120389 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment Multistep pretreatment
Sub-classes:METHOD FOR PRODUCING ALUMINUM ALLOY RAW MATERIAL, METHOD FOR PRODUCING ALUMINUM ALLOY INGOT, METHOD FOR PRODUCING ALUMINUM ALLOY PLATE, METHOD FOR PRODUCING ALUMINUM ALLOY SUBSTRATE FOR PLATING, METHOD FOR PRODUCING ALUMINUM ALLOY SUBSTRATE FOR MAGNETIC DISK, METHOD FOR PRODUCING MAGNETIC DISK, AND MAGNETIC DISK
#2WIRE AND METHOD FOR MANUFACTURING WIRE
#3JOINING STRUCTURE AND MANUFACTURING METHOD FOR SAME
#4Surface treating apparatus
#5Manufacturing a package using plateable encapsulant
#6Pretreatment of iron-based substrates for electroless plating
#7Process for Forming a Cobalt-Iron Alloy Film on a Substrate
#8Semiconductor package with plateable encapsulant and a method for manufacturing the same
#9Method for producing core-shell catalyst
#10UV CURABLE CATALYST COMPOSITIONS
#11Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
#12Method for producing magnetic cores
#13Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
#14Easy clean coating applied on stainless steel metallic surfaces used in the manufacture of household appliances
#15UV CURABLE CATALYST COMPOSITIONS
#16Painting pre-treatment processes with low environments impact, as an alternative to conventional phosphating treatments
#17SUBSTRATE, CONDUCTIVE PATTERN FORMATION PROCESS AND ORGANIC THIN FILM TRANSISTOR
#18Methods of forming fast ion conductors and memory devices comprising diffused metal ions
#19CATALYTIC SURFACE ACTIVATION METHOD FOR ELECTROLESS DEPOSITION
#20CATALYTIC SURFACE ACTIVATION METHOD FOR ELECTROLESS DEPOSITION
#21CATALYTIC SURFACE ACTIVATION METHOD FOR ELECTROLESS DEPOSITION
#22Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package
#23Plating method and apparatus
#24METHOD OF FORMING CONDUCTIVE TRACKS
#25CATALYTIC SURFACE ACTIVATION METHOD FOR ELECTROLESS DEPOSITION
#26Electro- and electroless plating of metal in the manufacture of PCRAM devices
#27Plating method and apparatus
#28UV curable catalyst compositions
#29Electro- and electroless plating of metal in the manufacture of PCRAM devices
#30Electro-and electroless plating of metal in the manufacture of PCRAM devices