108137 ⎘
Compositions of detergents based essentially on non-surface-active compounds; Organic compounds containing nitrogen Esters or carbonates thereof
LIPID REMOVAL IN DETERGENTS
#2BIODEGRADABLE MICROCAPSULES WITH IMPROVED STORAGE STABILITY, PROCESS FOR PREPARING THE SAME AND METHOD OF USE THEREOF
#3THINNER COMPOSITION AND METHOD FOR SUBSTRATE PROCESSING
#4Anti-limescale composition
#5Molecules having one hydrophobic group and two identical hydrophilic ionic groups and compositions thereof and methods of preparation thereof
#6Use of di-ionic compounds as corrosion inhibitors in a water system
#7EXTERIOR CLEANING COMPOSITION FOR A VEHICLE
#8Molecules having one hydrophobic group and two identical hydrophilic ionic groups and compositions thereof and methods of preparation thereof
#9Use of di-ionic compounds as corrosion inhibitors in a water system
#10SYSTEM AND METHOD FOR REMOVAL OF IMPURITIES RESULTING FROM THE USE OF SODA ASH IN COAL FIRED POWER PLANTS
#11Treatment of hard surfaces
#12Liquid composition comprising ethylenediamine disuccinic acid salt
#13PERHYDROLASE VARIANT PROVIDING IMPROVED SPECIFIC ACTIVITY
#14Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#15Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#16METHOD OF CLEANING CONTAINERS FOR RECYCLING
#17Semiconductor process residue removal composition and process
#18Cleaning compositions and methods of use thereof
#19Method of cleaning containers for recycling
#20Methods for stabilizing ingredients within cosmetics, personal care and household products
#21Stripper formulations and process
#22Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#23Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates
#24Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate