ClassID:

104631

C09K13/08 - page 2 - CPC Classification

Classification description:

Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound

Recent Application in this class:
#301
20120056126
2012-03-08

Fine-processing agent and fine-processing method

#302
20120034787
2012-02-09

Defect etching of germanium

#303
20120009792
2012-01-12

SEMICONDUCTOR WET ETCHANT AND METHOD OF FORMING INTERCONNECTION STRUCTURE USING THE SAME

#304
20120007019
2012-01-12

WET ETCHING SOLUTION

#305
20110290022
2011-12-01

Inertial sensor and method of manufacturing the same

#306
20110275164
2011-11-10

Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon

#307
20110257056
2011-10-20

SOLUTION FOR REMOVING TITANIUM-CONTAINING COATINGS AND REMOVING METHOD USING SAME

#308
20110250498
2011-10-13

Method of fabricating structured particles composed of silicon or a silicon-based material

#309
20110240912
2011-10-06

Titanium etchant composition and method of forming a semiconductor device using the same

#310
20110226727
2011-09-22

Etchant for metal wiring and method for manufacturing metal wiring using the same

#311
20110177680
2011-07-21

ETCHANT COMPOSITION FOR METAL WIRING AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR ARRAY PANEL USING THE SAME

#312
20110104905
2011-05-05

Etching composition, in particular for strained or stressed silicon materials, method for characterizing defects on surfaces of such materials and process of treating such surfaces with the etching composition

#313
20110073801
2011-03-31

Composition for etching silicon oxide and method of forming a contact hole using the same

#314
20110059570
2011-03-10

Process for the rough-etching of silicon solar cells

#315
20100330768
2010-12-30

Methods for etching doped oxides in the manufacture of microfeature devices

#316
20100317171
2010-12-16

Method of manufacturing a capacitor

#317
20100301010
2010-12-02

ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo

#318
20100239818
2010-09-23

Textured silicon substrate and method

#319
20100237046
2010-09-23

Dry non-plasma treatment system and method of using

#320
20100233539
2010-09-16

Method of etching a silicon-based material

#321
20100224593
2010-09-09

Acid corrosion solution for preparing polysilicon suede and the applied method of it

#322
20100224589
2010-09-09

Method for etching glass substrate

#323
20100216315
2010-08-26

Etching composition for metal material and method for manufacturing semiconductor device by using same

#324
20100176082
2010-07-15

Compositions and methods for the selective removal of silicon nitride

#325
20100163788
2010-07-01

LIQUID CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES

#326
20100112821
2010-05-06

Etching solution

#327
20100112728
2010-05-06

METHODS FOR STRIPPING MATERIAL FOR WAFER RECLAMATION

#328
20100035785
2010-02-11

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

#329
20100035436
2010-02-11

Composition for etching silicon oxide layer, method for etching semiconductor device using the same, and composition for etching semiconductor device

#330
20090253268
2009-10-08

POST-CONTACT OPENING ETCHANTS FOR POST-CONTACT ETCH CLEANS AND METHODS FOR FABRICATING THE SAME

#331
20090215275
2009-08-27

Defect Etching of Germanium

#332
20090078982
2009-03-26

ALPHA HYDROXY CARBOXYLIC ACID ETCHANTS FOR SILICON MICROSTRUCTURES

#333
20090042401
2009-02-12

Methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices

#334
20090042390
2009-02-12

ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANUFACTURING SILICON WAFERS USING THE SAME

#335
20090039311
2009-02-12

DIFLUORIDE COMPOSITION, METHOD OF PREPARATION, AND USE FOR FROSTING GLASS

#336
20090017636
2009-01-15

Titanium nitride-stripping liquid, and method for stripping titanium nitride coating film

#337
20090017626
2009-01-15

Semiconductor wet etchant and method of forming interconnection structure using the same

#338
20090001314
2009-01-01

Compositions for use in semiconductor devices

#339
20080318435
2008-12-25

Composition for etching a metal hard mask material in semiconductor processing

#340
20080299741
2008-12-04

Etching solution, method of surface modification of semiconductor substrate and method of forming shallow trench isolation

#341
20080286974
2008-11-20

Etching solution for multiple layer of copper and molybdenum and etching method using the same

#342
20080283796
2008-11-20

Compositions for Dissolution of Low-K Dielectric Films, and Methods of Use

#343
20080268652
2008-10-30

Solution used in the fabrication of a porous semiconductor material, and a method of fabricating said material

#344
20080261847
2008-10-23

Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon

#345
20080237190
2008-10-02

SURFACE CLEANING METHOD OF SEMICONDUCTOR WAFER HEAT TREATMENT BOAT

#346
20080223819
2008-09-18

Method and etchant for removing glass-coating from metal wires

#347
20080166842
2008-07-10

Etching composition and method for manufacturing a capacitor using the same

#348
20080161217
2008-07-03

Stripper for coating layer

#349
20080121622
2008-05-29

Composition for etching silicon oxide and method of forming a contact hole using the same

#350
20080110748
2008-05-15

Selective High Dielectric Constant Material Etchant

#351
20080099718
2008-05-01

Methods for characterizing defects on silicon surfaces and etching composition and treatment process therefor

#352
20080079006
2008-04-03

Signal line for a display device, etchant, thin film transistor panel, and method for manufacturing the same

#353
20080041823
2008-02-21

Wet etching solution

#354
20080038932
2008-02-14

Method for selective etching

#355
20080038896
2008-02-14

Methods for etching doped oxides in the manufacture of microfeature devices

#356
20080023667
2008-01-31

Fluoride tile etchants having improved safety

#357
20070298972
2007-12-27

Dry non-plasma treatment system and method of using

#358
20070262048
2007-11-15

Highly selective doped oxide etchant

#359
20070235684
2007-10-11

Composition for etching a metal hard mask material in semiconductor processing

#360
20070224792
2007-09-27

Manufacturing method of semiconductor device using etching solution

#361
20070207622
2007-09-06

Highly selective doped oxide etchant

#362
20070158301
2007-07-12

Post-parting etch to smooth silicon sliders

#363
20070151944
2007-07-05

Method for making solar cell

#364
20070148810
2007-06-28

Functional paste

#365
20070145009
2007-06-28

Etch compositions and methods of processing a substrate

#366
20070141850
2007-06-21

Wet Treatment of Hafnium Containing Materials

#367
20070135655
2007-06-14

Use of fluorinated additives in the etching or polishing of integrated circuits

#368
20070111532
2007-05-17

PAA-based etchant, methods of using same, and resultant structures

#369
20070099425
2007-05-03

Method for etching non-conductive substrate surfaces

#370
20070078073
2007-04-05

Stripper

#371
20070075290
2007-04-05

Filterable surfactant composition

#372
20070060490
2007-03-15

Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors

#373
20070049041
2007-03-01

Methods for etching doped oxides in the manufacture of microfeature devices

#374
20070023396
2007-02-01

Etch compositions and methods of processing a substrate

#375
20070012662
2007-01-18

Solution for wet treatment of hafnium containing materials, use of the solution and a wet treatment process

#376
20060292888
2006-12-28

Etchant, method for fabricating interconnection line using the etchant, and method for fabricating thin film transistor substrate using the etchant

#377
20060255314
2006-11-16

Polishing slurry and method of reclaiming wafers

#378
20060237392
2006-10-26

Polymer remover

#379
20060228890
2006-10-12

Cleaning solution and method of forming a metal pattern for a semiconductor device using the same

#380
20060186087
2006-08-24

Etchant and method of use

#381
20060144823
2006-07-06

Etching solution for D-defect evaluation in silicon wafer and evaluation method using the same

#382
20060144421
2006-07-06

Semiconductor substrate treating method, semiconductor component and electronic appliance

#383
20060124598
2006-06-15

Difluoride composition, method of preparation, and use for frosting glass

#384
20060118759
2006-06-08

Etching pastes for titanium oxide surfaces

#385
20060118522
2006-06-08

Etching composition and use thereof with feedback control of HF in BEOL clean

#386
20060097220
2006-05-11

Etching solution and method for removing low-k dielectric layer

#387
20060097218
2006-05-11

Etchants containing filterable surfactant

#388
20060089000
2006-04-27

Material and process for etched structure filling and planarizing

#389
20060068597
2006-03-30

Method for texturing surfaces of silicon wafers

#390
20060054595
2006-03-16

Selective hafnium oxide etchant

#391
20060049132
2006-03-09

Etchant composition and the use thereof

#392
20060027530
2006-02-09

Etching gas, etching method and etching gas evaluation method

#393
20060009004
2006-01-12

Method of forming trench isolation within a semiconductor substrate

#394
20050263489
2005-12-01

Ruthenium silicide wet etch

#395
20050224459
2005-10-13

Etching solution, etched article and method for etched article

#396
20050215446
2005-09-29

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

#397
20050211375
2005-09-29

Method of manufacturing a semiconductor device

#398
20050202987
2005-09-15

Compositions for cleaning organic and plasma etched residues for semiconductor devices

#399
20050196671
2005-09-08

Ionic liquids of heterocyclic amines

#400
20050181620
2005-08-18

Fluorinated surfactants for aqueous acid etch solutions

#401
20050169096
2005-08-04

PAA-based etchant, methods of using same, and resultant structures

#402
20050156140
2005-07-21

Tungsten metal removing solution and method for removing tungsten metal by use thereof

#403
20050124517
2005-06-09

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates

#404
20050081883
2005-04-21

Etching composition, method of preparing the same, method of etching an oxide film, and method of manufacturing a semiconductor device

#405
20050079649
2005-04-14

ETCHANT COMPOSITION FOR SEM IMAGE ENHANCEMENT OF P-N JUNCTION CONTRAST

#406
20050070110
2005-03-31

Etching solution, etching method and method for manufacturing semiconductor device

#407
20050061768
2005-03-24

Methods of etching silicon nitride substantially selectively relative to an oxide of aluminum

#408
20050003674
2005-01-06

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

#409
15909790
2019-05-07

Silicon addition for silicon nitride etching selectivity

#410
14642831
2015-12-29

Titanium nitride hard mask and etch residue removal