120387 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment Use of metal, e.g. activation, sensitisation with noble metals
Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate
#2PATTERN FORMATION USING CATALYST BLOCKER
#3Printed circuit nanofiber web manufacturing method
#4MATERIAL DEPOSITION IN A MAGNETIC FIELD
#5Film formation method
#6Manufacturing a package using plateable encapsulant
#7Compositions and methods for forming articles having silver metal
#8Self-adsorbed catalyst composition, method for preparing the same and method for manufacturing electroless plating substrate
#9Semiconductor devices comprising nickel— and copper—containing interconnects
#10Silver-containing precursor and product articles containing cellulosic polymers
#11Process for improving performance of sliding rheostat of 5G communication high-frequency signal board
#12High resistivity soft magnetic material for miniaturized power converter
#13Semiconductor devices comprising nickel- and copper-containing interconnects
#14Semiconductor package with plateable encapsulant and a method for manufacturing the same
#15Surface functionalisation method
#16Plating method for printed layer
#17Gold plate coated material
#18Non-aqueous metal catalytic composition with oxyazinium photoreducing agent
#19Forming silver catalytic sites from reducible silver-oximes
#20Electrically-conductive proppant and methods for making and using same
#21Forming catalytic sites from reducible silver-heterocyclic complexes
#22Method for activating a copper surface for electroless plating
#23Stable tin free catalysts for electroless metallization
#24Two-step deposition with improved selectivity
#25Heat-insulating structure of member facing engine combustion chamber, and process for producing same
#26Method for forming a conductive pattern
#27Plating catalyst and method
#28Methods of forming interconnects and semiconductor structures
#29Primer for electroless plating comprising hyperbranched polymer and metal fine particles
#30Plating pretreatment solution and method for producing aluminum substrate for hard disk devices using same
#31Method of preparing a palladium-silver alloy gas separation membrane system
#32Method of making a composite gas separation module
#33COMPOSITION OF NANOPARTICLES
#34BACK ELECTRODE-TYPE SOLAR CELL AND METHOD OF MANUFACTURING THE SAME
#35High permeance sulfur tolerant Pd/Cu alloy membranes
#36ELECTROLESS PALLADIUM PLATING SOLUTION AND METHOD OF USE
#37Method for manufacturing wiring structure of wiring board
#38Biomolecular recognition of crystal defects
#39Nanoporous Material
#40Method of Applying Catalytic Solution for Use in Electroless Deposition
#41Methods of forming interconnects in a semiconductor structure
#42BARRIER LAYER, COMPOSITE ARTICLE COMPRISING THE SAME, ELECTROACTIVE DEVICE, AND METHOD
#43Process for improving the adhesion of polymeric materials to metal surfaces
#44METHOD FOR FORMING A NICKEL-BASED LAYERED STRUCTURE ON A MAGNESIUM ALLOY SUBSTRATE, A SURFACE-TREATED MAGNESIUM ALLOY ARTICLE MADE THEREFROM, AND A CLEANING SOLUTION AND A SURFACE TREATMENT SOLUTION USED THEREFOR
#45Active Filler particles in Inks
#46JET PRINTING OF PATTERNED METAL
#47Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures
#48Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method
#49Process for making a metal seed layer
#50Process for electroless copper deposition
#51Selective activation of aluminum, copper, and tungsten structures
#52Process for preparing palladium alloy composite membranes for use in hydrogen separation, palladium alloy composite membranes and products incorporating or made from the membranes
#53Metallic structures incorporating bioactive materials and methods for creating the same
#54Metallic structures incorporating bioactive materials and methods for creating the same
#55Selective nickel plating of aluminum, copper, and tungsten structures
#56Jet printing of patterned metal
#57Conductive electrolessly plated powder and method for making same
#58Metallic structures incorporating bioactive materials and methods for creating the same
#59Metal/ceramic bonding member and method for producing same
#60Method to fabricate amorphous electroless metal layers
#61Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
#62Metallic structures incorporating bioactive materials and methods for creating the same
#63Plating method including pretreatment of a surface of a base metal
#64Substrate processing method and substrate processing apparatus
#65Semiconductor device manufacturing method