C23C18/1655 - CPC Classification Index

ClassID:

120353 ⎘

C23C18/1655 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus; Process of electroless plating Process features

Sub-classes:

C23C18/1657 » {Electroless forming, i.e. substrate removed or destroyed at the end of the process} 87
C23C18/1658 » {with two steps starting with metal deposition followed by addition of reducing agent} 104
C23C18/166 » {with two steps starting with addition of reducing agent followed by metal deposition} 55
C23C18/1662 » {Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires} 143
C23C18/1664 » {with additional means during the plating process} 14

Recent Application in this class:

20260110094

2026-04-23

PHOSPHORUS FREE ELECTROLESS PALLADIUM

20240204162

2024-06-20

METHODS, SYSTEMS, AND COMPOSITIONS FOR THE LIQUID-PHASE DEPOSITION OF THIN FILMS ONTO THE SURFACE OF BATTERY ELECTRODES

20220045307

2022-02-10

Methods, systems, and compositions for the liquid-phase deposition of thin films onto the surface of battery electrodes

20210242443

2021-08-05

Liquid-phase deposition of thin films onto the surface of battery electrodes

20210066701

2021-03-04

Methods, systems, and compositions for the liquid-phase deposition of thin films onto the surface of battery electrodes

20180030599

2018-02-01

Method and device for producing metal patterns on a substrate for decorative and/or functional purposes, manufacture of objects incorporating said production and set of consumables used