104082 ⎘
Presence of epoxy resin in the pretreated surface to be joined
METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETIC AND ELECTROSTATIC DISSIPATATIVE FEATURES
#2Surface treatment to enhance bonding of composite materials
#3Bonding of composite materials
#4Method for repairing or reinforcing structure, method for producing repaired or reinforced structure, and adhesive sheet
#5Method for improving the operability of an olefin polymerization reactor
#6Azole silane compound, surface treatment solution, surface treatment method, and use thereof
#7Bonding of composite materials
#8PRESSURE SENSITIVE ADHESIVES BASED ON CARBOXYLIC ACIDS AND EPOXIDES
#9Pressure sensitive adhesives based on fatty acids
#10Method for pretreating molded articles made of plastic matrix-fiber composites
#11ADHESION PROMOTION OF METAL TO A DIELECTRIC
#12USE OF SILANES AS ADHESION PROMOTERS BETWEEN TWO ORGANIC SURFACES
#13Method of surface treatment of composite material structures with atmospheric plasma beams