120619 ⎘
Brightening metals by chemical means; Heavy metals with acidic solutions
CHEMICAL POLISHING BATH FOR TITANIUM AND TITANIUM ALLOYS, AND METHOD USING SUCH A BATH
#2METHOD FOR MANUFACTURING A WAVEGUIDE DEVICE BY ADDITIVE MANUFACTURING AND POLISHING
#3Method For Manufacturing Ceramic Circuit Board
#4Method and device for improving the surface condition of a turbomachine component
#5Barrier Chemical Mechanical Planarization Slurries For Cobalt Films
#6Etching composition, method for etching insulating film of semiconductor devices using the same and method for preparing semiconductor devices
#7Method to increase barrier film removal rate in bulk tungsten slurry
#8Dual additive composition for polishing memory hard disks exhibiting edge roll off
#9Method for removing rouging from stainless steel
#10METHOD FOR INSPECTING AND PROCESSING HIGH ALLOY STEELS
#11COMPOSITION FOR TUNGSTEN CMP
#12Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives
#13Chemical mechanical polishing method for tungsten
#14Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates
#15Formulation and method for inhibiting carbon-based deposits
#16Polishing slurry composition
#17Slurry composition for polishing tungsten
#18Polishing Composition and Polishing Method
#19Method for inspecting and processing high hardness alloy steels
#20Slurry for chemical mechanical polishing of cobalt
#21Corrosion inhibitors and related compositions and methods
#22Brightening and passivation of stainless steel surfaces
#23Composition for tungsten buffing
#24POLISHING COMPOSITION
#25CMP method for suppression of titanium nitride and titanium/titanium nitride removal
#26Polishing slurry and substrate polishing method using the same
#27Polishing composition
#28CMP compositions and methods for polishing nickel phosphorous surfaces
#29Method for etching metal or metal oxide by ozone water, method for smoothing surface of metal or metal oxide by ozone water, and patterning method using ozone water
#30Apparatuses and methods for gas mixed liquid polishing, etching, and cleaning
#31COMPOSITIONS AND METHODS FOR SELECTIVE POLISHING OF PLATINUM AND RUTHENIUM MATERIALS
#32POLISHING COMPOSITION AND POLISHING METHOD
#33CMP composition containing zirconia particles and method of use
#34Method of removing work-affected layer
#35CMP slurry composition for tungsten
#36Apparatuses and methods for gas mixed liquid polishing, etching, and cleaning
#37Manufacturing method of timepiece part and timepiece part
#38Polishing slurry and polishing method
#39Abrasive liquid for metal and method for polishing
#40Polishing Composition and Polishing Method
#41BATTERY PACK AND METHOD OF MANUFACTURING SAME
#42SLURRY CONTAINING MULTI-OXIDIZER AND MIXED NANO-ABRASIVES FOR TUNGSTEN CMP
#43Polishing solution for metal films and polishing method using the same
#44Polishing slurry for metal films and polishing method
#45POLISHING LIQUID FOR METALS
#46Polishing liquid for metal film and polishing method
#47POLISHING SLURRY AND METHOD OF POLISHING
#48CHEMICAL MECHANICAL POLISHING COMPOSITIONS FOR COPPER AND ASSOCIATED MATERIALS AND METHOD OF USING SAME
#49CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME
#50Oxidation-stabilized CMP compositions and methods
#51CONTROLLING PASSIVATING FILM PROPERTIES USING COLLOIDAL PARTICLES, POLYELECTROLYTES, AND IONIC ADDITIVES FOR COPPER CHEMICAL MECHANICAL PLANARIZATION
#52POLISHING COMPOSITION
#53Metal polishing slurry and polishing method
#54CMP slurry composition for forming metal wiring line
#55Composition and method for improved adhesion of polymeric materials to copper alloy surfaces
#56Aqueous Solution for Chemical Polishing and Deburring and Process for Polishing and Deburring A Part made of Pure Nickel or Nickel-200 Therein
#57POLISHING COMPOSITION
#58POLISHING SLURRY FOR CMP
#59Polishing slurry
#60Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals
#61Compositions for polishing aluminum/copper and titanium in damascene structures
#62POLISHING SLURRIES FOR CHEMICAL-MECHANICAL POLISHING
#63Composition and method for polishing nickel-phosphorous-coated aluminum hard disks
#64Polishing slurry and polishing method
#65Method of passivating chemical mechanical polishing compositions for copper film planarization processes
#66Copper-passivating CMP compositions and methods
#67COMPOSITIONS AND METHODS FOR RUTHENIUM AND TANTALUM BARRIER CMP
#68Polishing slurry for metal, and polishing method
#69Slurry composition for chemical mechanical polishing of metal and polishing method using the same
#70Slurry containing multi-oxidizer and nano-abrasives for tungsten CMP
#71Compositions and methods for rapidly removing overfilled substrates
#72Potassium monopersulfate solutions
#73POLISHING LIQUID AND POLISHING METHOD USING THE SAME
#74Method for Chemical-Mechanical Planarization of Copper
#75Method of chemical mechanical polishing of a copper structure using a slurry having a multifunctional activator
#76Method for removal of bulk metal contamination from III-V semiconductor substrates
#77Chemical assisted lapping and polishing of metals
#78Method and slurry for reducing corrosion on tungsten during chemical mechanical polishing
#79Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries
#80Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
#81Selective barrier metal polishing method
#82Copper damascene chemical mechanical polishing (CMP) for thin film head writer fabrication
#83STABILIZER FOR ACIDIC, METAL-CONTAINING POLISHING BATHS
#84METHODS AND COMPOSITIONS FOR WET ETCHING
#85Composition for Chemical-Mechanical Polishing (Cmp)
#86Polishing slurry and polishing method
#87Polishing slurry and polishing method
#88Potassium monopersulfate solutions
#89Method of polishing a tungsten-containing substrate
#90Polishing slurry and polishing method
#91Cleaning and polishing rusted iron-containing surfaces
#92Oxidation-stabilized CMP compositions and methods
#93Polishing composition for a tungsten-containing substrate
#94Polishing liquid for metals
#95PASSIVATIVE CHEMICAL MECHANICAL POLISHING COMPOSITION FOR COPPER FILM PLANARIZATION
#96Compositions and methods for CMP of phase change alloys
#97Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
#98Metal-polishing liquid and chemical-mechanical polishing method using the same
#99Polishing method
#100Methods for chemically treating a substrate using foam technology
#101Polishing composition and polishing method
#102COPPER-BASED METAL POLISHING SOLUTION AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#103Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated method
#104Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries
#105Polishing liquid composition
#106Polishing slurries and methods for chemical mechanical polishing
#107Surface treating method and surface-treating apparatus
#108Polishing method
#109Polishing slurries and methods for chemical mechanical polishing
#110Methods for planarization of group VIII metal-containing surfaces using oxidizing agents
#111Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
#112Chemical mechanical polishing compositions for step-ll copper line and other associated materials and method of using same
#113Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
#114Method of washing a polished object
#115Polishing liquid composition
#116Metal CMP process on one or more polishing stations using slurries with oxidizers
#117Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
#118Method and system for reducing wafer edge tungsten residue utilizing a spin etch
#119Solution for etching copper surfaces and method of depositing metal on copper surfaces
#120Slurry for polishing copper film and method for polishing copper film using the same
#121Novel polishing slurries and abrasive-free solutions having a multifunctional activator
#122Polishing medium for chemical-mechanical polishing, and method of polishing substrate member
#123Polishing solutions
#124Novel slurry for chemical mechanical polishing of metals
#125Novel slurry for chemical mechanical polishing of metals
#126Pickling or brightening/passivating solution and process for steel and stainless steel
#127Polishing medium for chemical-mechanical polishing, and method of polishing substrate member
#128Compositions and methods for tantalum CMP
#129Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals
#130Surface treatment method for vacuum member
#131Method of polishing a tungsten-containing substrate
#132Chemical mechanical polishing slurry for polishing copper layer on a wafer
#133Method of passivating chemical mechanical polishing compositions for copper film planarization processes
#134Passivative chemical mechanical polishing composition for copper film planarization
#135Polishing slurries and methods for chemical mechanical polishing
#136Compositions and methods for chemical mechanical planarization of tungsten and titanium
#137Compositions and methods for polishing copper
#138Polishing composition and polishing method
#139Chemical agent additives in copper CMP slurry
#140Copper-based metal polishing solution and method for manufacturing semiconductor device
#141Multi-step polishing solution for chemical mechanical planarization
#142Polishing fluid and polishing method
#143Compositions and methods for rapidly removing overfilled substrates
#144Slurry for polishing copper film and method for polishing copper film using the same
#145Polishing fluid and method of polishing
#146Methods for planarization of Group VIII metal-containing surfaces using complexing agents
#147Chemical mechanical polishing systems and methods for their use
#148Compositions and methods for low downforce pressure polishing of copper
#149Chemical mechanical polishing slurries and cleaners containing salicylic acid as a corrosion inhibitor
#150Slurry for CMP, polishing method and method of manufacturing semiconductor device
#151Abrasive liquid for metal and method for polishing
#152Slurry compositions for chemical mechanical polishing of copper and barrier films
#153Polishing method
#154Novel slurry for chemical mechanical polishing of metals
#155Polishing fluid and polishing method
#156Particle-free polishing fluid for nickel-based coating planarization
#157Method of polishing C4 molybdenum masks to remove molybdenum peaks
#158Slurry and method for chemical-mechanical planarization of copper
#159Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same
#160Polishing slurry and method for chemical-mechanical polishing of copper
#161Composition for chemical-mechanical polishing and method of using same
#162Chemical mechanical polishing method for tungsten