ClassID:

120716

C23G1/20 - CPC Classification

Classification description:

Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions Other heavy metals

Sub-classes:
Recent Application in this class:
#1
20250305152
2025-10-02

COMPOSITION, ITS USE AND A PROCESS FOR CLEANING SUBSTRATES COMPRISING COBALT AND COPPER

#2
20250180997
2025-06-05

COPPER SURFACE PASSIVATION COMPOSITION, USE THEREOF, AND PHOTORESIST STRIPPER CONTAINING SAME

#3
20250051901
2025-02-13

METHOD FOR SURFACE TREATMENT OF CORROSION-RESISTANT NICKEL-BASED ALLOY AND ITS STRUCTURE

#4
20190381539
2019-12-19

Method and system for cleaning copper-exposed substrate

#5
20190345419
2019-11-14

Cleaning liquid composition

#6
20180251712
2018-09-06

Post chemical mechanical polishing formulations and method of use

#7
20180204764
2018-07-19

Post-etch residue removal for advanced node beol processing

#8
20180127889
2018-05-10

Zinc coating-forming method for drawing of metallic pipes

#9
20180057773
2018-03-01

Alkaline molybdenum cation and phosphonate-containing cleaning composition

#10
20160167139
2016-06-16

Cutting tool, manufacturing method for cutting tool, and method for manufacturing cut product using cutting tool

#11
20160130500
2016-05-12

Compositions and methods for selectively etching titanium nitride

#12
20160059273
2016-03-03

Method and system for cleaning copper-exposed substrate

#13
20160010216
2016-01-14

Method for the production of metal sheet having a ZnMg or ZnAlMg coating, comprising the application of a basic solution of a magnesium ion complexing agent, and resulting metal sheet

#14
20150299628
2015-10-22

Composition for removing and preventing formation of oxide on the surface of metal wire

#15
20150210966
2015-07-30

Cleaning liquid for semiconductor elements and cleaning method using same

#16
20150194232
2015-07-09

Metal foil and electronic device

#17
20150005219
2015-01-01

Use of phenol compounds as activator for metal surface corrosion

#18
20150000696
2015-01-01

Method for smut removal during stripping of coating

#19
20140030425
2014-01-30

Adhesion promotion in printed circuit boards

#20
20130143785
2013-06-06

Cleaning liquid composition for electronic device

#21
20130048598
2013-02-28

Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid

#22
20120328445
2012-12-27

GRIT BLAST FREE THERMAL BARRIER COATING REWORK

#23
20120302483
2012-11-29

Photoresist removal

#24
20120283163
2012-11-08

Copper cleaning and protection formulations

#25
20120065120
2012-03-15

Cleaning and corrosion inhibition system and composition for surfaces of aluminum or colored metals and alloys thereof under alkaline conditions

#26
20110301072
2011-12-08

METHOD OF REDUCING CORROSION USING A WAREWASHING COMPOSITION

#27
20110160114
2011-06-30

CLEANING COMPOSITIONS CONTAINING WATER SOLUBLE MAGNESIUM COMPOUNDS AND METHODS OF USING THEM

#28
20100256034
2010-10-07

COPPER CHELATING AGENT, COMPOSITION INCLUDING THE AGENT, AND METHODS OF FORMING AND USING THE AGENT AND COMPOSITION

#29
20100234262
2010-09-16

Cleaning compositions containing water soluble magnesium compounds and methods of using them

#30
20100206527
2010-08-19

In-Situ Treatment of Metallic Surfaces

#31
20100173820
2010-07-08

Compositions including hardness ions and gluconate and methods employing them to reduce corrosion and etch

#32
20100055344
2010-03-04

Process for Producing a Sheet Steel Product Coated with an Anticorrosion System

#33
20100012154
2010-01-21

Method for removing deposits containing magnetite and copper from containers in industrial and power plants

#34
20090312219
2009-12-17

Cleaning composition

#35
20090227483
2009-09-10

Stripper for dry film removal

#36
20090149363
2009-06-11

Compositions including hardness ions and gluconate and methods employing them to reduce corrosion and etch

#37
20090139872
2009-06-04

Method for producing a sheet steel product protected against corrosion

#38
20090120457
2009-05-14

COMPOSITIONS AND METHOD FOR REMOVING COATINGS AND PREPARATION OF SURFACES FOR USE IN METAL FINISHING, AND MANUFACTURING OF ELECTRONIC AND MICROELECTRONIC DEVICES

#39
20090118153
2009-05-07

Metals compatible post-etch photoresist remover and/or sacrificial antireflective coating etchant

#40
20090084408
2009-04-02

Method of Cleaning Cavities on Gas Turbine Components

#41
20090068846
2009-03-12

COMPOSITIONS AND METHOD FOR TREATING A COPPER SURFACE

#42
20080300160
2008-12-04

Compositions including magnesium ion, calcium ion, and silicate and methods employing them to reduce corrosion and etch

#43
20080287335
2008-11-20

Compositions including hardness ion and threshold agent and methods employing them to reduce corrosion and etch

#44
20080287334
2008-11-20

Compositions including Ca and Mg ions and gluconate and methods employing them to reduce corrosion and etch

#45
20080280800
2008-11-13

Cleaning compositions with water insoluble conversion agents and methods of making and using them

#46
20080276967
2008-11-13

Cleaning compositions containing water soluble magnesium compounds and methods of using them

#47
20080274939
2008-11-06

WATER TREATMENT SYSTEM AND DOWNSTREAM CLEANING METHODS

#48
20080274933
2008-11-06

Mg++ chemistry and method for fouling inhibition in heat processing of liquid foods and industrial processes

#49
20080274932
2008-11-06

COMPOSITION FOR IN SITU MANUFACTURE OF INSOLUBLE HYDROXIDE WHEN CLEANING HARD SURFACES AND FOR USE IN AUTOMATIC WAREWASHING MACHINES AND METHODS FOR MANUFACTURING AND USING

#50
20080274930
2008-11-06

Method of reducing corrosion using a warewashing composition

#51
20080274928
2008-11-06

WATER SOLUBLE MAGNESIUM COMPOUNDS AS CLEANING AGENTS AND METHODS OF USING THEM

#52
20080234164
2008-09-25

Alkaline cleaner for cleaning aluminum surfaces

#53
20080108539
2008-05-08

Cleaning and corrosion inhibition system and composition for surfaces of aluminum or colored metals and alloys thereof under alkaline conditions

#54
20080047592
2008-02-28

Alkaline chemistry for post-CMP cleaning comprising tetra alkyl ammonium hydroxide

#55
20070240734
2007-10-18

METHOD OF CLEANING POST-CMP WAFER

#56
20070181532
2007-08-09

CMP CLEAN PROCESS FOR HIGH PERFORMANCE COPPER/LOW-K DEVICES

#57
20070125459
2007-06-07

Oxide cleaning and coating of metallic components

#58
20060102879
2006-05-18

Methods to stop copper attach by alkaline etching agents such as ammonia and monoethanol amine (MEA)

#59
20060086620
2006-04-27

Textured decorative plating on plastic components

#60
20060063687
2006-03-23

Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate

#61
20060003910
2006-01-05

Composition and method comprising same for removing residue from a substrate

#62
20050247675
2005-11-10

Treatment of dies prior to nickel silicide formation

#63
20050181961
2005-08-18

Alkaline chemistry for post-CMP cleaning

#64
20050126429
2005-06-16

Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)