120326 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus coating on selected surface areas by direct patterning
Sub-classes:GAS SENSOR WITH SUPERLATTICE STRUCTURE
#2Circuit substrate and method for manufacturing the same
#3Stress patterning systems and methods for manufacturing free-form deformations in thin substrates
#4Electroless copper plating polydopamine nanoparticles
#5Semiconductor devices comprising nickel— and copper—containing interconnects
#6Integrated circuit substrate containing photoimageable dielectric material and method of producing thereof
#7Method for manufacturing planar coil
#8Semiconductor devices comprising nickel- and copper-containing interconnects
#9Metalization of surfaces
#10Plating method for printed layer
#11Stable catalysts for electroless metallization
#12Method for producing patterned metallic coatings
#13Electroless copper plating polydopamine nanoparticles
#14Method for forming a metal silicide using a solution containing gold ions and fluorine ions
#15Structures having selectively metallized regions and methods of manufacturing the same
#16Stable catalysts for electroless metallization
#17Process for electroless copper deposition on laser-direct structured substrates
#18Methods of forming interconnects and semiconductor structures
#19Metallization mixtures and electronic devices
#20Electroless deposition of platinum on copper
#21Methods of Filling Voids in Copper Structures
#22Enhanced methods for fabricating solar cells with textured surfaces
#23PRE-TREATMENT PROCESS FOR ELECTROLESS NICKEL PLATING
#24Method for Metallising Objects Which Have at Least Two Different Plastics on the Surface
#25METHOD FOR PRODUCING METAL COATINGS ON PLASTICS MATERIAL PARTS
#26METHODS OF MULTI-SHOT INJECTION MOLDING AND METAL-PLATED SURFACE COATED POLYMERIC ARTICLES MADE THEREFROM
#27METHODS OF MULTI-SHOT INJECTION MOLDING AND METAL-PLATED MULTI-LAYERED POLYMERIC ARTICLES MADE THEREFROM
#28Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same
#29Electroless deposition of platinum on copper
#30Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
#31Metallization processes, mixtures, and electronic devices
#32ELECTROLESS PLATING SOLUTION FOR PROVIDING SOLAR CELL ELECTRODE
#33PREPARING SUBSTRATES CONTAINING POLYMERS FOR METALLIZATION
#34METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUCT, PRINTED WIRING BOARD, INTERPOSER AND SEMICONDUCTOR APPARATUS
#35Solar cells with textured surfaces
#36Selective deposition of metal on plastic substrates
#37Electroless Deposition of Platinum on Copper
#38Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
#39LOW CONTACT RESISTANCE SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME
#40Process for Preventing Plating on a Portion of a Molded Plastic Part
#41Methods of forming interconnects in a semiconductor structure
#42Printed wiring board and its manufacturing method
#43Metallised parts made from plastic material
#44Process for plating plastic part after overmolding
#45METHOD OF FABRICATING METAL LINE BY WET PROCESS
#46Printed wiring board and its manufacturing method
#47Manufacturable CoWP metal cap process for copper interconnects
#48Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures
#49Catalytic activation technique for electroless metallization of interconnects
#50Selective activation of aluminum, copper, and tungsten structures
#51Method for manufacturing metallic microstructure
#52Manufacturable CoWP metal cap process for copper interconnects
#53Selective nickel plating of aluminum, copper, and tungsten structures
#54Metallised parts made from plastic material
#55Electroless deposition apparatus
#56Method for manufacturing wiring substrate and method for manufacturing electronic device
#57Method to fabricate amorphous electroless metal layers
#58Plating method including pretreatment of a surface of a base metal
#59Semiconductor device manufacturing method
#60Electroless plating pre-treatment solution and electroles plating method