120328 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
METAL COMPOUND THIN FILM, METHOD OF FORMING THE SAME AND THIN FLIM CATALYST FOR WATER ELECTROLYSIS
#2CATALYST INK FOR PLATING AND ELECTROLESS PLATING METHOD USING SAME
#3Reaction chamber with stop-gapped vacuum seal
#4CATALYST INK FOR PLATING AND ELECTROLESS PLATING METHOD USING SAME
#5Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor
#6Catalyst ink for three-dimensional conductive constructs
#7Selectively Plated Rolls Of Materials And Related Methods
#8Molecular organic reactive inks for conductive silver printing
#9Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor
#10PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATALYSTS
#11Selectively plated rolls of materials and related methods
#12Deposition mask and method of manufacturing the same
#13Patterning of electroless metals by selective deactivation of catalysts
#14Metallization of the wafer edge for optimized electroplating performance on resistive substrates
#15PLATING METHOD
#16Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#17Metallization of the wafer edge for optimized electroplating performance on resistive substrates
#18Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#19Process for depositing metal on a substrate
#20Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#21Metallization of the wafer edge for optimized electroplating performance on resistive substrates
#22Use of titania precursor composition pattern
#23Liquid deposition composition and process for forming metal therefrom
#24PRINTING METHOD FOR PRINTING AND PLATING PROCESS
#25Fabrication of tunneling junction for nanopore DNA sequencing
#26Fabrication of tunneling junction for nanopore DNA sequencing
#27Plating method
#28Plating catalyst and method
#29Enhanced methods for fabricating solar cells with textured surfaces
#30Formation of solid layers on substrates
#31Plating catalyst and method
#32METAL INK COMPOSITION, METHOD OF FORMING A CONDUCTIVE METAL FILM USING THE SAME, AND CONDUCTIVE METAL FILM USING THE SAME
#33MICROMETRIC DIRECT-WRITE METHODS FOR PATTERNING CONDUCTIVE MATERIAL AND APPLICATIONS TO FLAT PANEL DISPLAY REPAIR
#34METHOD AND APPARATUS FOR CHEMICAL DEPOSITION
#35Method of forming a patterned substrate
#36Method and apparatus for material deposition
#37Methods for multi-step copper plating on a continuous ruthenium film in recessed features
#38Solar cells with textured surfaces
#39Method of forming metal film and metal wiring pattern, undercoat composition for forming metal film and metal wiring pattern, and metal film
#40Surface ornamental structure of an article and a method for ornamentally working the surface structure of the article
#41Solar cell metallization using inline electroless plating
#42Microfluidic systems and methods for screening plating and etching bath compositions
#43INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME
#44INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME
#45Palladium complexes for printing circuits
#46Palladium complexes for printing circuits
#47Metal pattern forming method
#48Systems and methods for in situ annealing of electro- and electroless platings during deposition
#49METHOD OF FORMING METAL PATTERN, AND METAL SALT MIXTURE
#50Apparatus and method for forming magnetic film
#51Method for electroless depositing a material on a surface of a wafer
#52Self-limiting plating method
#53JET PRINTING OF PATTERNED METAL
#54CAPPING OF COPPER STRUCTURES IN HYDROPHOBIC ILD USING AQUEOUS ELECTRO-LESS BATH
#55Wet processing using a fluid meniscus apparatus
#56Method and apparatus for chemical deposition
#57Contact Structures Comprising A Core Structure And An Overcoat
#58Methttod for producing metal conductors on a substrate
#59Method of forming a conductive metal region on a substrate
#60Film formation method
#61Jet printing of patterned metal
#62Method for forming circuit pattern
#63Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
#64Capping of copper structures in hydrophobic ILD using aqueous electro-less bath
#65Depositing solid materials
#66Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#67Formation of solid layers on substrates
#68Method and apparatus for material deposition in semiconductor fabrication
#69Process for depositing a catalyst
#70Contact structures and methods for making same
#71Electroless deposition methods and systems
#72Methods of forming electrically conductive pathways using palladium aliphatic amine complexes
#73Catalyst ink for three-dimensional conductive constructs