120017 ⎘
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material; Coating on selected surface areas, e.g. using masks Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron
#302Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas
#303Physical vapor deposition plasma reactor with VHF source power applied through the workpiece
#304Multi-place coating apparatus and process for plasma coating
#305Method for filtering particles from a fluid
#306Method of depositing material on a substrate for a device
#307Apparatus for fabricating display device
#308Method and device for plasma treating workpieces
#309Magnetron sputtering apparatus and method for depositing a coating using same
#310Method for magnetron sputter deposition
#311Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece
#312Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece
#313Apparatus and method for coating an article
#314Methods and apparatus for forming barrier layers in high aspect ratio vias
#315Method and device for the incorporating a compound in the pores of a porous material and uses thereof
#316Method for the surface activation on the metalization of electronic devices
#317Plasma immersion ion implantation reactor having multiple ion shower grids
#318Apparatus for depositing a thin film on a substrate
#319Enhanced step coverage of thin films on patterned substrates by oblique angle PVD
#320Isotropic glass-like conformal coatings and methods for applying same to non-planar substrate surfaces at microscopic levels
#321Highly ionized PVD with moving magnetic field envelope for uniform coverage of feature structure and wafer
#322Coating process for patterned substrate surfaces
#323Methods and apparatus for forming barrier layers in high aspect ratio vias
#324Method and apparatus of distributed plasma processing system for conformal ion stimulated nanoscale deposition process
#325Multi-step process for forming a metal barrier in a sputter reactor
#326Apparatus for directing plasma flow to coat internal passageways
#327Controlled multi-step magnetron sputtering process
#328Self-ionized and inductively-coupled plasma for sputtering and resputtering
#329Apparatus and method for high rate uniform coating, including non-line of sight
#330Method and apparatus for forming a barrier layer on a substrate
#331Method and device for plasma treating workpieces
#332Method and device for the plasma treatment of workpieces
#333Coating device comprising a conveying device
#334Ionized physical vapor deposition (iPVD) process
#335Method of depositing a tantalum nitride/tantalum diffusion barrier layer system
#336Component comprising submicron hollow spaces
#337Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma
#338[PHYSICAL VAPOR DEPOSITION PROCESS AND APPARATUS THEREFOR]
#339Shields usable with an inductively coupled plasma reactor
#340Method and apparatus for forming a barrier layer on a substrate
#341Hydrogen-permeable membrane and process for production thereof
#342Isotropic glass-like conformal coatings and methods for applying same to non-planar substrate surfaces at microscopic levels
#343End point detection for sputtering and resputtering
#344Getter metal alloy coating and device and method for the production thereof
#345Method of forming a metal silicide layer on non-planar-topography polysilicon
#346Integration of barrier layer and seed layer
#347Apparatus and process for physical vapor deposition
#348Multi-cathode ionized physical vapor deposition system
#349Method of depositing a metal seed layer on semiconductor substrates
#350Multi-step magnetron sputtering process
#351Method and apparatus for ionization film formation
#352Method of depositing a diffusion barrier layer and a metal conductive layer
#353[IONIZED PHYSICAL VAPOR DEPOSITION PROCESS AND APPARATUS THEREOF]
#354Self-ionized and inductively-coupled plasma for sputtering and resputtering
#355Conformal films on semiconductor substrates