120351 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus; Process of electroless plating; Characteristics of the product obtained; Multilayered product Two or more layers only obtained by electroless plating
MULTI-LAYERED NICKEL-PHOSPHOROUS COATINGS AND PROCESSES FOR FORMING THE SAME
#302INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME
#303Palladium complexes for printing circuits
#304CATALYSTS FOR FUEL CELL APPLICATIONS USING ELECTROLESS DEPOSITION
#305Hydrogen transport membrane fabrication method
#306METHOD FOR APPLYING A METAL ON A SUBSTRATE
#307Palladium complexes for printing circuits
#308Integrated Circuit Packaging Using Electrochemically Fabricated Structures
#309Unsupported palladium alloy membranes and methods of making same
#310Porous Battery Components Comprising Electrochemically Created Nanocatalysts
#311Thick metal interconnect with metal pad caps at selective sites and process for making the same
#312Thick metal interconnect with metal pad caps at selective sites and process for making the same
#313Electroless palladium plating bath and electroless palladium plating method
#314Catalysts for Fuel Cell Applications Using Electroless Deposition
#315Metal pattern forming method
#316PRECIOUS METAL JEWELRY AND PROCESS FOR PRODUCING THE SAME
#317Method of enabling selective area plating on a substrate
#318Bright Pigment with Gold Tone, And Cosmetic, Paint, Ink or Resin Composition Containing the Same
#319Method For Manufacturing Embossed Conductive Clothes
#320Metal inks, methods of making the same, and methods for printing and/or forming metal films
#321Method for Metallizing Liquid Crystal and Polymer
#322Electroless plating production of nickel and cobalt structures
#323METHOD OF PREPARING LOW RESISTANCE METAL LINE, PATTERNED METAL LINE STRUCTURE, AND DISPLAY DEVICE USING THE SAME
#324Copper-tin-oxygen alloy plating
#325METHOD FOR PRODUCING A COPPER LAYER ON A SUBSTRATE IN A FLAT PANEL DISPLAY MANUFACTURING PROCESS
#326Stabilization and Performance of Autocatalytic Electroless Processes
#327Pd nanopore and palladium encapsulated membranes
#328Electrically Conductive Fine Particles, Anisotropic Electrically Conductive Material, and Electrically Conductive Connection Method
#329METHODS FOR ELECTROLESS PLATING OF METAL TRACES ON A SUBSTRATE AND DEVICES AND SYSTEMS THEREOF
#330Method for electroless depositing a material on a surface of a wafer
#331Integrated Circuit Packaging Using Electrochemically Fabricated Structures
#332Method for Depositing Palladium Layers and Palladium Bath Therefor
#333Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
#334Multi-step Release Method for Electrochemically Fabricated Structures
#335Methods of and Apparatus for Forming Three-Dimensional Structures Integral with Semiconductor Based Circuitry
#336Probe arrays and method for making
#337Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof
#338METHOD OF FABRICATING METAL LINE BY WET PROCESS
#339Tin-Based Plating Film and Method for Forming the Same
#340Method of making sulfur-resistant composite metal membranes
#341PLATING SUBSTRATE, ELECTROLESS PLATING METHOD, AND CIRCUIT FORMING METHOD USING THE SAME
#342Method of Producing Metal Oxide Film
#343Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating
#344Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide
#345Processes and systems for engineering a copper surface for selective metal deposition
#346Processes and systems for engineering a barrier surface for copper deposition
#347METHOD FOR FORMING A NICKEL-BASED LAYERED STRUCTURE ON A MAGNESIUM ALLOY SUBSTRATE, A SURFACE-TREATED MAGNESIUM ALLOY ARTICLE MADE THEREFROM, AND A CLEANING SOLUTION AND A SURFACE TREATMENT SOLUTION USED THEREFOR
#348Conductive Fine Particle, Method for Producing Conductive Fine Particle and Electroless Silver Plating Liquid
#349Coating structure and method for forming the same
#350Method of manufacturing polymer member and polymer member
#351Polyimide substrate and method of manufacturing printed wiring board using the same
#352Whiskerless plated structure and plating method
#353Non-cyanide electroless gold plating solution and process for electroless gold plating
#354METHOD FOR MANUFACTURING WIRING SUBSTRATE
#355Method for manufacturing wiring substrate
#356Method of manufacturing interconnect substrate
#357Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry
#358Conductive microparticle, process for producing the same and anisotropic conductive material
#359Methods of Reducing Interlayer Discontinuities in Electrochemically Fabricated Three-Dimensional Structures
#360Microdevices for Tissue Approximation and Retention, Methods for Using, and Methods for Making
#361Coating for biological rejuvenation
#362Electroconductive fine particle and anisotropically electroconductive material comprising non-crystal and crystal nickel plating layers and method of making thereof
#363Coating process for fatigue critical components
#364ELECTROLESS GOLD PLATING SOLUTION AND METHOD
#365ELECTROLESS GOLD PLATING SOLUTION
#366Method of electrolytically depositing materials in a pattern directed by surfactant distribution
#367Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component
#368Electrochemical fabrication processes incorporating non-platable metals and/or metals that are difficult to plate on
#369Fine metal structure, process for producing the same, fine metal mold and device
#370Method for manufacturing copper wires on substrate of flat panel display device
#371METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS
#372Hydrogen transport membrane fabrication method
#373Process for chemical etching of parts fabricated by stereolithography
#374Process for making a metal seed layer
#375Process for low resistance metal cap
#376Electroconductive fine particle, method of producing electroconductive fine particle, and anisotropic electroconductive material
#377Metal duplex method
#378Metal duplex method
#379Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
#380Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth
#381Lubricious coatings
#382Semiconductor device and manufacturing method using an ink-jet method of the same
#383Electroless gold plating solution
#384Electroless deposition process on a silicon contact
#385Electroless deposition processes and compositions for forming interconnects
#386In-situ silicidation metallization process
#387Contact metallization scheme using a barrier layer over a silicide layer
#388Electroless deposition process on a silicide contact
#389Deposition of an intermediate catalytic layer on a barrier layer for copper metallization
#390Vertical microprobes for contacting electronic components and method for making such probes
#391Production method of substrate with black film and substrate with black film
#392Method for manufacturing metallic microstructure
#393Method of forming electrically isolated structures using thin dielectric coatings
#394Casing for transporting a toner mixture and method for producing a casing of this type
#395Method of plating on a glass base plate, a method of manufacturing a disk substrate for a perpendicular magnetic recording medium, a disk substrate for a perpendicular magnetic recording medium, and a perpendicular magnetic recording medium
#396Pad structure of wiring board and wiring board
#397Process for preparing palladium alloy composite membranes for use in hydrogen separation, palladium alloy composite membranes and products incorporating or made from the membranes
#398Plating method
#399UV curable catalyst compositions
#400Integrated circuit packaging using electrochemically fabricated structures
#401Method of forming a conductive metal region on a substrate
#402Probe arrays and method for making
#403Method of forming metal pattern having low resistivity
#404Electroless metallic plating method for leak repair and prevention in liquid-cooled generator stator bars
#405Plating substrate, electroless plating method, and circuit forming method using the same
#406Conductive electrolessly plated powder and method for making same
#407Chip interconnect and packaging deposition methods and structures
#408Metallic structures incorporating bioactive materials and methods for creating the same
#409Methods of selectively incorporating metals onto substrates
#410Microprobe tips and methods for making
#411Novel structures and method of preparation
#412Apparatus configurations for affecting movement of fluids within a microelectric topography processing chamber
#413Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
#414Methods for forming a barrier layer with periodic concentrations of elements and structures resulting therefrom
#415Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes
#416Method for metallizing a non-metallic surface and the metallized surface structure thereof
#417Method for manufacturing light guide plate mold cores
#418Multiple stage electroless deposition of a metal layer
#419Multiple stage electroless deposition of a metal layer
#420Method for forming circuit pattern
#421Process for metallising support media made from plastic material
#422Conductive electrolessly plated powder and method for making same
#423Fabrication process for co-fabricating multilayer probe array and a space transformer
#424Method of plating a golf club head
#425Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
#426Method of forming metal pattern having low resistivity
#427Self-activated electroless metal deposition
#428Integrated circuit packaging using electrochemically fabricated structures
#429Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
#430Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber
#431Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#432Formation of solid layers on substrates
#433Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board
#434Multiple stage electroless deposition of a metal layer
#435Method and apparatus for material deposition in semiconductor fabrication
#436Method for forming CoWRe alloys by electroless deposition
#437Three dimensional polymeric fuel cell components
#438Apparatus and method of detecting the electroless deposition endpoint
#439Multi-step release method for electrochemically fabricated structures
#440Method of electrolytically depositing materials in a pattern directed by surfactant distribution
#441Method of making multi-layer electronic components with plated terminations
#442Metallization of ceramics
#443Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys
#444Methods of forming electrically conductive pathways using palladium aliphatic amine complexes
#445Activation plate for electroless and immersion plating of integrated circuits
#446Method for defining a source and a drain and a gap inbetween
#447High resolution patterning method