ClassID:

120295

C23C18/08 - page 2 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material

Recent Application in this class:
#301
20060292434
2006-12-28

Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells

#302
20060269824
2006-11-30

Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells

#303
20060257667
2006-11-16

Composition for forming silicon-aluminum film, silicon-aluminum film and method for forming the same

#304
20060223312
2006-10-05

Method and apparatus for selective deposition of materials to surfaces and substrates

#305
20060193979
2006-08-31

Low zirconium, hafnium-containing compositions, processes for the preparation thereof and methods of use thereof

#306
20060189071
2006-08-24

Integrated circuit capacitor and method of manufacturing same

#307
20060178006
2006-08-10

SUPERCRITICAL FLUID-ASSISTED DEPOSITION OF MATERIALS ON SEMICONDUCTOR SUBSTRATES

#308
20060165877
2006-07-27

Method for forming inorganic thin film pattern on polyimide resin

#309
20060160369
2006-07-20

Method of fabricating semiconductor electric heating film

#310
20060159854
2006-07-20

Method for forming inorganic thin film on polyimide resin and method for producing polyimide resin having reformed surface for forming inorganic thin film

#311
20060145351
2006-07-06

Article with a metal layer on a substrate

#312
20060141281
2006-06-29

R-T-B system permanent magnet and plating film

#313
20060121307
2006-06-08

Film deposition method

#314
20060110621
2006-05-25

Corrosion resistant coatings and method of producing

#315
20060099348
2006-05-11

Deposition method

#316
20060099343
2006-05-11

Method of copper deposition from a supercritical fluid solution containing copper (I) complexes with monoanionic bidentate and neutral monodentate ligands

#317
20060062910
2006-03-23

Low zirconium, hafnium-containing compositions, processes for the preparation thereof and methods of use thereof

#318
20060043346
2006-03-02

Precursor compositions for the deposition of electrically conductive features

#319
20060035103
2006-02-16

Method for the inner coating of a component with a cavity and component with an inner coating

#320
20060024937
2006-02-02

Methods for forming wiring and electrode

#321
20060001726
2006-01-05

Printable conductive features and processes for making same

#322
20050287691
2005-12-29

Method for doping quantum dots

#323
20050235869
2005-10-27

Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair

#324
20050233561
2005-10-20

Adhesion of a metal layer to a substrate by utilizing an organic acid material

#325
20050233154
2005-10-20

Laser-induced fabrication of metallic interlayers and patterns in polyimide films

#326
20050214458
2005-09-29

Low zirconium hafnium halide compositions

#327
20050191586
2005-09-01

UV curable silver chloride compositions for producing silver coatings

#328
20050156991
2005-07-21

Maskless direct write of copper using an annular aerosol jet

#329
20050142839
2005-06-30

Conductive layers and fabrication methods thereof

#330
20050084689
2005-04-21

Organometallic precursor composition and method of forming metal film or pattern using the same

#331
20050081907
2005-04-21

Electro-active device having metal-containing layer

#332
20050069688
2005-03-31

Single-layer, oriented thermoplastic polyester film capable of structuring by means of electromagnetic radiation, for producing selectively metallized films

#333
20050069647
2005-03-31

Platinum coating process

#334
20050048205
2005-03-03

Method of producing thin film or powder array using liquid source misted chemical deposition process

#335
20050040535
2005-02-24

Conductive film and method for preparing the same

#336
20050003086
2005-01-06

Copper compound and method for producing copper thin film using the same

#337
15602684
2020-11-10

Toughened and corrosion- and wear-resistant composite structures and fabrication methods thereof

#338
15251035
2019-04-30

Chemical method to create metal films on metal and ceramic substrates