120608 ⎘
Etching metallic material by chemical means; Etching compositions; Aqueous compositions; Alkaline compositions for etching copper or alloys thereof
COMPOSITION, METHOD OF TREATING METAL-CONTAINING LAYER BY USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
#2COMPOSITION, METHOD OF TREATING METAL-CONTAINING LAYER BY USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
#3PROCESS FOR ETCHING CIRCUIT BOARD WITH ALKALINE TETRAAMMINECOPPER (II) SULFATE AND APPARATUS THEREFOR
#4ETCHING COMPOSITIONS
#5ETCHING COMPOSITIONS
#6AN AQUEOUS BASIC ETCHING COMPOSITION FOR THE TREATMENT OF SURFACES OF METAL SUBSTRATES
#7Methods for wet atomic layer etching of copper
#8Eco-friendly hydrophobic or ultrahydrophobic coating method
#9Nanotextured metal powders for 3D printing of metals
#10Etching chelating agent, manufacturing method thereof, and etching solution composition
#11CONTINUOUS ETCHING SYSTEM
#12Chemical liquid and method for treating object to be treated
#13Alkaline cupric chloride etchant for printed circuit board
#14Ruthenium etching composition and method
#15Superhydrophobic surface arrangement, article compromising same and method of manufacture thereof
#16Manufacture method of array substrate and array substrate manufactured by the method
#17Methods of modifying surfaces of diamond particles, and related diamond particles and earth-boring tools
#18METHOD OF IMPROVING LIFETIME OF ETCHING LIQUID AND YIELD IN CU-INTERCONNECTION PROCESS AND CU-INTERCONNECTION ETCHING DEVICE
#19Microetching solution for copper, replenishment solution therefor and method for production of wiring board
#20Selective metal/metal oxide etch process
#21Removal composition for selectively removing hard mask and methods thereof
#22Removal composition for selectively removing hard mask and methods thereof
#23SUPERHYDROPHOBIC SURFACE ARRANGEMENT, ARTICLE COMPRISING SAME, AND METHOD OF MANUFACTURE THEREOF
#24Method of improving lifetime of etching liquid and yield in Cu-interconnection process and Cu-interconnection etching device
#25Etching agent for copper or copper alloy
#26High-efficiency high-quality and safe alkaline cupric chloride etchant for printed circuit board
#27Wet etching methods for copper removal and planarization in semiconductor processing
#28Microetching solution for copper, replenishment solution therefor and method for production of wiring board
#29ETCHED SILICON STRUCTURES, METHOD OF FORMING ETCHED SILICON STRUCTURES AND USES THEREOF
#30Selective etching of copper and copper-barrier materials by an aqueous base solution with fluoride addition
#31Etching agent for copper or copper alloy
#32Reduced isotropic etchant material consumption and waste generation
#33Method for processing a surface
#34Wet etching methods for copper removal and planarization in semiconductor processing
#35Etching composition, method of forming a metal pattern and method of manufacturing a display substrate
#36Etching liquid for film of multilayer structure containing copper layer and molybdenum layer
#37Method for processing a surface
#38Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
#39Fabrication of semiconductor interconnect structure
#40Method of producing a hydrogen production filter
#41Reduced isotropic etchant material consumption and waste generation
#42COPPER CHELATING AGENT, COMPOSITION INCLUDING THE AGENT, AND METHODS OF FORMING AND USING THE AGENT AND COMPOSITION
#43Method of cleaning firearms and ordnance
#44Modulated metal removal using localized wet etching
#45Wet etching methods for copper removal and planarization in semiconductor processing
#46Fabrication of semiconductor interconnect structure
#47Method for kinetically controlled etching of copper
#48Method for processing a surface
#49Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
#50Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
#51Method of cleaning firearms and ordnance
#52AQUEOUS CLEANER WITH LOW METAL ETCH RATE
#53Method and Composition for Improving Adhesion of Organic Polymer Coatings with Copper Surface
#54Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
#55Polishing composition and polishing method
#56Fabrication of semiconductor interconnect structure
#57ETCHING APPARATUS
#58Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxide
#59Printed circuit patterned embedded capacitance layer
#60Etching solution, method of etching and printed wiring board
#61Method for isotropic etching of copper
#62Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
#63Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
#64Remover compositions for dual damascene system
#65Compositions and processes for photoresist stripping and residue removal in wafer level packaging
#66Reactive fluid systems for removing deposition materials and methods for using same
#67Dissolution of copper metal in aqueous alkanolamine to form copper containing aqueous solution
#68Method for isotropic etching of copper
#69Petroleum-free, ammonia-free cleaner for firearms and ordnance