ClassID:

108134

C11D7/3227 - CPC Classification

Classification description:

Compositions of detergents based essentially on non-surface-active compounds; Organic compounds containing nitrogen Ethers thereof

Recent Application in this class:
#1
20250277171
2025-09-04

COMPOSITION FOR POST-CMP CLEANING

#2
20250017209
2025-01-16

COMPOSITION, MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT, AND CLEANING METHOD FOR SEMICONDUCTOR SUBSTRATE

#3
20240231237
2024-07-11

TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMOVING RESIST

#4
20240200490
2024-06-20

HYDROPHILIC POLYETHER AMINE SOLUTION AND USES THEREOF

#5
20240134284
2024-04-25

TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMOVING RESIST

#6
20220380705
2022-12-01

Composition comprising three alkanolamines and a hydroxylamine for removing etch residues

#7
20220260919
2022-08-18

Treatment liquid, method for washing substrate, and method for removing resist

#8
20210179977
2021-06-17

1,2-dichloro-1-(2,2,2-trifluoroethoxy)ethylene, production method therefor, and uses thereof

#9
20190317409
2019-10-17

Photoresist stripper

#10
20190313639
2019-10-17

Ether amines for enhanced sporicidal performance

#11
20190079409
2019-03-14

Treatment liquid, method for washing substrate, and method for removing resist

#12
20170245499
2017-08-31

Ether amines for enhanced sporicidal performance

#13
20150329475
2015-11-19

Quaternary ammonium hydroxides

#14
20140026923
2014-01-30

Method for cleaning wafers using a polycarboxylate solution

#15
20130310297
2013-11-21

Polymer-cleaning composition

#16
20130261039
2013-10-03

Quaternary ammonium hydroxides

#17
20120285482
2012-11-15

Method for cleaning wafers using a polycarboxylate solution

#18
20110094545
2011-04-28

Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux

#19
20100180917
2010-07-22

Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux

#20
20100041582
2010-02-18

Cleaning compositions for removing organic deposits in hard to reach surfaces

#21
20100041580
2010-02-18

Cleaning compositions for removing organic deposits in hard to reach surfaces

#22
20090170741
2009-07-02

Composition for removing polymer residue of photosensitive etching-resistant layer

#23
20090151755
2009-06-18

Method and composition for cleaning wafers

#24
20090149364
2009-06-11

Particle removal cleaning method and composition

#25
20090011967
2009-01-08

Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials

#26
20080242102
2008-10-02

Chemistry for removal of photo resist, organic sacrificial fill material and etch polymer

#27
20080004193
2008-01-03

Semiconductor process residue removal composition and process

#28
20070207938
2007-09-06

Cleaning compositions and methods of use thereof

#29
20070078074
2007-04-05

Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials

#30
20060286393
2006-12-21

Composition and process for improving the adhesion of a siccative organic coating compositions to metal substrates

#31
20060115970
2006-06-01

Compositions and processes for photoresist stripping and residue removal in wafer level packaging

#32
20060079426
2006-04-13

Use of polyoxypropylene/polyoxyethylene terpene compounds as degreasing agents for hard surfaces

#33
20060003909
2006-01-05

Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials

#34
20050245422
2005-11-03

Alkali cleaner

#35
20050153867
2005-07-14

Modified alkoxylated polyol compounds

#36
20050143270
2005-06-30

Cleaning solutions and etchants and methods for using same

#37
20050048211
2005-03-03

Composition and process for improving the adhesion of a siccative organic coating compositions to metal substrates

#38
20050037937
2005-02-17

Process of treating a carpet with a composition comprising a zeolite

#39
20050009722
2005-01-13

Cleaning compositions for removing organic deposits in hard to reach surfaces