108220 ⎘
Special methods for preparing compositions containing mixtures of detergents ; Methods for using cleaning compositions; Special cleaning or washing methods characterised by the objects to be cleaned "Hard" surfaces Electronic devices, e.g. PCBs or semiconductors
Compositions for the removal of organic and inorganic residues
#1202Cleaning agent composition for a positive or a negative photoresist
#1203Photoresist stripping solution and a method of stripping photoresists using the same
#1204Compositions and methods for a barrier removal
#1205Solvent compositions containing chlorofluoroolefins
#1206Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer
#1207Process of maintaining hybrid etch
#1208Method for cleaning an integrated circuit device using an aqueous cleaning composition
#1209Semiconductor process residue removal composition and process
#1210CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers
#1211Composition for exfoliation agent effective in removing resist residues
#1212System and method for cleaning semiconductor fabrication equipment parts
#1213Process solutions containing surfactants used as post-chemical mechanical planarization treatment
#1214Semiconductor device cleaning employing heterogeneous nucleation for controlled cavitation
#1215Etching composition, method of preparing the same, method of etching an oxide film, and method of manufacturing a semiconductor device
#1216Cleaning solution for photoresist and method for forming pattern using the same
#1217Surface treatment apparatus and method for manufacturing liquid crystal display device
#1218NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
#1219Method of remediating PCB contamination on metal surfaces
#1220Solvents containing cycloakyl alkyl ethers and process for production of the ethers
#1221Selective silicon etch chemistries, methods of production and uses thereof
#1222Chemical composition for use with group IIA metal fluorides
#1223Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching
#1224Chemical rinse composition
#1225Detergent composition
#1226Methods and compositions for selectively etching metal films and structures
#1227Composition and method for removing copper-compatible resist
#1228System and method for cleaning semicondutor fabrication equipment parts
#1229Method for wafer surface cleaning using hydroxyl radicals in deionized water
#1230Process and system for cleaning surfaces of semiconductor wafers
#1231Rinse solution and methods for forming and cleaning a semiconductor device
#1232Stripping agent composition for a resist
#1233Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the composition
#1234Stripping and cleaning compositions for microelectronics
#1235Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same
#1236Photoresist stripping solution and a method of stripping photoresists using the same
#1237Aqueous fluoride compositions for cleaning semiconductor devices
#1238Composition comprising an oxidizing and complexing compound
#1239Composition for cleaning
#1240Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#1241Method and apparatus for wet-cleaning substrate
#1242Nano-micro particle fluid for cleaning dirty and greasy surfaces and pipes
#1243Surface treatment of textured silicon
#1244Solvent for reducing resist consumption and method using solvent for reducing resist consumption
#1245Detergent composition with low foam and high nickel solubility
#1246Low foam media cleaning detergent
#1247Low foam media cleaning detergent with nonionic surfactants