120402 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
Systems and Methods for Deposition of Adhesion Augmented Atomic Palladium
#2CATALYST FOR WATER ELECTROLYSIS USING FLUORINE-DOPED TIN OXIDE SUPPORT AND METHOD FOR MANUFACTURING THE SAME
#3TIN OXIDE MULTILAYER FILM WITH CATALYST LAYER AND METHOD FOR FORMING SAME
#4Additive Solution-Processed Structural Colors
#5Additive Solution-Processed Structural Colors
#6SOLUTION AND PROCESS FOR THE ACTIVATION OF NONCONDUCTIVE AREA FOR ELECTROLESS PROCESS
#7ETCHING METHOD
#8SOLUTION AND PROCESS FOR THE ACTIVATION OF NONCONDUCTIVE AREA FOR ELECTROLESS PROCESS
#9Nickel-coated hexagonal boron nitride nanosheet composite powder, preparation and high performance composite ceramic cutting tool material
#10Composites and methods of making composite materials
#11Method of producing electroconductive substrate, electronic device and display device
#12METHOD FOR PRODUCING NOBLE METAL NANOCOMPOSITES
#13Manufacturing a package using plateable encapsulant
#14Electroless plating of silver onto graphite
#15Controlled growth of ultranarrow nanowires on functionalized 2D materials
#16HEAT RADIATING PLATE-LINED CERAMICS SUBSTRATE
#17Method for forming metal wiring
#18Method of producing electroconductive substrate, electronic device and display device
#19Method for forming circuit on substrate
#20Copper foil with carrier, copper foil with resin and method for manufacturing printed wiring board
#21Method for producing electroconductive laminate, three-dimensional structure with plated-layer precursor layer, three-dimensional structure with patterned plated layer, electroconductive laminate, touch sensor, heat generating member, and three-dimensional structure
#22Method for producing noble metal nanocomposites
#23Electrostatic coating of metal thin layers with adjustable film properties
#24Substrate processing apparatus, substrate processing method and recording medium
#25Electrode and process for preparing the electrode and devices thereof
#26Semiconductor package with plateable encapsulant and a method for manufacturing the same
#27ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRIMIDINE DERIVATIVE CONTAINING CATALYSTS
#28SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM
#29Metalization of surfaces
#30ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRIMIDINE DERIVATIVE CONTAINING CATALYSTS
#31Composites and methods of making composite materials
#32NOVEL ADHESION PROMOTING AGENTS FOR METALLISATION OF SUBSTRATE SURFACES
#33Polymer articles, ink compositions, and methods for selectively metalizing polymer articles
#34Method for forming a metal silicide using a solution containing gold ions and fluorine ions
#35Ceramic electronic component and manufacturing method therefor
#36Stable tin free catalysts for electroless metallization
#37Process of depositing a metallic pattern on a medium
#38Coating composition, composite prepared by using the coating composition and method for preparing the same
#39Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
#40FORMATION OF NANOSIZED METAL PARTICLES ON A TITANATE CARRIER
#41Process for application of metal
#42Methods and materials for anchoring gapfill metals
#43Method of metalizing surface and article obtainable
#44Electroless plating of silver onto graphite
#45Plating catalyst and method
#46Deposition of a silver layer on a nonconducting substrate
#47Primer for electroless plating comprising hyperbranched polymer and metal fine particles
#48Methods and materials for anchoring gapfill metals
#49Method and jig assembly for manufacturing outer blade cutting wheel
#50Graphite particle-supported Pt-shell/Ni-core nanoparticle electrocatalyst for oxygen reduction reaction
#51Solution and method for activating the oxidized surface of a semiconductor substrate
#52Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object
#53Solution and process for activating the surface of a semiconductor substrate
#54Highly ordered arrays of nanoholes in metallic films and methods for producing the same
#55Method of reducing magnetite formation
#56METHOD FOR FORMING A BLOCK COPOLYMER PATTERN
#57Composition for printing a seed layer and process for producing conductor tracks
#58METHOD OF FORMING CONDUCTIVE PATTERN AND ORGANIC THIN FILM TRANSISTOR
#59Metallization of a porous silicon zone by in situ reduction and application to a fuel cell
#60NANOWIRES USING A CARBON NANOTUBE TEMPLATE
#61Method and jig assembly for manufacturing outer blade cutting wheel
#62Magnetic composite powders, preparing method thereof and electromagnetic noise suppressing films comprising same
#63Resin composition containing catalyst precursor for electroless plating in forming electro-magnetic shielding layer, method of forming metallic pattern using the same, and metallic pattern formed by the same method
#64Biomolecular recognition of crystal defects
#65METHOD OF FABRICATING AN INTEGRATED CIRCUIT
#66Method for forming metal pattern, metal pattern and printed wiring board
#67ACTIVATION SOLUTION FOR ELECTROLESS PLATING ON DIELECTRIC LAYERS
#68Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits
#69Nanotube growth and device formation
#70PLATED SUBSTRATE AND ITS FABRICATION METHOD
#71Metal deposition
#72Stabilization and Performance of Autocatalytic Electroless Processes
#73METHOD OF FABRICATING METAL LINE BY WET PROCESS
#74Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating
#75Molded polymer comprising silicone and at least one metal trace
#76Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method
#77SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTROLESS COPPER PLATING
#78Electromagnetic-wave-shielding light-transmitting window member and method for producing the same
#79Surface modification method and surface modification apparatus for interlayer insulating film
#80Method for electroless plating and metal-plated article
#81Production method of substrate with black film and substrate with black film
#82Substrate processing method, semiconductor device production method, and semiconductor device
#83Process for fabrication of printed circuit boards
#84Process for producing a resin composition and electrophotographic fixing member
#85Metal plating method and pretreatment agent
#86Nanotube growth and device formation
#87Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
#88Formation of layers on substrates