252Adhesive film, preparation method thereof, display device and method for removing adhesive film
#253Electrical steel sheet adhesive coating composition, electrical steel sheet product, and manufacturing method therefor
#254Adhesion promoters and compositions for containers and other articles
#255Reusable attaching apparatus and methods of making and using a reusable attaching apparatus
#256Rollable display device
#257Protrusion patch, method of installation and use, and measurement of quality
#258Interior member for aircraft, manufacturing method of the same, and replacement method of the same
#259Radio frequency heating for rapid curing of nanocomposite adhesives
#260Toughened adhesive and bonding method using the same
#261Vehicular camera with adhesively bonded construction
#262Error based locationing of a mobile target on a road network
#263Adhesive composition and polarizing plate comprising adhesive layer formed using same
#264Adhesive composition and polarizing plate comprising adhesive layer formed using same
#265Thermally activatable, fast curing adhesive coating
#266Wireless sensor networks installation, deployment, maintenance, and operation
#267SELF-ADHESIVE SEAL ASSEMBLY AND METHOD OF MAKING SUCH AN ASSEMBLY
#268UV-curable adhesive tape and method for jacketing elongated items, especially leads
#269Two-Component Structural Adhesives
#270Correlated asset identifier association
#271Curable epoxide composition
#272Adhesive composition
#273Transient infrastructure for ubiquitous network communications applications
#274Adhesive and method of encapsulating organic electronic device using the same
#275Epoxy resin composition
#276Adhesive film including a (meth)acrylate matrix including a curable epoxy/thiol resin composition, tape, and method
#277CATION-CURABLE RESIN COMPOSITION
#278Wireless communications and transducer based event detection platform
#279Adhesive strain sensing pods with improved protection
#280Method for connecting molded bodies by injecting a single-component heat-curing epoxy resin composition into cavities
#281ADHESIVE SHEET AND PRODUCTION METHOD THEREOF
#282Adhesive sheet
#283Film roll and film bundle
#284Adhesive resin laminate, laminate, and method of producing same
#285ULTRA RAPID CURING STRUCTURAL ADHESIVE
#286ADHESIVE COMPOSITION
#287Vehicle centric logistics management
#288TWO-COMPONENT ROOM TEMPERATURE CURABLE TOUGHENED EPOXY ADHESIVES
#289Method for curing adhesive composition and method for manufacturing bonded structure
#290Seal coated devices
#291CURABLE EPOXY COMPOSITIONS AND CURED PRODUCTS THEREOF
#292ADHESION IMPROVER FOR CARBON-FIBER-REINFORCED RESIN COMPOSITION
#293Epoxy composition containing copolyamide and block copolymer with polyamide and polyether blocks
#294Epoxy resin adhesive with high compressive strength
#295Adhesive coating composition for non-oriented electrical steel sheet, and method for manufacturing non-oriented electrical steel sheet
#296THERMOSETTING ADHESIVE FILMS
#297MULTI-LAYER WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
#298Hydroxyl functionalized polybutadiene polyurethane hotmelt prepolymer
#299Error based locationing of a mobile target on a road network
#300SOLID POLYMERIC ADHESIVE COMPOSITIONS HAVING HIGH USE TEMPERATURE, AND ARTICLES AND METHODS THEREOF