ClassID:

120717

C23G1/205 - CPC Classification

Classification description:

Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions; Other heavy metals refractory metals

Recent Application in this class:
#1
20260098346
2026-04-09

COMPOSITION, METHOD OF TREATING METAL-CONTAINING LAYER BY USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME

#2
20240368770
2024-11-07

PREPARATION FOR PRE-TREATING SURFACES BY CHEMICALLY CONVERTING OXIDE LAYERS OF TITANIUM OR TITANIUM ALLOYS

#3
20240018640
2024-01-18

METHOD FOR SURFACE TREATMENT BY SELECTIVE REMOVAL OF A BONDING PRIMER ON A TITANIUM OR TITANIUM ALLOY SUBSTRATE

#4
20200013598
2020-01-09

MOLYBDENUM CONTAINING TARGETS

#5
20190127858
2019-05-02

Solution and method for etching titanium based materials

#6
20180076011
2018-03-15

Molybdenum containing targets

#7
20170009136
2017-01-12

Selective etching of reactor surfaces

#8
20150332903
2015-11-19

Molybdenum containing targets for touch screen device

#9
20150210966
2015-07-30

Cleaning liquid for semiconductor elements and cleaning method using same

#10
20150000697
2015-01-01

Oxidizing aqueous cleaner for the removal of post-etch residues

#11
20130224422
2013-08-29

Method of making molybdenum containing targets comprising molybdenum, titanium, and tantalum or chromium

#12
20130203231
2013-08-08

Selective etch chemistry for gate electrode materials

#13
20110186086
2011-08-04

Oxidizing aqueous cleaner for the removal of post-etch residues

#14
20110147341
2011-06-23

ETCHING SOLUTION FOR TITANIUM-BASED METAL, TUNGSTEN-BASED METAL, TITANIUM/TUNGSTEN-BASED METAL OR THEIR NITRIDES

#15
20110117375
2011-05-19

Molybdenum containing targets

#16
20110056914
2011-03-10

Process for the stripping of workpieces and stripping solution

#17
20100275952
2010-11-04

Selective etching of reactor surfaces

#18
20090215658
2009-08-27

Oxidizing aqueous cleaner for the removal of post-etch residues

#19
20090165596
2009-07-02

Removal of niobium second phase particle deposits from pickled zirconium-niobium alloys

#20
20080230090
2008-09-25

Removal of niobium second phase particle deposits from pickled zirconium-niobium alloys

#21
20080004193
2008-01-03

Semiconductor process residue removal composition and process

#22
20070227683
2007-10-04

Manufacture of casting cores

#23
20070207938
2007-09-06

Cleaning compositions and methods of use thereof

#24
20070065295
2007-03-22

Preparation of getter surfaces using caustic chemicals

#25
20060091110
2006-05-04

Cleaning solution and method for cleaning semiconductor device by using the same

#26
20050028838
2005-02-10

Cleaning tantalum-containing deposits from process chamber components