104631 ⎘
Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
Fine-processing agent and fine-processing method
#302Defect etching of germanium
#303SEMICONDUCTOR WET ETCHANT AND METHOD OF FORMING INTERCONNECTION STRUCTURE USING THE SAME
#304WET ETCHING SOLUTION
#305Inertial sensor and method of manufacturing the same
#306Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
#307SOLUTION FOR REMOVING TITANIUM-CONTAINING COATINGS AND REMOVING METHOD USING SAME
#308Method of fabricating structured particles composed of silicon or a silicon-based material
#309Titanium etchant composition and method of forming a semiconductor device using the same
#310Etchant for metal wiring and method for manufacturing metal wiring using the same
#311ETCHANT COMPOSITION FOR METAL WIRING AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR ARRAY PANEL USING THE SAME
#312Etching composition, in particular for strained or stressed silicon materials, method for characterizing defects on surfaces of such materials and process of treating such surfaces with the etching composition
#313Composition for etching silicon oxide and method of forming a contact hole using the same
#314Process for the rough-etching of silicon solar cells
#315Methods for etching doped oxides in the manufacture of microfeature devices
#316Method of manufacturing a capacitor
#317ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo
#318Textured silicon substrate and method
#319Dry non-plasma treatment system and method of using
#320Method of etching a silicon-based material
#321Acid corrosion solution for preparing polysilicon suede and the applied method of it
#322Method for etching glass substrate
#323Etching composition for metal material and method for manufacturing semiconductor device by using same
#324Compositions and methods for the selective removal of silicon nitride
#325LIQUID CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES
#326Etching solution
#327METHODS FOR STRIPPING MATERIAL FOR WAFER RECLAMATION
#328Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#329Composition for etching silicon oxide layer, method for etching semiconductor device using the same, and composition for etching semiconductor device
#330POST-CONTACT OPENING ETCHANTS FOR POST-CONTACT ETCH CLEANS AND METHODS FOR FABRICATING THE SAME
#331Defect Etching of Germanium
#332ALPHA HYDROXY CARBOXYLIC ACID ETCHANTS FOR SILICON MICROSTRUCTURES
#333Methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices
#334ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANUFACTURING SILICON WAFERS USING THE SAME
#335DIFLUORIDE COMPOSITION, METHOD OF PREPARATION, AND USE FOR FROSTING GLASS
#336Titanium nitride-stripping liquid, and method for stripping titanium nitride coating film
#337Semiconductor wet etchant and method of forming interconnection structure using the same
#338Compositions for use in semiconductor devices
#339Composition for etching a metal hard mask material in semiconductor processing
#340Etching solution, method of surface modification of semiconductor substrate and method of forming shallow trench isolation
#341Etching solution for multiple layer of copper and molybdenum and etching method using the same
#342Compositions for Dissolution of Low-K Dielectric Films, and Methods of Use
#343Solution used in the fabrication of a porous semiconductor material, and a method of fabricating said material
#344Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
#345SURFACE CLEANING METHOD OF SEMICONDUCTOR WAFER HEAT TREATMENT BOAT
#346Method and etchant for removing glass-coating from metal wires
#347Etching composition and method for manufacturing a capacitor using the same
#348Stripper for coating layer
#349Composition for etching silicon oxide and method of forming a contact hole using the same
#350Selective High Dielectric Constant Material Etchant
#351Methods for characterizing defects on silicon surfaces and etching composition and treatment process therefor
#352Signal line for a display device, etchant, thin film transistor panel, and method for manufacturing the same
#353Wet etching solution
#354Method for selective etching
#355Methods for etching doped oxides in the manufacture of microfeature devices
#356Fluoride tile etchants having improved safety
#357Dry non-plasma treatment system and method of using
#358Highly selective doped oxide etchant
#359Composition for etching a metal hard mask material in semiconductor processing
#360Manufacturing method of semiconductor device using etching solution
#361Highly selective doped oxide etchant
#362Post-parting etch to smooth silicon sliders
#363Method for making solar cell
#364Functional paste
#365Etch compositions and methods of processing a substrate
#366Wet Treatment of Hafnium Containing Materials
#367Use of fluorinated additives in the etching or polishing of integrated circuits
#368PAA-based etchant, methods of using same, and resultant structures
#369Method for etching non-conductive substrate surfaces
#370Stripper
#371Filterable surfactant composition
#372Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors
#373Methods for etching doped oxides in the manufacture of microfeature devices
#374Etch compositions and methods of processing a substrate
#375Solution for wet treatment of hafnium containing materials, use of the solution and a wet treatment process
#376Etchant, method for fabricating interconnection line using the etchant, and method for fabricating thin film transistor substrate using the etchant
#377Polishing slurry and method of reclaiming wafers
#378Polymer remover
#379Cleaning solution and method of forming a metal pattern for a semiconductor device using the same
#380Etchant and method of use
#381Etching solution for D-defect evaluation in silicon wafer and evaluation method using the same
#382Semiconductor substrate treating method, semiconductor component and electronic appliance
#383Difluoride composition, method of preparation, and use for frosting glass
#384Etching pastes for titanium oxide surfaces
#385Etching composition and use thereof with feedback control of HF in BEOL clean
#386Etching solution and method for removing low-k dielectric layer
#387Etchants containing filterable surfactant
#388Material and process for etched structure filling and planarizing
#389Method for texturing surfaces of silicon wafers
#390Selective hafnium oxide etchant
#391Etchant composition and the use thereof
#392Etching gas, etching method and etching gas evaluation method
#393Method of forming trench isolation within a semiconductor substrate
#394Ruthenium silicide wet etch
#395Etching solution, etched article and method for etched article
#396Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#397Method of manufacturing a semiconductor device
#398Compositions for cleaning organic and plasma etched residues for semiconductor devices
#399Ionic liquids of heterocyclic amines
#400Fluorinated surfactants for aqueous acid etch solutions
#401PAA-based etchant, methods of using same, and resultant structures
#402Tungsten metal removing solution and method for removing tungsten metal by use thereof
#403Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates
#404Etching composition, method of preparing the same, method of etching an oxide film, and method of manufacturing a semiconductor device
#405ETCHANT COMPOSITION FOR SEM IMAGE ENHANCEMENT OF P-N JUNCTION CONTRAST
#406Etching solution, etching method and method for manufacturing semiconductor device
#407Methods of etching silicon nitride substantially selectively relative to an oxide of aluminum
#408Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#409Silicon addition for silicon nitride etching selectivity
#410Titanium nitride hard mask and etch residue removal