C23C18/1824 - CPC Classification Index

ClassID:

120385 ⎘

C23C18/1824 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment

Sub-classes:

C23C18/1827 » {only one step pretreatment} 25
C23C18/1837 » {Multistep pretreatment} 30

Recent Application in this class:

20250051926

2025-02-13

SYSTEM AND METHOD FOR PERFORMING LOCALIZED ELECTROLESS NICKEL PLATING

20230151493

2023-05-18

METAL DISPLACEMENT SOLUTION, METHOD FOR SURFACE TREATMENT OF ALUMINUM OR ALUMINUM ALLOY

20230009692

2023-01-12

COATED SUBSTRATE SUPPORT ASSEMBLY FOR SUBSTRATE PROCESSING

20220235468

2022-07-28

Laminate

20220112603

2022-04-14

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

20200407852

2020-12-31

Anti-scale deposition hierarchical coatings for wellbore applications

20180017518

2018-01-18

Nanogrid electrochemical sensor for detection of biochemical species by electrochemical impedance spectroscopy

20170009088

2017-01-12

Method for removing substrates provided with organic coatings

20160333480

2016-11-17

Method of electrolessly plating nickel on tubulars

#10

20150044374

2015-02-12

Electroless nickel plating solution and method

#11

20120125659

2012-05-24

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

#12