120087 ⎘
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating; Sputtering by application of a magnetic field, e.g. magnetron sputtering; Introduction of auxiliary energy into the plasma Inductive energy
APPARATUS AND METHOD OF DAMAGE MITIGATION AND STEP COVERAGE ENHANCEMENT
#2Semiconductor Device, Method and Machine of Manufacture
#3Top magnets for decreased non-uniformity in PVD
#4Method and apparatus for use in generating plasma
#5Semiconductor device, method and machine of manufacture
#6Semiconductor device, method and machine of manufacture
#7SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESPUTTERING
#8Movable structure and film forming apparatus
#9Ionized physical vapor deposition (IPVD) apparatus and method for an inductively coupled plasma sweeping source
#10PLASMA PRODUCING APPARATUS
#11Method of manufacturing a magnetic film having high coercivity for use as a hot seed in a magnetic write head
#12Copper wiring structure forming method
#13Self-ionized and inductively-coupled plasma for sputtering and resputtering
#14Method for forming copper wiring
#15High coercivity magnetic film for use as a hot seed in a magnetic write head and method to grow it
#16Plasma processing apparatus
#17Mounting table structure and plasma film forming apparatus
#18CREATION OF MAGNETIC FIELD (VECTOR POTENTIAL) WELL FOR IMPROVED PLASMA DEPOSITION AND RESPUTTERING UNIFORMITY
#19GAP FILL IMPROVEMENT METHODS FOR PHASE-CHANGE MATERIALS
#20Sputtering apparatus and sputtering method
#21Thin-film forming sputtering system
#22Method and apparatus for improved high power impulse magnetron sputtering
#23Sputtering apparatus
#24Electromagnet array in a sputter reactor
#25GAP FILL IMPROVEMENT METHODS FOR PHASE-CHANGE MATERIALS
#26Confining Magnets In Sputtering Chamber
#27METHOD OF DEPOSITING METAL-CONTAINING FILMS BY INDUCTIVELY COUPLED PHYSICAL VAPOR DEPOSITION
#28SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESPUTTERING
#29CHALCOGENIDE TARGET AND METHOD
#30RESPUTTERED COPPER SEED LAYER
#31Self-ionized and inductively-coupled plasma for sputtering and resputtering
#32Systems and methods for magnetron deposition
#33Sputtering apparatus and method, and sputtering control program
#34Physical vapor deposition plasma reactor with arcing suppression
#35Sputtering system providing large area sputtering and plasma-assisted reactive gas dissociation
#36Pulsed cathodic arc plasma
#37Enhanced reliability deposition baffle for iPVD
#38Method and apparatus for a metallic dry-filling process
#39Method and apparatus for a metallic dry-filling process
#40ICP source for iPVD for uniform plasma in combination high pressure deposition and low pressure etch process
#41Hollow body plasma uniformity adjustment device and method
#42Pulsed magnetron sputtering deposition with preionization
#43Thin film forming device and thin film forming method
#44Method of performing physical vapor deposition with RF plasma source power applied to the target using a magnetron
#45Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece
#46Method for plasma-enhanced physical vapor deposition of copper with RF source power applied to the target
#47Physical vapor deposition plasma reactor with RF source power applied to the target
#48Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron
#49Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas
#50Physical vapor deposition plasma reactor with VHF source power applied through the workpiece
#51Thin film forming device and thin film forming method
#52Highly ionized PVD with moving magnetic field envelope for uniform coverage of feature structure and wafer
#53Multi-step process for forming a metal barrier in a sputter reactor
#54Self-ionized and inductively-coupled plasma for sputtering and resputtering
#55Reactive sputter deposition plasma reactor and process using plural ion shower grids
#56Reactive sputter deposition plasma process using an ion shower grid
#57Chemical vapor deposition plasma reactor having plural ion shower grids
#58Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma
#59Shields usable with an inductively coupled plasma reactor
#60Method of forming a metal silicide layer on non-planar-topography polysilicon
#61Ionized physical vapor deposition apparatus using helical self-resonant coil
#62Temperature optimization of a physical vapor deposition process to prevent extrusion into openings
#63Self-ionized and inductively-coupled plasma for sputtering and resputtering