C23C18/1875 - CPC Classification Index

ClassID:

120400 ⎘

C23C18/1875 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment

Sub-classes:

C23C18/1879 » {Use of metal, e.g. activation, sensitisation with noble metals} 136
C23C18/1882 » {Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers} 85

Recent Application in this class:

20240084447

Sealing article comprising metal coating, method of making and method of using the same

20240066561

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

20220408558

Structure with Conductive Pattern and Method for Manufacturing Same

20220356571

Sealing article comprising metal coating, method of making and method of using the same

20190093233

Non-Seed Layer Electroless Plating of Ceramic

20190093220

Sealing article comprising metal coating, method of making and method of using the same

20170350015

Electrode-forming composition

20170001709

Thermal acoustic insulation blankets

20150167174

PLATING APPARATUS, PLATING METHOD, AND STORAGE MEDIUM

20140083860

Plating catalyst and method

20120145555

Plating catalyst and method