C23C18/1886 - CPC Classification Index

ClassID:

120403 ⎘

C23C18/1886 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment Multistep pretreatment

Sub-classes:

C23C18/1889 » {with use of metal first} 73
C23C18/1893 » {with use of organic or inorganic compounds other than metals, first} 192

Recent Application in this class:

20250333846

CATALYST FOR WATER ELECTROLYSIS USING FLUORINE-DOPED TIN OXIDE SUPPORT AND METHOD FOR MANUFACTURING THE SAME

20210017650

Plated laminate and printed circuit board

20190211434

Thermal spraying of ceramic materials comprising metal or metal alloy coating

20180199442

Electroless plating method and ceramic substrate

20170204519

METHOD FOR PLATING NONWOVEN FABRIC BY USING CONTINUOUS ELECTROLESS AND ELECTROLYTIC PLATING PROCESSES

20170081766

METHOD FOR NO-SILANE ELECTROLESS METAL DEPOSITION USING HIGH ADHESIVE CATALYST AND PRODUCT THEREFROM

20160307759

Plating method, recording medium and plating system

20160038925

Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds

20160007476

Electroless plating method and ceramic substrate

20150111050

Process for coating a surface of a substrate made of nonmetallic material with a metal layer

20150004323

Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds

20110256413

Process for coating a surface of a substrate made of nonmetallic material with a metal layer

20110203518

Substrate processing method and apparatus

20100221432

Substrate processing method and apparatus