120388 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
ELECTROLESS PLATING METHOD
#2METHODS FOR INFILTRATING GALLIUM INTO POROUS SCAFFOLDS
#3SELECTIVE POLYMER METALIZATION FOR COMPOSITE MATERIALS
#4METHOD AND COMPOSITION FOR METAL FINISHING
#5ELECTROLESS COPPER PLATING AND COUNTERACTING PASSIVATION
#6ELECTROLESS COPPER PLATING AND COUNTERACTING PASSIVATION
#7Cleaning solution for cleaning metal surfaces
#8Printed circuit nanofiber web manufacturing method
#9MATERIAL DEPOSITION IN A MAGNETIC FIELD
#10Manufacturing a package using plateable encapsulant
#11Method for producing hollow structure, plated composite, and hollow structure
#12Method and device for preparing high strength and durable super-hydrophobic film layer on inner wall of elongated metal tube
#13SURFACE-INDEPENDENT, SURFACE-MODIFYING, MULTIFUNCTIONAL COATINGS AND APPLICATIONS THEREOF
#14Semiconductor devices comprising nickel— and copper—containing interconnects
#15Emotion lighting apparatus for vehicle and method for manufacturing the same
#16Electrostatic coating of metal thin layers with adjustable film properties
#17Semiconductor devices comprising nickel- and copper-containing interconnects
#18Semiconductor package with plateable encapsulant and a method for manufacturing the same
#19METHOD FOR FORMING ORGANIC COATING ON NICKEL SURFACE
#20Plating method for printed layer
#21Metal plate coated stainless material and method of producing metal plate coated stainless material
#22Plating method and recording medium
#23Method of electrolessly plating nickel on tubulars
#24Metal catalytic compositions and articles therefrom
#25Method and composition for metal finishing
#26Forming catalytic sites from reducible silver complexes
#27Gold plate coated stainless material and method of producing gold plate coated stainless material
#28SILVER-PLATED STRUCTURE
#29Stable tin free catalysts for electroless metallization
#30Plating catalyst and method
#31Electroless plated material formed directly on metal
#32Methods of forming interconnects and semiconductor structures
#33Primer for electroless plating comprising hyperbranched polymer and metal fine particles
#34Direct Electroless Palladium Plating on Copper
#35Metallization mixtures and electronic devices
#36Metal coating of objects using plasma polymerisation pretreatment
#37Surface-independent, surface-modifying, multifunctional coatings and applications thereof
#38Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same
#39Metallization processes, mixtures, and electronic devices
#40SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#41Fabrication of semiconductor interconnect structure
#42METHOD FOR FORMING CORROSION-RESISTANT PLATING LAYER AND ROTARY MACHINE
#43Method of chrome plating magnesium and magnesium alloys
#44Biomolecular recognition of crystal defects
#45PROCESSES FOR TEXTURING A SURFACE PRIOR TO ELECTROLESS PLATING
#46MULTI-LAYERED NICKEL-PHOSPHOROUS COATINGS AND PROCESSES FOR FORMING THE SAME
#47Fabrication of semiconductor interconnect structure
#48METHOD FOR FORMING METAL FILM AND METHOD FOR FORMING METAL PATTERN
#49Micro-Arc Assisted Electroless Plating Methods
#50Methods of forming interconnects in a semiconductor structure
#51Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits
#52Substrate processing method and substrate processing apparatus
#53COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE
#54Substrate Processing Method and Substrate Processing Apparatus
#55Surface-independent, surface-modifying, multifunctional coatings and application thereof
#56Cobalt-based alloy electroless plating solution and electroless plating method using the same
#57Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures
#58Microfabrication using patterned topography and self-assembled monolayers
#59Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method
#60Selective activation of aluminum, copper, and tungsten structures
#61Electroless metal deposition methods
#62Production method of substrate with black film and substrate with black film
#63Microfabrication using patterned topography and self-assembled monolayers
#64Selective nickel plating of aluminum, copper, and tungsten structures
#65Electroless metal deposition methods
#66Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
#67Method of plating metal leafs and metal membranes
#68Plating method including pretreatment of a surface of a base metal
#69Electroless plating pre-treatment solution and electroles plating method
#70Electroless atomic layer deposition