Transient liquid phase sinter pastes and application and processing methods relating thereto

Semiconductor device and method of manufacturing semiconductor device

Laser subassembly metallization for heat assisted magnetic recording

SOLDER ALLOY

Method For Manufacturing High Purity Tin, Electrowinning Apparatus For High Purity Tin And High Purity Tin

Tin-based sliding bearing alloy

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Intermetallic nanoparticles

Lead-free solder alloy and in-vehicle electronic circuit

Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part

Solder material and bonded structure

Bonding body, power module substrate, and heat-sink-attached power module substrate

Solder alloy and joint thereof

LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

Electroconductive bonding material

Lead-free solder and electronic component built-in module

Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure

Aluminum-tin paste and its use in manufacturing solderable electrical conductors

Metallic composite material for a sliding bearing comprising a metallic support layer

Flux and solder paste

Pb-free solder alloy

SN-AG-CU-BASED SOLDER POWDER AND SOLDER PASTE USING SAID POWDER

Lead-free solder alloy for printed circuit board assemblies for high-temperature environments

LEAD-FREE SOLDER ALLOY

Power module

Power module

Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component

Solder alloy, solder paste, and electronic circuit board

Electrical devices with solder dam

Electronic component metal material and method for manufacturing the same

Mixed alloy solder paste

Solder paste, joining method using the same and joined structure

Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Lead-free and antimony-free tin solder reliable at high temperatures

Method of soldering an electronic component with a high lateral accuracy

Lead-free solder ball

Multi-layered plain bearing

Core ball, solder paste, formed-solder, flux-coated core ball and solder joint

Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

Method of soldering electronic part

SOLDER ALLOY

Solder alloy, solder paste, and electronic circuit board

Solder joint material and method of manufacturing the same, soldering member and solar cell module

Solder ball and electronic member

Solder alloy, solder paste, and electronic circuit board

Coating process and coating for press-fit contact

THERMOELECTRIC CONVERSION MATERIAL AND THERMOELECTRIC CONVERSION MODULE USING THE SAME

Electric contact and socket for electric parts

Stable binary nanocrystalline alloys and methods of identifying same

Electrodes and electrochemical cells employing metal nanoparticles synthesized via a novel reagent

Synthesis of metal nanoparticles

Solder alloy

Electric contact and socket for electrical part

METAL DEPOSITION USING ORGANIC VAPOR PHASE DEPOSITION (VPD) SYSTEM

Metallic material for electronic components, and connector terminals, connectors and electronic components using same

Lead-free solder alloy

Sn-Cu-based lead-free solder alloy

Cream solder composition

Method for producing microparticles

Sliding member

Bonded body and semiconductor module

Intermetallic M—Sn(M=Fe, Cu, Co, Ni) compound and a method of synthesis thereof

Sintered bearing for motor-type fuel pump with superior corrosion resistance, wear resistance and conformability

Materials for near field transducers, near field tranducers containing same, and methods of forming

Materials for near field transducers and near field transducers containing same

Negative electrode active material for electric device, negative electrode for electric device and electric device

Materials for near field transducers and near field transducers containing same

Joining method, joint structure and method for producing the same

Method and apparatus for manufacturing lead wire for solar cell

Negative electrode active material for electric device

Stable nanocrystalline ordering alloy systems and methods of identifying same

Joining method, method for producing electronic device and electronic part

Process for producing high-purity tin

Metal material for electronic component and method for manufacturing the same

Negative electrode active material for electric device

Thick sintered polycrystalline diamond and sintered jewelry

Method for producing a thermoelectric object for a thermoelectric conversion device

Solid metal alloy

Copper alloy sheet and method for manufacturing copper alloy sheet

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

Copper alloy sheet and method for manufacturing copper alloy sheet

Solder powder, and solder paste using solder powder

Method for producing a pane having an electrical connection element

Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder

Lead-free solder alloy

Glazing with a soldered connector

ECOLOGICAL AMMUNITION

Negative electrode active material for electric device

Lead-free solder ball

Method of producing tin emitted low alpha radiation by using vacuum refining

Amalgam balls having an alloy coating

Photonic sintering of polymer thick film conductor compositions

Lead-free solder alloy

Solder alloy

Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method

Amalgam spheres for energy-saving lamps and their production

Solder alloy

Lead-free solder alloy for vehicle glass

Solder paste for bonding micro components

Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part

Additives for grain fragmentation in Pb-free Sn-based solder

Mounted structure and manufacturing method of mounted structure

Lead-free solder flux and lead-free solder paste

Connection structure

Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body

Si based negative electrode material

Conductive material, bonding method using the same, and bonded structure

Negative electrode material for a nonaqueous electrolyte secondary battery and a method for its manufacture

Soldering paste and flux

Bonding material for semiconductor devices

Lead-free solder paste

CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

Intermetallic nanoparticles

White Metal Babbitt for Rolling Mill Bushing

ACTIVE SOLDER

Low α-dose tin or tin alloy, and method for producing same

Metal tape material and interconnector for solar module current collection

Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device

MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability

Method for producing lead-free copper—bismuth alloys and ingots useful for same

Disk with an electrical connection element

Solder alloys and arrangements

SOLDER INK AND ELECTRONIC DEVICE PACKAGE USING SAME

Negative electrode material for nonaqueous electrolyte secondary batteries and manufacturing method thereof

Method of making tin-based alloys for negative electrode compositions

Disk with an electrical connection element

SOLDER PASTE

FLUX FOR SOLDER PASTE, AND SOLDER PASTE

Electronic component

Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material

Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticles

ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE

Self healing lithium-ion battery negative electrodes, product including same, and methods of making and using same

Solder ball for semiconductor packaging and electronic member using the same

Saw wire

Solder, soldering method, and semiconductor device

Wiring board and method for manufacturing the same

LOW SILVER SOLDER ALLOY AND SOLDER PASTE COMPOSITION

CONDUCTIVE ADHESIVE TAPE

Solder paste, joining method using the same and joined structure

Wafer-level interconnect for high mechanical reliability applications

Mechanochemical synthesis and thermoelectric properties of magnesium silicide and related alloys

WEAR RESISTANT LEAD FREE ALLOY SLIDING ELEMENT METHOD OF MAKING

Hydrogen gas generating member and hydrogen gas producing method therefor

METHOD FOR PREPARING PLASTIC PARTICLES COATED WITH METAL

SLIDE MEMBER

SLIDE MEMBER

ELECTRODE COMPOSITIONS AND METHODS

LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP

Cream solder and method of soldering electronic part

Metal-carbon compositions

Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder

Junction body, semiconductor module, and manufacturing method for junction body

COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES

LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS

MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, COATING FILM FORMING METHOD AND SOLDERING METHOD

SOLDER ALLOY

MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, COATING FILM FORMING METHOD AND SOLDERING METHOD

Flux composition and soldering paste composition

Reducing dross method of lead-free solder

CLATHRATE COMPOUNDS

Low melting temperature alloys with magnetic dispersions

Solder alloy and semiconductor device

Lead-free solder and electronic component built-in module

SOLDER, ELECTRONIC PART, AND METHOD OF FABRICATING ELECTRONIC PART

Thick sintered polycrystalline diamond and sintered jewelry

Anti-friction coating

Solder structure, method for forming the solder structure, and semiconductor module including the solder structure

Porous tin particles and the preparation for the same

Soldering material and electronic component assembly

Lead-free solder connection structure and solder ball

Tin-indium based lead-free solders with zinc addition

BONDING COMPOSITION

Power semiconductor device and manufacturing method therefor

Lead-free solder

THERMAL FUSE ELEMENT, THERMAL FUSE AND BATTERY USING THE THERMAL FUSE

Solder preform and a process for its manufacture

METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE

PARTICULATE TIN POWER AND MANUFACTURING METHOD THEREOF

Lead-free solder alloy for printed circuit board assemblies for high-temperature environments

Rare earth metal-based permanent magnet

BEARING

Method of making tin-based alloys for negative electrode compositions

Indium-containing lead-free solder for vehicle-mounted electronic circuits

Method of regulating nickel concentration in lead-free solder containing nickel

Lead-free solder alloy

ALLOY SOLDER AND ALLOY SOLDER MANUFACTURING METHOD

Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder

LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTURE

Process for producing metallic-nanoparticle inorganic composite and metallic-nanoparticle inorganic composite

Lead free solder alloy

Active material composition for the negative electrode of a lithium-ion accumulator

Solder joint

Sn based alloys with fine compound inclusions for NbSn superconducting wires

Slide member

Electronic apparatus produced using lead-free bonding material for soldering

LEAD-FREE SOLDER ALLOY

Pb-Free Sn-Ag-Cu-Mn Solder

Additives for grain fragmentation in Pb-free Sn-based solder

THERMOELECTRIC CONVERSION MODULE, AND HEAT EXCHANGER, THERMOELECTRIC TEMPERATURE CONTROL DEVICE AND THERMOELECTRIC GENERATOR EMPLOYING THE SAME

SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT USING SAME

Method For Bonding Of Concentrating Photovoltaic Receiver Module To Heat Sink Using Foil And Solder

Hot-dip Sn-Zn coated steel sheet having excellent corrosion resistance

METHOD FOR OXIDE BONDING USING SOLDER ALLOY

Amalgam spheres for energy-saving lamps and the manufacture thereof

Plain bearing

ANTI-TOMBSTONING LEAD FREE ALLOYS FOR SURFACE MOUNT REFLOW SOLDERING

PB-FREE SOLDER ALLOY

Member formed with coating film having tin as its main component, coating film forming method and soldering method

Lead-free jointing material and method of producing the same

Lead-Free Solder with Improved Properties at Temperatures >150°C

MODULE INCLUDING A STABLE SOLDER JOINT

TIN ALLOY SOLDER COMPOSITION

Anisotropic conductive material

ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES

Metal films, methods for production thereof, methods for production of laminated electronic components, and laminated electronic components

Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member

Whisker-free lead frames

Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath

ELECTRODE WIRE MATERIAL AND SOLAR CELL HAVING CONNECTION LEAD WIRE FORMED OF THE WIRE MATERIAL

Plain bearing composite material, use thereof and production methods therefor

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT

Cu-Zn alloy strip superior in thermal peel resistance of Sn plating and Sn plating strip thereof

Method for increasing the effectiveness of a component of a material

Lead-free solder alloy

Method of surface treatment for the inhibition of whiskers

Solder paste

Disk drive device

HYDROGEN GENERATING METHOD, HYDROGEN GENERATING ALLOY AND METHOD FOR PRODUCING HYDROGEN GENERATING ALLOY

SOLDER ALLOY FOR OXIDE BONDING

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

TIN-SILVER COATINGS

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS

Solder alloy, solder ball and electronic member having solder bump

Lead-free solder alloy and electoronic component using this lead-free solder alloy

Electrical connector

PB FREE SOLDER ALLOY

ELECTRODE COMPOSITIONS AND METHODS

High-Purity Tin or Tin Alloy and Process for Producing High-Purity Tin

Slide bearing composite material

Plated material and electric and electronic parts using the plated material

Surface Treated Stainless Steel Sheet for Automobile Fuel Tank and for Automobile Fuel Pipe with Excellent Salt Corrosion Resistance and Weld Zone Reliability and Surface Treated Stainless Steel Welded Pipe for Automobile Fuel Inlet Pipe Excellent in Pipe Expandability

Hot-Dip Sn-Zn Coated Steel Sheet Having Excellent Corrosion Resistance

RECORDING LAYER FOR OPTICAL INFORMATION RECORDING MEDIUM, OPTICAL INFORMATION RECORDING MEDIUM, AND SPUTTERING TARGET FOR OPTICAL INFORMATION RECORDING MEDIUM

CORROSION-RESISTANT COATED COPPER AND METHOD FOR MAKING THE SAME

SOLDER ALLOYS

Bearing for motorized fuel pump

Lead-free solder alloy

Sn-Containing Heavy-Duty Material Composition, Method for the Production of a Heavy-Duty Coating, and Use Thereof

Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In

Solder alloy

SiC crystal and semiconductor device

Solder alloy and glass bonded body using the same

Solder preform and a process for its manufacture

Thermal interface materials

Plain bearing and method of manufacturing the same

Solder Composition

SOLDER ALLOY

Solder alloy

Intermetallic electrodes for lithium batteries

Plain bearing

Three-dimensional wafer stacking with vertical interconnects

Flux for Lead-Free Solder and Solder Paste

Degradable whipstock apparatus and method of use

Wafer-level interconnect for high mechanical reliability applications

Wireless technique for microactivation

Lead-free solder and soldered article

Spintronics Material and Tmr Device

Lead-free solder alloy

Solder Composition and Solder Layer Forming Method Using the Same

Electrode for electrolysis and method for producing aqueous solution of quaternary ammonium hydroxide using the same

Thick film conductor case compositions for LTCC tape

Solder, and mounted components using the same

Corrosion-resistant coated copper and method for making the same

Method of forming Sn-Ag-Cu ternary alloy thin-film on base material

Pb-free Sn-based material, wiring conductor, terminal connecting assembly, and Pb-free solder alloy

SOLDER ALLOYS

Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same

SEALING MATERIAL, IMAGE DISPLAY DEVICE USING THE SEALING MATERIAL, METHOD FOR MANUFACTURING THE IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY DEVICE MANUFACTURED BY THE MANUFACTURING METHOD

Electronic device with lead-free metal thin film formed on the surface thereof

Lead-Free Solder

Wiring conductor, method for fabricating same, terminal connecting assembly, and Pb-free solder alloy

Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium

Electrical Connector For A Window Pane Of A Vehicle

Whiskerless plated structure and plating method

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

LEAD-FREE SOLDER, SOLDER JOINT PRODUCT AND ELECTRONIC COMPONENT

Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method

Lead-free solder with low copper dissolution

Soldering method

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same

Continuous Metal Matrix Composite Consolidation

Tin-silver coatings

Lead-free solder alloys and solder joints thereof with improved drop impact resistance

Window glass for vehicle

SOLDER ALLOY, SOLDER BALL, AND SOLDER JOINT USING THE SAME

Solders

SOLDER COMPOSITION AND SOLDERING STRUCTURE