Corrosion-resistant coated copper and method for making the same

Technique for increasing the compliance of lead-free solders containing silver

LOW MELTING TEMPERATURE COMPLIANT SOLDERS

Lead-free solder ball

Electrode wire material and solar cell having connection lead wire formed of the wire material

Nonaqueous electrolyte battery having a LaCoSn type crystal structure

Technique for increasing the compliance of tin-indium solders

Multilayer solder article

Solder composition

Electrode material for anode of rechargeable lithium battery, electrode structural body using said electrode material, rechargeable lithium battery using said electrode structural body, process for producing said electrode structural body, and process for producing said rechargeable lithium battery

Solder composition for electronic devices

Temperature fuse element, temperature fuse and battery using the same

Corrosion-resistant fuel tank

Alloy compositions for lithium ion batteries

Current fuse and method of making the current fuse

Current fuse and method of making the current fuse

Lead-free solder and soldered article

Negative electrode active material and nonaqueous electrolyte secondary battery

Whisker-free electronic structures

ANODE ACTIVE MATERIAL AND BATTERY

Tin alloy solder compositions

Surface reactor

Vehicular glazing panel

Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure

Pb-free solder alloy compositions comprising essentially Tin(Sn), Silver(Ag), Copper(Cu), and Phosphorus(P)

Sn—Zn lead-free solder alloy, its mixture, and soldered bond

Contact surfaces for electrical contacts and method for producing the same

Sn-Zn lead-free solder alloy, and solder junction portion

Lead-free solder system

Recording film for use in optical information recording medium, optical information recording medium, and sputtering target

Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof

Solder composition

Method of forming composite solder by cold compaction and composite solder

Anode active material and battery using the same

Doped alloys for electrical interconnects, methods of production and uses thereof

Electrode material, method of manufacturing the electrode material, electrode, and nonaqueous electrolyte battery

Lead-free solder alloy

Lead-free solder, and a lead-free joint

Pb-free solder alloy

Solders

Electroplated metals with silvery-white appearance and method of making

Electroplated metals with silvery-white appearance and method of making

Whisker-free lead frames

Low melting-point solders, articles made thereby, and processes of making same

Tin plating

Soldering alloy

Method for making nano-scale lead-free solder

Lead-free solder alloy and electronic component using this lead-free solder alloy

Soldering method and solder joints formed therein

Lead-free solder ball

Plain bearing and method of manufacturing the same

Electrode material for anode of rechargeable lithium battery, electrode structural body using said electrode material, rechargeable lithium battery using said electrode structural body, process for producing said electrode structural body, and process for producing said rechargeable lithium battery

Tin-silver coatings

Resin-coated steel plate and press molded can using the same

Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same

Lead-free solder balls and method for the production thereof

Anti-tombstoning lead free alloys for surface mount reflow soldering

Pb-free solder alloy, and solder material and solder joint using same

Lead-free solder composition for substrates

Method for forming plating film

Current fuse and method of making the current fuse

[SOLDER COMPOSITION]

Tin/indium lead-free solders for low stress chip attachment

Method for increasing the effectiveness of a component of a material

Metal-alloy biphasic systems, and powders and methods for making metal-alloy biphasic systems

Superelastic tire

Self healing lead, tin, and their alloys, and solders, incorporating shape memory alloys, reactive particles and hollow vascular networks

Tin-indium based low temperature solder alloy

Methods for bonding substrates with transient liquid phase bonds by spark plasma sintering