Patents-Review.com
ClassID:

120607 ⎘

C23F1/32 - CPC Classification

Classification description:

Etching metallic material by chemical means; Etching compositions; Aqueous compositions Alkaline compositions

Sub-classes:
Recent Application in this class:
#1
20250250683
2025-08-07

ETCHING COMPOSITION, METHOD OF ETCHING METAL-CONTAINING LAYER BY USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE ETCHING COMPOSITION

 #2
20250214331
2025-07-03

GRAPHENE LAYER TRANSFER METHOD

 #3
20250125306
2025-04-17

PACKAGING METHOD AND PACKAGING BODY

 #4
20230268187
2023-08-24

Atomic layer etching

 #5
20220064803
2022-03-03

Hafnium oxide corrosion inhibitor

 #6
20210288172
2021-09-16

Substrate processing liquid for etching a metal layer, substrate processing method and substrate processing apparatus

 #7
20210273217
2021-09-02

Negative electrode comprising a protective layer for a lithium secondary battery, method for manufacturing same, and lithium secondary battery including same

 #8
20210175088
2021-06-10

Atomic layer etching

 #9
20200171722
2020-06-04

Manufacturing method of metal-polymer resin bonded component

 #10
20200020545
2020-01-16

Etching Composition

 #11
20180363473
2018-12-20

Fluidic machining method and system

 #12
20180355490
2018-12-13

METHOD FOR PRESERVING A MARK ON A METALLIC WORKPIECE

 #13
20180265989
2018-09-20

SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

 #14
20180221946
2018-08-09

Method allowing the removal of oxides present on the surface of nodules of a metal powder before using same in an industrial method

 #15
20170346175
2017-11-30

Composite material, shell for mobile device, their manufacturing methods, and mobile device

 #16
20170287699
2017-10-05

Substrate processing apparatus, liquid processing method, and storage medium

 #17
20170107628
2017-04-20

Method for preserving a mark on a metallic workpiece

 #18
20170060282
2017-03-02

METHOD OF SELECTIVELY ETCHING A METAL LAYER FROM A MICROSTRUCTURE

 #19
20160258299
2016-09-08

Fluidic machining method and system

 #20
20160133349
2016-05-12

Nanostructure, method of preparing the same, and panel units comprising the nanostructure

 #21
20160126024
2016-05-05

Switch contact element and its preparation method

 #22
20160047053
2016-02-18

ETCHING SOLUTION, ETCHING SOLUTION KIT, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE PRODUCT

 #23
20150275375
2015-10-01

Generation of compact alumina passivation layers on aluminum plasma equipment components

 #24
20150275361
2015-10-01

Conditioned semiconductor system parts

 #25
20150267112
2015-09-24

Etching composition

 #26
20140141622
2014-05-22

Process for etching metals

 #27
20130203231
2013-08-08

Selective etch chemistry for gate electrode materials

 #28
20120312784
2012-12-13

Surface roughening agent for aluminum, and surface roughening method using said surface roughening agent

 #29
20100320457
2010-12-23

ETCHING SOLUTION COMPOSITION

 #30
20090215265
2009-08-27

Low-stain polishing composition

 #31
20080053491
2008-03-06

WAFER PROTECTION SYSTEM EMPLOYED IN CHEMICAL STATIONS

 #32
20070044817
2007-03-01

WAFER PROTECTION SYSTEM EMPLOYED IN CHEMICAL STATIONS

 #33
20060260646
2006-11-23

Method to address carbon incorporation in an interpoly oxide

 #34
20060207970
2006-09-21

Printed circuit patterned embedded capacitance layer

 #35
20060065286
2006-03-30

Method to address carbon incorporation in an interpoly oxide