C23C18/166 - CPC Classification Index

ClassID:

120356 ⎘

C23C18/166 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus; Process of electroless plating; Process features with two steps starting with addition of reducing agent followed by metal deposition

Recent Application in this class:

20240213090

2024-06-27

SUBSTRATE LIQUID PROCESSING METHOD, AND RECORDING MEDIUM

20230002907

2023-01-05

Coating method

20220356582

2022-11-10

NOVEL METHODOLOGY FOR COATING NON-CONDUCTING ARTICLES WITH BROAD-SPECTRUM ANTIMICROBIAL ELECTROLESS PLATING LAYERS

20220056587

2022-02-24

METHOD OF FABRICATING AND COATING COPPER NANOWIRES

20210140052

2021-05-13

ELECTROLESS COPPER PLATING AND COUNTERACTING PASSIVATION

20210115565

2021-04-22

PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM

20190341324

2019-11-07

Manufacturing a package using plateable encapsulant

20180352661

2018-12-06

Methods of fast fabrication of single and multilayer circuit with highly conductive interconnections without drilling

20180178718

2018-06-28

Emotion lighting apparatus for vehicle and method for manufacturing the same

#10

20180016679

2018-01-18

Silver-coated particle and method of producing same

#11

20170256472

2017-09-07

Semiconductor package with plateable encapsulant and a method for manufacturing the same

#12

20170156216

2017-06-01

ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRAZINE DERIVATIVE CONTAINING CATALYSTS

#13

20170127515

2017-05-04

Metal nanowire thin-films

#14

20170073815

2017-03-16

METHOD FOR A NON-AQUEOUS ELECTROLESS POLYOL DEPOSITION OF METAL OR METAL ALLOY IN FEATURES OF A SUBSTRATE

#15

20170067165

2017-03-09

Conductive laminate for touch panel, touch panel, and transparent conductive laminate

#16

20170042039

2017-02-09

Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts

#17

20160305016

2016-10-20

Method for producing patterned metallic coatings

#18

20160161242

2016-06-09

Non-contact strain measurement

#19

20160160066

2016-06-09

Process for depositing metal on a substrate

#20

20160145758

2016-05-26

In-situ balancing of plated polymers

#21

20160145755

2016-05-26

LIGHTWEIGHT METAL PARTS PRODUCED BY PLATING POLYMERS

#22

20160145747

2016-05-26

BRUSH PLATING REPAIR METHOD FOR PLATED POLYMERS

#23

20160055931

2016-02-25

Conductive particles, method of manufacturing the same, conductive resin composition containing the same, and conductive coated object

#24

20160047050

2016-02-18

METHOD FOR PRODUCTION OF METAL SKIN LAYER PARTICLES WITH CONTROLLABLE LAYER THICKNESS

#25

20160010273

2016-01-14

Conductive fibres

#26

20150376794

2015-12-31

RESIN ARTICLE HAVING PLATING LAYER AND METHOD OF MANUFACTURING THE SAME

#27

20150368806

2015-12-24

Method for depositing a first metallic layer onto non-conductive polymers

#28

20150284857

2015-10-08

Electroless deposition of continuous platinum layer using complexed Co metal ion reducing agent

#29

20150249195

2015-09-03

Method for forming metal particle layer and light emitting device fabricated using metal particle layer formed by the method

#30

20150079414

2015-03-19

Method for preparing multilayer metal complex having excellent surface properties

#31

20150056379

2015-02-26

Method of manufacturing gold thin film by using electroless-plating method

#32

20150056378

2015-02-26

Method of manufacturing palladium thin film by using electroless-plating method

#33

20150017331

2015-01-15

Process for metallizing nonconductive plastic surfaces

#34

20150001177

2015-01-01

Process for metallizing nonconductive plastic surfaces

#35

20140284849

2014-09-25

Method for manufacturing three-dimensional integrated circuit

#36

20140255600

2014-09-11

Process for electroless copper deposition on laser-direct structured substrates

#37

20140072706

2014-03-13

Direct Electroless Palladium Plating on Copper

#38

20120164328

2012-06-28

FILM FORMATION METHOD AND STORAGE MEDIUM

#39

20110235203

2011-09-29

Mirror with increased reflectance

#40

20110162870

2011-07-07

Metal nanowire thin-films

#41

20110086165

2011-04-14

Metallization of a porous silicon zone by in situ reduction and application to a fuel cell

#42

20110083785

2011-04-14

ELECTRODE FORMING METHOD

#43

20100323109

2010-12-23

Selective deposition of metal on plastic substrates

#44

20100296166

2010-11-25

PROCESS FOR PRODUCING TRANSPARENT ELECTROCONDUCTIVE MEMBER

#45

20100075053

2010-03-25

Non-electrolytic method for metallizing a substrate by the reduction of metallic salt(s) and the spraying of aerosol(s)

#46

20090087570

2009-04-02

Metal pattern forming method

#47

20070298190

2007-12-27

Method of Producing Metal Oxide Film

#48

20070148547

2007-06-28

Modification of an anode material and a preperation method thereof

#49

20060286304

2006-12-21

Methttod for producing metal conductors on a substrate

#50

20060240187

2006-10-26

Deposition of an intermediate catalytic layer on a barrier layer for copper metallization

#51

20060225994

2006-10-12

Electrode forming method

#52

20060063382

2006-03-23

Method to fabricate copper-cobalt interconnects

#53

20060035018

2006-02-16

Method for forming a thin film silver mirror and method for forming coated film comprising thin silver mirror film

#54

20050145133

2005-07-07

Copper molybdenum electroless deposition process and materials

#55

20050136185

2005-06-23

Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application