120405 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment; Multistep pretreatment with use of organic or inorganic compounds other than metals, first
METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMICONDUCTORS
#2PRODUCTION METHOD FOR PLATED SUBSTRATE
#3METAL-PLATED BORON NITRIDE NANOMATERIALS AND METHOD OF PRODUCING THE SAME
#4A METHOD FOR ACTIVATING A SURFACE OF A NON-CONDUCTIVE OR CARBON-FIBRES CONTAINING SUBSTRATE FOR METALLIZATION
#5METHOD FOR ELECTROLESSLY DEPOSITING A METAL LAYER ONTO A SUBSTRATE
#6Surface conditioner for electroless deposition
#7A METHOD FOR ACTIVATING A SURFACE OF A NON-CONDUCTIVE OR CARBON-FIBRES CONTAINING SUBSTRATE FOR METALLIZATION
#8AQUEOUS ALKALINE PRE-TREATMENT SOLUTION FOR USE PRIOR TO DEPOSITION OF A PALLADIUM ACTIVATION LAYER, METHOD AND USE THEREOF
#9ELECTROLESS NICKEL PLATING OF SILICONE RUBBER
#10Method of preparing nanocomposite material plated with network-type metal layer through silica self-cracks and wearable electronics carbon fiber prepared therefrom
#11Method for manufacturing surge absorbing device
#12PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM
#13PLATING METHOD, PLATING SYSTEM, AND RECORDING MEDIUM
#14Composites and methods of making composite materials
#15Method of producing electroconductive substrate, electronic device and display device
#16METHOD FOR FORMING METALLIZATION STRUCTURE
#17HEXAVALENT CHROMIUM FREE ETCH MANGANESE RECOVERY SYSTEM
#18Electroless copper plating polydopamine nanoparticles
#19Enhanced nickel plating process
#20METHOD OF FORMING MATERIAL FOR A CIRCUIT USING NICKEL AND PHOSPHOROUS
#21PLATED OBJECT AND METHOD OF FORMING THE SAME
#22COATED GLASS SLEEVES AND METHODS OF COATING GLASS SLEEVES
#23Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom
#24Electroless nickel plating of silicone rubber
#25Method of electroless nickle plating on surface of silicon carbide powder
#26METHOD FOR PROVIDING A MULTILAYER COATING ON A SURFACE OF A SUBSTRATE
#27Plating method, plating apparatus and recording medium
#28Thermal spraying of ceramic materials comprising metal or metal alloy coating
#29Metallization structure and manufacturing method thereof
#30Ceramic device and manufacturing method thereof
#31Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same
#32Process for depositing a metal or metal alloy on a surface of a substrate including its activation
#33Forming method of hard mask
#34Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same
#35Proppant having non-uniform electrically conductive coatings and methods for making and using same
#36Method of producing electroconductive substrate, electronic device and display device
#37METHOD OF FORMING A METAL LAYER ON A PHOTOSENSITIVE RESIN
#38Plating method
#39Hexavalent chromium free etch manganese recovery system
#40Method for producing electroconductive laminate, three-dimensional structure with plated-layer precursor layer, three-dimensional structure with patterned plated layer, electroconductive laminate, touch sensor, heat generating member, and three-dimensional structure
#41PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATALYSTS
#42METHOD OF FORMING METAL PATTERN
#43Method for manufacturing surge absorbing device
#44Green method for coating a substrate with silver nanoparticles
#45ELECTROLESS PLATING METHOD
#46Semiconductor device having a Pd-containing adhesion layer
#47Coated optical fibres having improved features
#48METHOD FOR PLATING ON SURFACE OF NON-CONDUCTIVE SUBSTRATE
#49Patterning of electroless metals by selective deactivation of catalysts
#50Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
#51Method for fine line manufacturing
#52Method for producing metal-plated stainless material
#53Method and apparatus for fabrication of metal-coated optical fiber, and the resulting optical fiber
#54Polymer product and method for selectively metallizing polymer substrate
#55Liquid jet head, method of manufacturing liquid jet head, and liquid jet device
#56Systems and methods for electroless plating of thin gold films directly onto silicon nitride and into pores in silicon nitride
#57Surface functionalisation method
#58Substrate surface metallization method and substrate having metallized surface manufactured by the same
#59Plating method, plated component, and plating system
#60Composites and methods of making composite materials
#61Method for electrical contact materials including Ag plated CNTs
#62Adhesion layer forming method, adhesion layer forming system and recording medium
#63NOVEL ADHESION PROMOTING AGENTS FOR METALLISATION OF SUBSTRATE SURFACES
#64Proppant having non-uniform electrically conductive coatings and methods for making and using same
#65Adhesion promoting process for metallisation of substrate surfaces
#66Electroless copper plating polydopamine nanoparticles
#67Method for coating of carbon nanomaterials
#68Method and apparatus for fabrication of metal-coated optical fiber, and the resulting optical fiber
#69Catalyst layer forming method, catalyst layer forming system, and recording medium
#70Gold nanostructures and processes for their preparation
#71Pre-treatment method of plating, storage medium, and plating system
#72Plating method, plating apparatus, and storage medium
#73Pre-treatment method for plating and storage medium
#74Forming conductive metal pattern using reactive polymers
#75Pre-treatment method for plating and storage medium
#76Plating method, plating system and storage medium
#77Method of manufacturing palladium thin film by using electroless-plating method
#78Electroless nickel plating solution and method
#79Three-dimensional copper nanostructure and fabrication method thereof
#80Adhesion promoting agents for metallization of substrate surfaces
#81Methods of plating or coating ultrasound transducers
#82Stabilized silver catalysts and methods
#83Deposition of a silver layer on a nonconducting substrate
#84Method for electroless metallization
#85Plating catalyst and method
#86Silver coating pigment, and method for producing same
#87Plating catalyst and method
#88Method for forming interconnection pattern and semiconductor device
#89METHOD OF MANUFACTURING TOUCH PANEL
#90COATED ARTICLE AND METHOD FOR MAKING SAME
#91Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board
#92NANO-SEEDING VIA DUAL SURFACE MODIFICATION OF ALKYL MONOLAYER FOR SITE-CONTROLLED ELECTROLESS METALLIZATION
#93Enhanced methods for fabricating solar cells with textured surfaces
#94Semiconductor device and manufacturing method of the same
#95Plating catalyst and method
#96Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method
#97Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization
#98Method of preparing low resistance metal line, patterned metal line structure, and display device using the same
#99Half mirror and process for producing same
#100METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME
#101Solar cells with textured surfaces
#102Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method
#103Process for the preparation of an organic film at the surface of a solid support with oxidizing treatment
#104Chemical modification process for a deep polymeric matrix
#105PROCESS FOR PREPARING A METALLIZED SUBSTRATE, SAID SUBSTRATE AND USES THEREOF
#106Metal-clad polymer article
#107PROCESS FOR PREPARING A MOULDED PRODUCT
#108Semiconductor device and manufacturing method of the same
#109Process for producing metal film
#110Process for producing metal film
#111METHOD FOR FORMING GRAFT POLYMER PATTERN AND METHOD FOR FORMING ELECTRICALLY CONDUCTIVE PATTERN
#112Process for applying a metal coating to a non-conductive substrate
#113Electroless deposition process on a silicon contact
#114METHOD FOR MANUFACTURING THREE-DIMENSIONAL CIRCUIT
#115METHODS OF TREATING A SURFACE TO PROMOTE METAL PLATING AND DEVICES FORMED
#116Metallization on a surface and in through-holes of a substrate and a catalyst used therein
#117Methods of treating a surface to promote metal plating and devices formed
#118MATERIAL FOR FORMING ELECTROLESS PLATE, COATING SOLUTION FOR ADHERING CATALYST, METHOD FOR FORMING ELECTROLESS PLATE, AND PLATING METHOD
#119ULSI wiring and method of manufacturing the same
#120ELECTRODE AND METHOD FOR FORMING THE SAME AND SEMICONDUCTOR DEVICE
#121METHOD FOR APPLYING A METAL ON A SUBSTRATE
#122Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor device
#123Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits
#124GRAFT PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING METHOD
#125Material for forming electroless plate and method for forming electroless plate using the same
#126Methods of Treating a Surface to Promote Metal Plating and Devices Formed
#127Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom
#128Metal-coated lipid bilayer vesicles and process for producing same
#129Material for forming electroless plate and method for producing electrolessly plated non-conductive substrate
#130Electroless Niwp Adhesion and Capping Layers for Tft Copper Gate Process
#131Metal deposition
#132Method of the application of a zinc sulfide buffer layer on a semiconductor substrate
#133METHOD OF PREPARING LOW RESISTANCE METAL LINE, PATTERNED METAL LINE STRUCTURE, AND DISPLAY DEVICE USING THE SAME
#134Nanoporous thin films and multi-functional layers via spatially organized polymers
#135Methods of making functionalized nanorods
#136Element substrate and method of manufacturing the same
#137Composite nanostructure apparatus and method
#138Plated substrate and method of manufacturing the same
#139Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof
#140Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide
#141Processes and systems for engineering a copper surface for selective metal deposition
#142Method of manufacturing interconnect substrate
#143Method of manufacturing interconnect substrate
#144Method of manufacturing interconnect substrate
#145PATTERNED ELECTROLESS METALLIZATION PROCESSES FOR LARGE AREA ELECTRONICS
#146Semiconductor device and fabrication method thereof
#147Fabrication of semiconductor interconnect structure
#148Reducing electrical resistance in electrolessly deposited copper interconnects
#149Method of forming metal on a substrate using a Ruthenium-based catalyst
#150Semiconductor device and manufacturing method using an ink-jet method of the same
#151Electroless deposition process on a silicon contact
#152Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization
#153Electroless deposition process on a silicide contact
#154Substrate processing apparatus and substrate processing method
#155Substrate processing apparatus and substrate processing method
#156Deposition of an intermediate catalytic layer on a barrier layer for copper metallization
#157Substrate processing apparatus and substrate processing method
#158Method for electroless plating and metal-plated article
#159Plating method and electronic device
#160Method of plating on a glass base plate and a method of manufacturing a perpendicular magnetic recording medium
#161Surface-coating method, production of microelectronic interconnections using said method and integrated circuits
#162Method of plating on a glass base plate, a method of manufacturing a disk substrate for a perpendicular magnetic recording medium, a disk substrate for a perpendicular magnetic recording medium, and a perpendicular magnetic recording medium
#163Patterning method, substrate for biomolecule immobilization using the patterning method, and biochip employing the substrate
#164Plating method
#165Optical filter for image display devices and manufacturing method thereof
#166Method of electroless plating on a glass substrate and method of manufacturing a magnetic recording medium using the method of electroless plating
#167Method of forming a metal thin film in a micro hole by ink-jet printing
#168ELECTROLESS PLATED NICKEL ON ZIRCONIA
#169Platable coating and plating process
#170Method of forming metal pattern having low resistivity
#171Ink-jet printing of coupling agents for trace or circuit deposition templating
#172Method of manufacturing a disk substrate for a magnetic recording medium
#173Method of treating a substrate for electroless plating and method of increasing adhesion therebetween, and magnetic recording medium and magnetic recording device thereof
#174Substrate processing method, semiconductor device production method, and semiconductor device
#175Electroless nickel plating method for the preparation of zirconia ceramic
#176Method for metallizing titanate-based ceramics
#177Method for manufacturing wiring substrate
#178Method for manufacturing wiring substrate
#179Pattern forming method, arranged fine particle pattern forming method, conductive pattern forming method, and conductive pattern material
#180Method of forming a pattern, conductive patterned material, and method of forming a conductive pattern
#181Wet processing method and processing apparatus of substrate
#182Surface graft material, conductive pattern material, and production method thereof
#183Electroless palladium nitrate activation prior to cobalt-alloy deposition
#184Microstructure array, mold for forming a microstructure array, and method of fabricating the same
#185Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus
#186Copper molybdenum electroless deposition process and materials
#187Methods of metallizing non-conductive substrates and metallized non-conductive substrates formed thereby
#188Electroless-plated deposit process for silicon based dielectric insulating material
#189Method for forming metal wires by microdispensing pattern
#190Substrate processing apparatus and substrate processing method
#191Metallization of ceramics
#192Method and apparatus for forming capping film
#193High resolution patterning method
#194Shielding coating for selective metallization
#195Shielding coating for selective metallization