Bendable Nickel Plating on Flexible Substrates

LIQUID-COOLING COOLER HAVING NICKEL MULTILAYER STRUCTURE

FIRE RESISTANT ENCLOSURE FOR BATTERIES AND INVERTERS AND BATTERIES AND INVERTERS CONTAINING THE SAME

SYSTEM AND METHOD FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electroless Deposition Process for Semiconductor Devices

WHEELS HAVING A BI-LAYERED COATING AND METHODS FOR MAKING THE SAME

TIN OXIDE MULTILAYER FILM WITH CATALYST LAYER AND METHOD FOR FORMING SAME

POWER COMPONENT SUBMOUNT AND MANUFACTURING METHOD THEREOF

Bendable Nickel Plating on Flexible Substrates

Device for Printing to a Recording Medium

COSMETIC FINISH FOR ALUMINUM ALLOYS

Additive Solution-Processed Structural Colors

Additive Solution-Processed Structural Colors

METHOD FOR ETCHING AT LEAST ONE SURFACE OF A PLASTIC SUBSTRATE

MULTILAYER CORROSION SYSTEM

Method of forming an etched part and a method of forming a metal plated part

ELECTRONIC DEVICE INCLUDING OUTER HOUSING PLATED WITH CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREFOR

Plating stack

Electroless Plating Process and Two-Layer Plating Film

METHOD FOR FABRICATING ELECTRONIC COMPONENT

ELECTRONIC DEVICE HOUSINGS WITH ELECTROLESS PLATING LAYERS

Multilayered nickel-phosphorus composite

Laminate

Laminate and method for producing same

AN ALUMINUM ALLOY CAGE AND A PROCESSING METHOD OF THE ALUMINUM ALLOY CAGE

Alnico-based hard magnetic particle and method for manufacturing the same

ELECTROLESS NICKEL COATINGS AND COMPOSITIONS AND METHODS FOR FORMING THE COATINGS

Additively manufactured thermoset polymers for metal plating and metal plated parts formed therefrom

METHOD OF FABRICATING AND COATING COPPER NANOWIRES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

ELECTROLESS PALLADIUM PLATING BATH

Metal member and production method therefor

Method for manufacturing surge absorbing device

Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor

GALVANICALLY DECORATED COMPONENT MADE OF PLASTIC, AND METHOD FOR PRODUCING A PLASTIC COMPONENT HAVING A STRUCTURED SURFACE

Composite member

Method of producing electroconductive substrate, electronic device and display device

Roll stamp for imprint device, and manufacturing method therefor

Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates

Semiconductor wafer with void suppression and method for producing same

GOLD PLATING METHOD AND PLATING FILM

Plated metallization structures

Metal-plated carbon material and manufacturing method thereof

ELECTROLESS PALLADIUM PLATING SOLUTION, AND ELECTROLESS PALLADIUM PLATED COATING

Composition for electroless plating underlying membrane

Enhanced nickel plating process

CIRCUIT BOARD AND PLATING METHOD THEREOF

Piston ring with wear resistant coating

Electroless plating process

PATTERNING OF ELECTROLESS METALS

Silver-coated silicone rubber particles, conductive paste containing same, and a conductive film production method using conductive paste

Film formation method

Transistor manufacturing method

Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium

Ceramic device and manufacturing method thereof

Plated metallization structures

Plating bath composition and method for electroless plating of palladium

Solution deposition method for forming metal oxide or metal hydroxide layer

Method of producing electroconductive substrate, electronic device and display device

Sheet material, metal mesh and manufacturing methods thereof

Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor

Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates

Method for making composite structure with porous metal

Plating bath composition and method for electroless plating of palladium

CORROSION AND FATIGUE RESISTANT COATING FOR A NON-LINE-OF-SIGHT (NLOS) PROCESS

Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device

Embedded formation of wearable and flexible batteries

Method for producing porous copper foil and porous copper foil produced by the same

Deposition mask, method of manufacturing deposition mask and metal plate

Layer-by-layer deposition using hydrogen

Silver Coated Copper Flakes and Methods of Their Manufacture

Method for manufacturing surge absorbing device

PROCESS FOR METALLIZING PLASTIC SURFACES

Electroless plating method and ceramic substrate

Conducting member for fuel cells, fuel cell, fuel cell stack, and method of producing conducting member for fuel cells

Method of producing uniform polymer beads by vibration jetting with superhydrophobic membrane

COATING STRUCTURE, IMPELLER, COMPRESSOR, METAL PART MANUFACTURING METHOD, IMPELLER MANUFACTURING METHOD, AND COMPRESSOR MANUFACTURING METHOD

Metal deposition methods for forming bimetallic structures, batteries incorporating bipolar current collectors made therefrom, and applications thereof

Semiconductor element having a warped surface and production method thereof

High resistivity soft magnetic material for miniaturized power converter

Semiconductor device having a Pd-containing adhesion layer

Coated optical fibres having improved features

Galvanically decorated component made of plastic, and method for producing a plastic component having a structured surface

CONTROLLED GRAIN SIZE STRUCTURES

Method for electromagnetic shielding and thermal management of active components

Solution deposition method for forming metal oxide or metal hydroxide layer

Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates

Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device

Aluminum plate and method for manufacturing aluminum plate

Coating electronic component

Plating bath composition and method for electroless plating of palladium

Plated terminations

Magnet electroplating

METHOD FOR A NON-AQUEOUS ELECTROLESS POLYOL DEPOSITION OF METAL OR METAL ALLOY IN FEATURES OF A SUBSTRATE

Metal circuit structure

Web transport system including scavenger blade

Plating method, plated component, and plating system

Semiconductor device having a Pd-containing adhesion layer

ELECTROCHEMICAL STRIP AND MANUFACTURING METHOD THEREOF

Method of removing soluble material layer by dissolving, method of manufacturing member, socket for use in electronic part, and electric and electronic devices

Plating method and recording medium

Method for metalizing polymer substrate and polymer article prepared thereof

Method for metalizing polymer substrate and polymer article prepared thereof

Method for metalizing polymer substrate and polymer article prepared thereof

System for insulating high current busbars

Conductive nanowire films

METHOD OF ELECTROLESS GOLD PLATING

Gold plate coated material

Wiring pattern manufacturing method and transistor manufacturing method

Method of manufacturing an electrode for an energy storage device

Catalyst layer forming method, catalyst layer forming system and recording medium

Abutment for a tubular component overlaid with a metallic composite deposit and method for making it

Connecting element for a tubular component overlaid with a metallic composite deposit and method of obtaining such element

Adhesion promoting process for metallisation of substrate surfaces

Plated terminations

Nickel corrosion barrier under chrome for sucker rod pumps

PLATED POLYMER AVIATION COMPONENTS

Plated polymer compressor

Palladium plate coated material and method of producing palladium plate coated material

Solution deposition method for forming metal oxide or metal hydroxide layer

Plating of articles

Plating method, plating apparatus, and storage medium

METHOD FOR PRODUCTION OF METAL SKIN LAYER PARTICLES WITH CONTROLLABLE LAYER THICKNESS

Wiring substrate and method for manufacturing the same

Catalyst layer forming method, catalyst layer forming system, and recording medium

Conductive fibres

Electroless plating method and ceramic substrate

Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure

Electroless surface treatment plated layers of printed circuit board and method for preparing the same

Electrochemical fabrication process for forming multilayer multimaterial microprobe structures

Deposition of a protective coating including metal-containing and chromium-containing layers on zirconium alloy for nuclear power applications

Separator for fuel cells, fuel cell, fuel cell stack, and method of manufacturing separator for fuel cells

MANUFACTURING METHOD OF TEST STRIP

Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes

Pre-treatment method of plating, storage medium, and plating system

ELECTROLESS DEPOSITION OF Bi, Sb, Si, Sn, AND Co AND THEIR ALLOYS

Liquid deposition composition and process for forming metal therefrom

Coating composition, composite prepared by using the coating composition and method for preparing the same

Method of electroless gold plating

Electroless nickel plating bath

Plating method, plating apparatus, and storage medium

Pre-treatment method for plating and storage medium

Method for producing hard disk substrate

Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure

Conductive nanowire films

Plating method, plating system and storage medium

Method for preparing multilayer metal complex having excellent surface properties

Iron oxide-gold core-shell nanoparticles and uses thereof

Plating method, plating system and storage medium

Electrochemical strip and manufacturing method thereof

Method of applying a nanocrystalline coating to a gas turbine engine component

Metalized plastic articles and methods thereof

Plating apparatus, plating method and storage medium

Method and composition for electroless nickel and cobalt deposition

ETCHED SILICON STRUCTURES, METHOD OF FORMING ETCHED SILICON STRUCTURES AND USES THEREOF

Wiring substrate and method of manufacturing wiring substrate

Metal material for electronic component and method for manufacturing the same

Plating apparatus, plating method and storage medium having plating program stored thereon

Metal compound, method for preparing the same, selective metallization of surface of substrate with the metal compound

Method for manufacturing three-dimensional integrated circuit

Methods of plating or coating ultrasound transducers

Liquid ejecting head, liquid ejecting apparatus, piezoelectric element, and manufacturing method thereof

Multi shell metal particles and uses thereof

Methods for fabrication of orthodontic appliances and orthodontic appliances made thereby

Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates

Method for producing a resin substrate having a metal film pattern formed thereon

Sheet assembly with aluminum based electrodes

Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids

Method for electroless metallization

Supporting unit, substrate treating device including the same, and method of manufacturing the supporting unit

Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board

Process for tin coating a metallic substrate, process for hardening a tin layer and wire having a tin coating

Immobilization of Technetium by Electroless Plating

Method for producing a semiconductor element of a direct-converting x-ray detector

Methods for preparing and using metal and/or metal oxide porous materials

Secondary battery

Metal coating of objects using plasma polymerisation pretreatment

Electronic component and method of manufacturing electronic component

MANUFACTURING METHOD OF CIRCUIT PATTERN

Method for direct metallization of non-conductive substrates

Plated terminations

Metal foil for base material

Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board

Coatings Having Enhanced Corrosion Performance and Method of Using the Same

Method for production of hard disk substrate and hard disk substrate

High temperature resistant silver coated substrates

Method of preparing a palladium-silver alloy gas separation membrane system

Method of making a composite gas separation module

Aluminum article

Method of manufacturing an electrode for an energy storage device

Coating and electronic component

Electroless plating apparatus and electroless plating method

SURFACE TREATMENT METHOD FOR ALUMINUM OR ALUMINUM ALLOY AND ARTICLE MANUFACTURED BY THE SAME

Process for the surface-modification of flyash and industrial applications thereof

METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE

Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid

Formation of solid layers on substrates

CORE-SHELL TYPE METAL NANOPARTICLES AND METHOD FOR PRODUCING THE SAME

ADHESION OF METAL THIN FILMS TO POLYMERIC SUBSTRATRES

Electroless surface treatment plated layers of printed circuit board and method for preparing the same

ELECTRIC JOINT STRUCTURE AND METHOD FOR PREPARING THE SAME

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing

Manufacturing method of circuit board

ELECTRONIC CIRCUIT, METHOD FOR FORMING SAME, AND COPPER CLAD LAMINATE FOR FORMING ELECTRONIC CIRCUIT

NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM

Semiconductor device and manufacturing method of the same

Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing

CATHODE, ELECTROLYTIC CELL FOR ELECTROLYSIS OF ALKALI METAL CHLORIDE, AND METHOD FOR PRODUCING NEGATIVE ELECTRODE

Processes and Systems for Engineering a Barrier Surface for Copper Deposition

Methods for Forming a Barrier Layer with Periodic Concentrations of Elements and Structures Resulting Therefrom

Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids

Stretchable Conductive Nanofibers, Stretchable Fiber Electrode Using The Same And Method For Producing The Same

METHOD OF MAKING A BIOCHEMICAL TEST STRIP

Microstructure manufacturing method

Production method of base plate for disk drive, base plate for disk drive, and drive therewith

Methods for preparing and using metal and/or metal oxide porous materials

Graphite particle-supported Pt-shell/Ni-core nanoparticle electrocatalyst for oxygen reduction reaction

DECORATIVE SURFACE FINISH AND METHOD OF FORMING SAME

Electroless plating bath composition and method of plating particulate matter

Substrate structure and method of manufacturing the same

DISPLACEMENT GOLD PLATING SOLUTION AND METHOD FOR FORMING CONNECTING PORTION

METHODS FOR METAL PLATING AND RELATED DEVICES

Method for electroless plating of tin and tin alloys

METHOD OF APPLYING A METALLIC PRECURSOR TO A TITANIUM OXIDE COATING TO FORM A COMPOSITE COATING OR MATERIAL

Layer System with Improved Corrosion Resistance

SULFUR-RESISTANT COMPOSITE METAL MEMBRANES

Metalized plastic articles and methods thereof

Anticorrosion Mirror, Method for Producing Same, and Uses Thereof in Solor Energy

MANUFACTURING METHOD OF NOBLE METAL PLATING LAYER

Method of applying a nanocrystalline coating to a gas turbine engine component

Method for Treating Metal Surfaces

Method for Treating Metal Surfaces

Method for Treating Metal Surfaces

CONTACT OF ELECTRICAL CONNECTOR AND PLATING METHOD THEREOF

METHOD FOR DEPOSITING METAL ON A SUBSTRATE; METAL STRUCTURE AND METHOD FOR PLATING A METAL ON A SUBSTRATE

Metalized plastic articles and methods thereof

COATING AND ELECTRONIC COMPONENT

Metal-Coated Polyimide Resin Substrate with Excellent Thermal Aging Resistance Properties

Aluminum oxide film remover and method for surface treatment of aluminum or aluminum alloy

High permeance sulfur tolerant Pd/Cu alloy membranes

SURFACE METALLIZING METHOD, METHOD FOR PREPARING PLASTIC ARTICLE AND PLASTIC ARTICLE MADE THEREFROM

DIAMOND-COATED DOCTOR BLADE

ELECTROLESS PLATING PRODUCTION OF NICKEL AND COBALT STRUCTURES

Metalized plastic articles and methods thereof

Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces

Microstructure manufacturing method and microstructure

METALIZED PLASTIC ARTICLES AND METHODS THEREOF

Method for the fabrication of composite palladium and palladium-alloy membranes

Method of preparing low resistance metal line, patterned metal line structure, and display device using the same

Erosion and corrosion resistant coating system for compressor

Circuit board

Electrode of biosensor, manufacturing method thereof, and biosensor thereof

SOLUTION FOR INHIBITING PALLADIUM ACTIVITY INCLUDING HALOGENIC ACID AND METHOD FOR PREVENTING DEFECT OF PLATING USING THEREOF

Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties

Composite material, method for producing the same, and apparatus for producing the same

METHOD OF ENABLING SELECTIVE AREA PLATING ON A SUBSTRATE

Barrier layer configurations and methods for processing microelectronic topographies having barrier layers

Method for passivating hardware of a microelectronic topography processing chamber

METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME

Method and apparatus for material deposition

Methods for multi-step copper plating on a continuous ruthenium film in recessed features

Multi-step release method for electrochemically fabricated structures

Decorative surface finish and method of forming same

Suppression method for corrosion of carbon steel member

Method and apparatus for manufacturing semiconductor device

Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids

PROCESS FOR PRODUCING COMPOSITE MATERIAL COMPRISING RESIN MOLDED PRODUCT

CONDUCTIVE PARTICLE AND METHOD FOR PRODUCING CONDUCTIVE PARTICLE

Electrochemical Fabrication Processes Incorporating Non-Platable Metals and/or Metals that are Difficult to Plate On

Methods of Reducing Interlayer Discontinuities in Electrochemically Fabricated Three-Dimensional Structures

Fine metal structure, process for producing the same, fine metal mold and device

Coating structure and method for forming the same

Systems and Methods Affecting Profiles of Solutions Dispensed Across Microelectronic Topographies During Electroless Plating Processes

Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes

Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates

Semiconductor device and manufacturing method of the same

Coated conductive powder and conductive adhesive using the same

WEAR RESISTANCE REINFORCING METHOD AND SLIDING STRUCTURE

Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing

CHROME-FREE METHOD OF CONDITIONING AND ETCHING OF A THERMOPLASTIC SUBSTRATE FOR METAL PLATING

Barrier layer configurations and methods for processing microelectronic topographies having barrier layers

Microprobe Tips and Methods for Making

Coated fatigue critical components

Fabrication Process for Co-Fabricating a Multilayer Probe Array and a Space Transformer

Solar cell metallization using inline electroless plating

Electroless deposition process on a silicon contact

Nickel-gold plateable thick film silver paste

Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package

Method of nickel-gold plating and printed circuit board

Method of depositing fluids within a microelectric topography processing chamber

Method of Forming Electrically Isolated Structures Using Thin Dielectric Coatings

Metallization process for making fuser members

ULSI wiring and method of manufacturing the same

Method of light induced plating on semiconductors

METHOD FOR FORMING CORROSION-RESISTANT PLATING LAYER AND ROTARY MACHINE

Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe Structures

METHOD FOR APPLYING A METAL ON PAPER

INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME