METAL FILAMENTS FOR FUSED FILAMENT FABRICATION

FLUX AND SOLDER PASTE

HIGH IMPACT SOLDER TOUGHNESS ALLOY

METHODS, APPARATUS AND SYSTEMS FOR CREATING WELLBORE PLUGS FOR ABANDONED WELLS

BISMUTH-BASED FIREARM PROJECTILES, FIREARM CARTRIDGES INCLUDING THE SAME, AND RELATED METHODS

PLUG AND ABANDON WITH FUSIBLE ALLOY SEAL

SOLDER PARTICLES, SOLDER PARTICLE PRODUCTION METHOD, AND CONDUCTIVE COMPOSITION

METHOD OF PHASE-TRANSITIONING THREE-DIMENSIONAL DIRAC SEMIMETAL INTO TWO-DIMENSIONAL WEYL SEMIMETAL AND SEMIMETAL THAT UNDERGOES PHASE TRANSITION BY THE SAME

THERMOELECTRIC CONVERSION MATERIAL AND THERMOELECTRIC CONVERSION DEVICE USING SAME

METAL-ALLOY BIPHASIC SYSTEMS, AND POWDERS AND METHODS FOR MAKING METAL-ALLOY BIPHASIC SYSTEMS

Method of preparing biodegradable Zn—Mg—Bi zinc alloy

BONDING SHEET AND METHOD FOR PRODUCING SAME

LEAD-FREE SOLDER PASTE

BISMUTH-BASED FIREARM PROJECTILES, FIREARM CARTRIDGES INCLUDING THE SAME, AND RELATED METHODS

METHODS, APPARATUS AND SYSTEMS FOR CREATING WELLBORE PLUGS FOR ABANDONED WELLS

LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME, SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, AND METHOD OF MANUFACTURING SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION

Methods, apparatus and systems for creating bismuth alloy plugs for abandoned wells

SOLDER ALLOY, JOINT PORTION, JOINING MATERIAL, SOLDER PASTE, JOINT STRUCTURE, AND ELECTRONIC CONTROL DEVICE

Plug and abandon with fusible alloy seal

STABLE UNDERCOOLED METALLIC PARTICLES FOR FILLING A VOID

Low melting-point bonding member, method for producing same, semiconductor electronic circuit, and method for mounting said semiconductor electronic circuit

WELL SEALING MATERIAL AND METHOD OF PRODUCING A PLUG

Methods, apparatus and systems for creating wellbore plugs for abandoned wells

SOLDER PASTES AND METHODS OF USING THE SAME

Sliding member

Lead-free solder alloy and method of manufacturing electronic device using the same

Sn—Cu mixed alloy solder paste, method of making the same and soldering method

SnIn solder alloys

ALLOYS AND PROCESSES FOR MAKING AND USING SAME

BIODEGRADABLE Zn-Mg-Bi ZINC ALLOY AND PREPARATION METHOD THEREOF

Copper alloy sliding material

METHOD OF PERMANENTLY PHASE-TRANSITING SEMIMETAL USING ION IMPLANTATION AND SEMIMETAL PHASE-TRANSITED THEREBY

Bismuth-based firearm projectiles, firearm cartridges including the same, and related methods

Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate

Heat sources and alloys for use in down-hole applications

Thermoelectric material and thermoelectric device including the same

Thermoelectric conversion material and thermoelectric conversion device using same

Solder joint

Conductive composites

Well sealing material and method of producing a plug

SINTERED COMPACT TARGET AND METHOD OF PRODUCING SINTERED COMPACT

Terminal member made of plurality of metal layers between two heat sinks

Extreme ultraviolet mask absorber materials

Extreme ultraviolet mask blank hard mask materials

SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES

Zintl compounds with high thermoelectric performance and methods of manufacture thereof

Methods, apparatus and systems for creating wellbore plugs for abandoned wells

Methods, apparatus and systems for creating bismuth alloy plugs for abandoned wells

Methods, apparatus and systems for creating wellbore plugs for abandoned wells

Thermoelectric conversion material, thermoelectric conversion module, and method for manufacturing thermoelectric conversion material

SLIDING MEMBER AND SLIDING BEARING

Sliding member

Sliding member

Compound semiconductor and use thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric alloy, method for producing the same and thermoelectric alloy composite

SnBiSb series low-temperature lead-free solder and its preparation method

SnBi and SnIn solder alloys

Thermoelectric material, manufacturing method of thermoelectric material, thermoelectric conversion element, and thermoelectric conversion module

Stable binary nanocrystalline alloys and methods of identifying same

THERMOELECTRIC COMPOSITIONS AND METHODS OF FABRICATING HIGH THERMOELECTRIC PERFORMANCE MgAgSb-BASED MATERIALS

Sb—Te-based alloy sintered compact sputtering target

Separation of manganese bismuth powders

Hybrid high temperature lead-free solder preform

Lead-Free Solder Alloy Comprising Sn, Bi and at Least One of Mn, Sb, Cu and its Use for Soldering an Electronic Component to a Substrate

METHOD FOR PRODUCING PLAIN-BEARING COMPOSITE MATERIALS, PLAIN-BEARING COMPOSITE MATERIAL, AND SLIDING ELEMENT MADE OF SUCH PLAIN-BEARING COMPOSITE MATERIALS

Preparation method and use of thickness-controllable bismuth nanosheet and bismuth alloy nanosheet

METHOD FOR PRODUCING PLAIN-BEARING COMPOSITE MATERIALS, PLAIN-BEARING COMPOSITE MATERIAL AND SLIDING ELEMENT COMPRISING PLAIN-BEARING COMPOSITE MATERIALS OF THIS TYPE

HIGH IMPACT SOLDER TOUGHNESS ALLOY

Stable nanocrystalline ordering alloy systems and methods of identifying same

HIGH IMPACT SOLDER TOUGHNESS ALLOY

Sliding member and sliding bearing

Conductive composites

Solder bonding method and solder joint

ANISOTROPIC COMPLEX SINTERED MAGNET COMPRISING MnBi WHICH HAS IMPROVED MAGNETIC PROPERTIES AND METHOD OF PREPARING THE SAME

ALLOYS AND PROCESSES FOR MAKING AND USING SAME

Apparatus for use in well abandonment

Extreme ultraviolet absorbing alloys

Heat sources and alloys for use in down-hole applications

Metal fine particle-containing composition

Joining material and method for manufacturing joined body

METHOD OF MANUFACTURING JOINED BODY, AND JOINING MATERIAL

SOLDER ALLOY AND SOLDER COMPOSITION

Lead-free solder compositions

Mixer for producing and solidifying an alloy in a subterranean reservoir

High Impact Solder Toughness Alloy

Thermoelectric conversion material

Writing instrument and related production method

Formation of P-type filled skutterudite by ball-milling and thermo-mechanical processing

Method of manufacturing a manganese bismuth alloy

METHOD OF PRODUCING ALLOY NANOPARTICLES

Core material, semiconductor package, and forming method of bump electrode

Thermoelectric conversion element and method of manufacturing the same

Systems and methods of fabrication and use of NbFeSb P-type half-heusler thermoelectric materials

Stable nanocrystalline ordering alloy systems and methods of identifying same

P-type skutterudite thermoelectric material, method for preparing the same, and thermoelectric device including the same

SINTERED COMPACT TARGET AND METHOD OF PRODUCING SINTERED COMPACT

SOLUTION PHASE SYNTHESIS OF HIGHLY PROCESSIBLE NANOCRYSTALLINE LiZnP AND SIMILAR TERNARY SEMICONDUCTORS

Hybrid lead-free solder wire

Turbomachine shaft and journal bearing assembly

Solid metal alloy

SOLDER PASTE

Conductive particle, and connection material, connection structure, and connecting method of circuit member

Connection structure and connecting method of circuit member

Hot-pressed and deformed magnet comprising nonmagnetic alloy and method for manufacturing same

Connecting method of circuit member

High Impact Solder Toughness Alloy

Hybrid lead-free solder wire

Thermoelectric conversion material and method of production thereof

Electrode, preparation method therefor, and uses thereof

High activity Pt—Bi catalyst for dimethyl ether electro-oxidation

Compound semiconductor and manufacturing method thereof

Piston with sealed cooling gallery containing a thermally conductive composition

Imprinting Metallic Substrates at Hot Working Temperatures

Method for manufacturing an Sn:Sb intermetallic phase

High Impact Solder Toughness Alloy

Plated steel sheet

Process for producing bonded body and process for producing power module substrate

Lead-free solder compositions

GaSbGe phase change memory materials

Solder material and connected structure

Bonding material, bonding method and semiconductor device for electric power

Selective restoration of fluid communication between wellbore intervals using degradable substances

Thermoelectric compositions and methods of fabricating high thermoelectric performance MgAgSb-based materials

Sintered magnet based on MnBi having improved heat stability and method of preparing the same

Sputtering target of sintered Sb—Te-based alloy

Metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same

Thermoelectric conversion material, thermoelectric conversion element, thermoelectric conversion module, thermoelectric generator, thermoelectric conversion system, and method of manufacturing thermoelectric conversion material

Bi-BASED SOLDER ALLOY, METHOD OF BONDING ELECTRONIC COMPONENT USING THE SAME, AND ELECTRONIC COMPONENT-MOUNTED BOARD

BISMUTH-ANTIMONY ANODES FOR LITHIUM OR SODIUM ION BATTERIES

HIGH IMPACT SOLDER TOUGHNESS ALLOY

Synthesis of ferromagnetic manganese-bismuth nanoparticles using a manganese-based ligated anionic-element reagent complex (Mn-LAERC) and formation of bulk MnBi magnets therefrom

ANISOTROPIC COMPLEX SINTERED MAGNET COMPRISING MnBi WHICH HAS IMPROVED MAGNETIC PROPERTIES AND METHOD OF PREPARING THE SAME

Method of producing low alpha-ray emitting bismuth, and low alpha-ray emitting bismuth

Solder paste

Solder paste

Apparatus for use in well abandonment

REACTIVE POWDER, BONDING MATERIAL USING REACTIVE POWDER, BONDED BODY BONDED WITH BONDING MATERIAL AND METHOD FOR PRODUCING BONDED BODY

Lead-Free Solder Alloy

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Silver-bismuth powder, conductive paste and conductive film

MNBI-BASED MAGNETIC SUBSTANCE, PREPARATION METHOD THEREOF, MNBI-BASED SINTERED MAGNET AND PREPARATION METHOD THEREOF

Sliding member and sliding bearing

Sliding member and sliding bearing

METHOD OF MANUFACTURING THERMOELECTRIC CONVERSION MATERIAL

Thermoelectric conversion material

Sb nanocrystals or Sb-alloy nanocrystals for fast charge/discharge Li- and Na-ion battery anodes

System and method of using heat sources and alloys in down-hole applications

Method for sorting a collection of bodies comprising cemented carbide bodies and non-cemented carbide bodies

Apparatus for use in well abandonment

Method of forming solder bump, and solder bump

Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component

Soldering method using a low-temperature solder paste

NbFeSb based half-heusler thermoelectric materials and methods of fabrication and use

Solder alloy for die bonding

(Zr,Hf)NiSb-based n-type thermoelectric conversion material

Mixed alloy solder paste

Mixed alloy solder paste

Method of production of core/shell type nanoparticles, method of production of sintered body using that method, and thermoelectric conversion material produced by that method

High-temperature lead-free solder alloy

Method of soldering electronic part

N-type thermoelectric material

SOLDER ALLOY

SINTERED MAGNET AND PROCESS FOR PRODUCTION THEREOF

Disk having an electrical connection element

Layer For An Electrical Contact Element, Layer System And Method For Producing A Layer

Stable binary nanocrystalline alloys and methods of identifying same

Boron doped manganese antimonide as a useful permanent magnet material

Synthesis and annealing of manganese bismuth nanoparticles

METAL DEPOSITION USING ORGANIC VAPOR PHASE DEPOSITION (VPD) SYSTEM

Sliding member

Formation of p-type filled skutterudite by ball-milling and thermo-mechanical processing

Stable nanocrystalline ordering alloy systems and methods of identifying same

Solid metal alloy

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

Method for producing a pane having an electrical connection element

CONSTRUCTING BISMUTH ANTIMONY THIN FILMS WITH ANISOTROPIC SINGLE-DIRAC CONES

Photonic sintering of polymer thick film conductor compositions

Pb-free solder paste

Thermoelectric material and method of preparing the thermoelectric material

Liquid metal ion source and secondary ion mass spectrometric method and use thereof

Thermoelectric material, method for fabricating the same, and thermoelectric module employing the same

Leadless brass alloy excellent in stress corrosion cracking resistance

Sn—Sb—Ni ternary compound and method for forming the same

Bi—Sn based high-temperature solder alloy

Active material for rechargeable battery

Pb-free solder alloy

CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

THERMOELECTRIC ALLOY MATERIAL AND THERMOELECTRIC ELEMENT

Bi—Al—Zn—based Pb-free solder alloy

Half-Heusler Alloys with Enhanced Figure of Merit and Methods of Making

Disk with an electrical connection element

SOLDER INK AND ELECTRONIC DEVICE PACKAGE USING SAME

Disk with an electrical connection element

SOLDER PASTE

Sb-Te-Based Alloy Sintered Compact Sputtering Target

Active material for rechargeable battery

Self healing lithium-ion battery negative electrodes, product including same, and methods of making and using same

INJECTION METHOD FOR HOLLOW PRODUCTS, ITS FUSIBLE CORE AND THE METHOD FOR MAKING THE FUSIBLE CORE THEREOF

Solder, soldering method, and semiconductor device

Alkaline earth filled nickel skutterudite antimonide thermoelectrics

CONDUCTIVE ADHESIVE TAPE

Hydrogen gas generating member and hydrogen gas producing method therefor

Zintl phases for thermoelectric applications

Degradable compositions, apparatus comprising same, and methods of use

LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP

Cream solder and method of soldering electronic part

Thermoelectric material, thermoelectric element, thermoelectric module and method for manufacturing the same

P-type thermoelectric materials, a process for their manufacture and uses thereof

Thermoelectric material and composites made from thermoelectric material and a method for fabricating thereof

Mixed alloy solder paste

Process for producing thermoelectric semiconductor alloy, thermoelectric conversion module, thermoelectric power generating device, rare earth alloy, producing process thereof, thermoelectric conversion material, and thermoelectric conversion system using filled skutterudite based alloy

Synthesis of High-Efficiency Thermoelectric Materials

Joint structure, joining material, and method for producing joining material containing bismuth

BONDING COMPOSITION

SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME

METHOD FOR PRODUCING A THERMOELECTRIC INTERMETALLIC COMPOUND

Sintered Compact Target and Method of Producing Sintered Compact

Arsenic-containing variable resistance materials

Joint structure and electronic component

BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE

Thermoelectric conversion material and thermoelectric conversion module

Slide member

Slide member

Electronic apparatus produced using lead-free bonding material for soldering

Liquid metal ion source, secondary ion mass spectrometer, secondary ion mass spectrometric analysis method and use thereof

Thermoelectric converter and method of manufacturing same

Method of Producing Sintered Compact, Sintered Compact, Sputtering Target Formed from the same, and Sputtering Target-Backing Plate Assembly

THERMOELECTRIC CONVERSION MODULE, AND HEAT EXCHANGER, THERMOELECTRIC TEMPERATURE CONTROL DEVICE AND THERMOELECTRIC GENERATOR EMPLOYING THE SAME

Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit Board

USE OF THERMOELECTRIC MATERIALS FOR LOW TEMPERATURE THERMOELECTRIC PURPOSES

Composition and methods of preparation of target material for producing radionuclides

THERMOELECTRIC MATERIAL INCLUDING A FILLED SKUTTERUDITE CRYSTAL STRUCTURE

Anisotropic conductive material

Lead-free solder paste and its use

Sb-Te alloy sintered compact target and manufacturing method thereof

Low-pressure mercury vapor discharge lamp

Lead-free low-temperature solder

Sb-Te base alloy sinter sputtering target

Leadless brass alloy excellent in stress corrosion cracking resistance

Plain bearing composite material, use thereof and production methods therefor

Bonding material, electronic component, bonding structure and electronic device

Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof

Electrical connector

P-type thermoelectric materials, a process for their manufacture and uses thereof

HYDROGEN GENERATING METHOD, HYDROGEN GENERATING ALLOY AND METHOD FOR PRODUCING HYDROGEN GENERATING ALLOY

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Electrical connector

Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead

THERMOELECTRIC MATERIAL AND PROCESS OF PRODUCING THE SAME

LEAD-FREE SOFT SOLDER

Sprinkler head

Slide bearing composite material

Sb-Te alloy powder for sintering, sintered compact sputtering target obtained by sintering said powder, and manufacturing method of Sb-Te alloy powder for sintering

Process for manufacturing devices carrying at least one active material by deposition of a low-melting alloy

InSb NANOPARTICLE

Sliding material and a method for its manufacture

CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIAL

Plain bearing

MODIFIED SOLDER ALLOYS FOR ELECTRICAL INTERCONNECTS, METHODS OF PRODUCTION AND USES THEREOF

Melting temperature adjustable metal thermal interface materials and application thereof

Degradable whipstock apparatus and method of use

Regenerator Material, Regenerator and Regenerative Cryocooler

Bismuth-zinc-mercury amalgam, fluorescent lamps, and related methods

Sb-Te alloy sintered compact sputtering target

Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium

Solder composition having dispersoid particles for increased creep resistance

Electrical Connector For A Window Pane Of A Vehicle

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Degradable compositions, apparatus comprising same, and method of use

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same

Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof

Thermoelectric material, thermoelectric element, thermoelectric module and methods for manufacturing the same

Bismuth-indium amalgam, fluorescent lamps, and methods of manufacture

Process for producing thermoelectric semiconductor alloy, thermoelectric conversion module, thermoelectric power generating device, rare earth alloy, producing process thereof, thermoelectric conversion material, and thermoelectric conversion system using filled skutterudite based alloy

Negative electrode active material and nonaqueous electrolyte secondary battery

Vehicular glazing panel

Sliding member

Solder composition

Filled skutterudite-based alloy, production method thereof and thermoelectric conversion device fabricated using the alloy

Doped alloys for electrical interconnects, methods of production and uses thereof

InSb nanoparticle

Low melting-point solders, articles made thereby, and processes of making same

Solder composition, connecting process with soldering, and connection structure with soldering

Solder composition, connecting process with soldering, and connection structure with soldering

Thermoelectric properties by high temperature annealing

Cathode for an organic electronics component

Thermoelectric material and thermoelectric module using the thermoelectric material

Lead-free soft solder, especially electronics solder

Lead-free solder composition for substrates

[SOLDER COMPOSITION]

Metal-alloy biphasic systems, and powders and methods for making metal-alloy biphasic systems