120618 ⎘
Brightening metals by chemical means Heavy metals
Sub-classes:METHOD FOR FORMING SUPERHYDROPHILIC OXIDE FILM ON PURE TITANIUM SURFACE
#2Method for Coating a Motor Vehicle Bodyshell Part, and Motor Vehicle Bodyshell Part
#3Fluid composition and method for conducting a material removing operation
#4Laminate for see-through electrodes, see-through electrode material, device and method for producing laminate for see-through electrodes
#5Anti-corrosion polishing composition
#6Copper plasma etching method and manufacturing method of display panel
#7Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
#8Polishing compositions
#9Buffered slurry formulation for cobalt CMP
#10Chemical mechanical polishing (CMP) of cobalt-containing substrate
#11CMP slurry composition for polishing copper and polishing method using the same
#12CMP polishing agent, manufacturing method thereof, and method for polishing substrate
#13Cobalt polishing accelerators
#14CMP slurry composition for metal wiring and polishing method using the same
#15MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SLURRY FOR CHEMICAL MECHANICAL POLISHING
#16Tungsten-processing slurry with cationic surfactant
#17Tungsten-processing slurry with cationic surfactant and cyclodextrin
#18Slurry for chemical mechanical polishing of cobalt
#19Corrosion inhibitors and related compositions and methods
#20Wet etching methods for copper removal and planarization in semiconductor processing
#21POLISHING COMPOSITION
#22Metal foil and electronic device
#23Polishing composition
#24Method of surface-treating metal component
#25COMPOSITIONS AND METHODS FOR SELECTIVE POLISHING OF PLATINUM AND RUTHENIUM MATERIALS
#26Polishing slurry composition
#27Wet etching methods for copper removal and planarization in semiconductor processing
#28METHOD OF PREVENTING OXIDATION OF MULTILAYER WIRINGS IN ULTRA LARGE SCALE INTEGRATED CIRCUITS AFTER ALKALINE POLISHING
#29Ultrapure colloidal silica for use in chemical mechanical polishing applications
#30Polishing slurry and polishing method
#31Stent With Reduced Weld Profiles and a Closed-End Wire Configuration
#32Polishing slurry for metal films and polishing method
#33POLISHING LIQUID FOR METALS
#34Polishing composition
#35CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME
#36Oxidation-stabilized CMP compositions and methods
#37POLISHING COMPOSITION
#38POLISHING COMPOSITION
#39CMP slurry composition for forming metal wiring line
#40Wet etching methods for copper removal and planarization in semiconductor processing
#41POLISHING SLURRY FOR CMP
#42Free Radical-Forming Activator Attached to Solid and Used to Enhance CMP Formulations
#43POLISHING SLURRIES FOR CHEMICAL-MECHANICAL POLISHING
#44Low-stain polishing composition
#45METHOD FOR PRODUCING ABRASIVE COMPOSITION
#46Sarcosine compound used as corrosion inhibitor
#47Polishing slurry and polishing method
#48Copper-passivating CMP compositions and methods
#49COMPOSITIONS AND METHODS FOR RUTHENIUM AND TANTALUM BARRIER CMP
#50Composition useful to chemical mechanical planarization of metal
#51Ruthenium CMP compositions and methods
#52Free radical-forming activator attached to solid and used to enhance CMP formulations
#53POLISHING LIQUID AND POLISHING METHOD USING THE SAME
#54METAL-POLISHING COMPOSITION AND CHEMICAL MECHANICAL POLISHING METHOD BY USING THE SAME
#55CMP method for gold-containing substrates
#56Fabrication process of semiconductor device and polishing method
#57Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
#58Copper damascene chemical mechanical polishing (CMP) for thin film head writer fabrication
#59Tantalum CMP compositions and methods
#60Gold CMP composition and method
#61Ultrapure colloidal silica for use in chemical mechanical polishing applications
#62Polishing slurry and polishing method
#63Oxidation-stabilized CMP compositions and methods
#64Polishing liquid for metals
#65Metal- polishing liquid and chemical-mechanical polishing method using the same
#66Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
#67Copper CMP slurry composition
#68Polishing composition and polishing method
#69Polishing slurry for CMP and polishing method
#70CMP of copper/ruthenium substrates
#71Ultrapure colloidal silica for use in chemical mechanical polishing applications
#72CMP slurry, preparation method thereof and method of polishing substrate using the same
#73METHOD AND APPARATUS FOR FORMING DEVICE FEATURES IN AN INTEGRATED ELECTROLESS DEPOSITION SYSTEM
#74Metal polishing liquid and polishing method using it
#75CMP SLURRY DELIVERY SYSTEM AND METHOD OF MIXING SLURRY THEREOF
#76Polishing liquid composition
#77Polishing slurries and methods for chemical mechanical polishing
#78Polishing slurries and methods for chemical mechanical polishing
#79Polishing compound
#80Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
#81Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
#82Chemical mechanical polishing compositions for step-ll copper line and other associated materials and method of using same
#83Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
#84Polishing liquid composition
#85Profile control using selective heating
#86Metal CMP process on one or more polishing stations using slurries with oxidizers
#87Fabrication process of semiconductor device and polishing method
#88Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
#89CMP SLURRY DELIVERY SYSTEM AND METHOD OF MIXING SLURRY THEREOF
#90Free radical-forming activator attached to solid and used to enhance CMP formulations
#91Method for making a contact magnetic transfer template
#92Method of polishing film to be polished
#93Colloidal silica based chemical mechanical polishing slurry
#94Slurry composition and methods for chemical mechanical polishing
#95Free radical-forming activator attached to solid and used to enhance CMP formulations
#96Planarization films for advanced microelectronic applications and devices and methods of production thereof
#97Systems, methods and slurries for chemical mechanical polishing
#98Metal surface protective film forming agent and use thereof
#99Transition radiation apparatus and method therefor
#100Compositions and methods for tantalum CMP
#101Stent with reduced weld profiles and a closed-end wire configuration
#102Polishing slurries and methods for chemical mechanical polishing
#103One step copper damascene CMP process and slurry
#104Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
#105Compositions for planarization of metal-containing surfaces using halogens and halide salts
#106Polishing composition
#107Method for planarizing an interconnect structure
#108Polishing fluid and polishing method
#109Method of manufacturing semiconductor device
#110Cobalt inhibitor combination for improved dishing