ClassID:

120017

C23C14/046 - page 2 - CPC Classification

Classification description:

Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material; Coating on selected surface areas, e.g. using masks Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates

Recent Application in this class:
#301
20060169582
2006-08-03

Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron

#302
20060169578
2006-08-03

Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas

#303
20060169576
2006-08-03

Physical vapor deposition plasma reactor with VHF source power applied through the workpiece

#304
20060150909
2006-07-13

Multi-place coating apparatus and process for plasma coating

#305
20060147679
2006-07-06

Method for filtering particles from a fluid

#306
20060105550
2006-05-18

Method of depositing material on a substrate for a device

#307
20060090705
2006-05-04

Apparatus for fabricating display device

#308
20060086320
2006-04-27

Method and device for plasma treating workpieces

#309
20060076235
2006-04-13

Magnetron sputtering apparatus and method for depositing a coating using same

#310
20060076231
2006-04-13

Method for magnetron sputter deposition

#311
20060073700
2006-04-06

Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece

#312
20060073283
2006-04-06

Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece

#313
20060070573
2006-04-06

Apparatus and method for coating an article

#314
20060057843
2006-03-16

Methods and apparatus for forming barrier layers in high aspect ratio vias

#315
20060051826
2006-03-09

Method and device for the incorporating a compound in the pores of a porous material and uses thereof

#316
20060040065
2006-02-23

Method for the surface activation on the metalization of electronic devices

#317
20060019039
2006-01-26

Plasma immersion ion implantation reactor having multiple ion shower grids

#318
20060016396
2006-01-26

Apparatus for depositing a thin film on a substrate

#319
20050282369
2005-12-22

Enhanced step coverage of thin films on patterned substrates by oblique angle PVD

#320
20050281985
2005-12-22

Isotropic glass-like conformal coatings and methods for applying same to non-planar substrate surfaces at microscopic levels

#321
20050279624
2005-12-22

Highly ionized PVD with moving magnetic field envelope for uniform coverage of feature structure and wafer

#322
20050277295
2005-12-15

Coating process for patterned substrate surfaces

#323
20050266682
2005-12-01

Methods and apparatus for forming barrier layers in high aspect ratio vias

#324
20050266173
2005-12-01

Method and apparatus of distributed plasma processing system for conformal ion stimulated nanoscale deposition process

#325
20050263390
2005-12-01

Multi-step process for forming a metal barrier in a sputter reactor

#326
20050257744
2005-11-24

Apparatus for directing plasma flow to coat internal passageways

#327
20050255700
2005-11-17

Controlled multi-step magnetron sputtering process

#328
20050255691
2005-11-17

Self-ionized and inductively-coupled plasma for sputtering and resputtering

#329
20050255242
2005-11-17

Apparatus and method for high rate uniform coating, including non-line of sight

#330
20050252765
2005-11-17

Method and apparatus for forming a barrier layer on a substrate

#331
20050233077
2005-10-20

Method and device for plasma treating workpieces

#332
20050227002
2005-10-13

Method and device for the plasma treatment of workpieces

#333
20050223988
2005-10-13

Coating device comprising a conveying device

#334
20050211545
2005-09-29

Ionized physical vapor deposition (iPVD) process

#335
20050208767
2005-09-22

Method of depositing a tantalum nitride/tantalum diffusion barrier layer system

#336
20050208211
2005-09-22

Component comprising submicron hollow spaces

#337
20050205414
2005-09-22

Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma

#338
20050205411
2005-09-22

[PHYSICAL VAPOR DEPOSITION PROCESS AND APPARATUS THEREFOR]

#339
20050199491
2005-09-15

Shields usable with an inductively coupled plasma reactor

#340
20050189217
2005-09-01

Method and apparatus for forming a barrier layer on a substrate

#341
20050188845
2005-09-01

Hydrogen-permeable membrane and process for production thereof

#342
20050181177
2005-08-18

Isotropic glass-like conformal coatings and methods for applying same to non-planar substrate surfaces at microscopic levels

#343
20050173239
2005-08-11

End point detection for sputtering and resputtering

#344
20050164028
2005-07-28

Getter metal alloy coating and device and method for the production thereof

#345
20050146036
2005-07-07

Method of forming a metal silicide layer on non-planar-topography polysilicon

#346
20050139948
2005-06-30

Integration of barrier layer and seed layer

#347
20050126904
2005-06-16

Apparatus and process for physical vapor deposition

#348
20050115827
2005-06-02

Multi-cathode ionized physical vapor deposition system

#349
20050085068
2005-04-21

Method of depositing a metal seed layer on semiconductor substrates

#350
20050056536
2005-03-17

Multi-step magnetron sputtering process

#351
20050029090
2005-02-10

Method and apparatus for ionization film formation

#352
20050020080
2005-01-27

Method of depositing a diffusion barrier layer and a metal conductive layer

#353
20050006232
2005-01-13

[IONIZED PHYSICAL VAPOR DEPOSITION PROCESS AND APPARATUS THEREOF]

#354
20050006222
2005-01-13

Self-ionized and inductively-coupled plasma for sputtering and resputtering

#355
13619077
2015-08-25

Conformal films on semiconductor substrates