COMPOSITE MATERIAL, TERMINAL AND METHOD FOR MANUFACTURING TERMINAL

PROTECTION OF SENSITIVE SURFACES IN SEMICONDUCTOR PROCESSING

PLATING DEVICE FOR IMPROVING PLATING QUALITY AND PREVENTING GLOSS DETERIORATION OF OBJECTS TO BE PLATED

METAL FOAM THERMAL INTERFACE MATERIALS

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING ELECTROCHEMICAL DEPOSITION

WATER-BASED PRETREATMENT FOR PHOTORESIST SCUM REMOVAL

AN ELECTROCHEMICAL TREATMENT SYSTEM

Electrochemical Treatment Methods

TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING AND RAMPING

Composition and Method for Fabrication of Nickel Interconnects

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT REDUCTION AGENT

ELECTROPLATING SYSTEMS AND METHODS

APPARATUS AND METHODS FOR CONTROLLED ELECTROCHEMICAL SURFACE MODIFICATION

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HOLE PROCESSING, COPPER-CLAD LAMINATE USING SAME, AND MANUFACTURING METHOD THEREFOR

BUILDING LIQUID FLOW-THROUGH PLATES

BUILDING LIQUID FLOW-THROUGH PLATES

APPARATUSES AND SYSTEMS FOR ELECTROPLATING

METHOD OF PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND ELECTROLYTIC METALLIZATION

COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING

LOW TEMPERATURE HYBRID BONDING METALLIZATION

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING ELECTROCHEMICAL DEPOSITION

BIOCOMPATIBLE IMPLANTABLE ELECTRODE

APPARATUS AND METHOD FOR MANUFACTURING MAGNETIZABLE COMPONENTS CONSISTING OF CONCENTRICALLY LAYERED MATERIALS GROWN USING PATTERNED SUBSTRATE SEED TEMPLATES

Method for Improving Copper Alloy Electroplating Filling Process

PLATING APPARATUS AND PLATING METHOD

ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTORESIST-FREE FORMATION OF METAL FEATURES

COMPUTATIONAL REPRESENTATION OF DEPOSITION PROCESSES

LIQUID COLD WELDING METHODS AND APPARATUS

METAL-MATRIX COMPOSITES

COPPER ELECTROPLATING BATH

COMBINED SELF-FORMING BARRIER AND SEED LAYER BY ATOMIC LAYER DEPOSITION

Forming acoustic panel with multi-layered septum(s)

ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS

Method to coat metals onto surfaces

Electrocatalyst for water electrolysis

SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER

Alkaline Composition For Copper Electroplating Comprising A Defect Reduction Agent

Method and process for creating high-performance coax sockets

ELECTROPLATING COBALT, NICKEL, AND ALLOYS THEREOF

Methods for partial gold plating of metal packaging housings and packaging housings thereof

Wetting method for substrate and plating apparatus

Composite array electrode, preparation method thereof and use thereof

Electrochemical three-dimensional printing and soldering

Systems and methods for manufacturing electrical components using electrochemical deposition

Method for manufacturing semiconductor device

Electrochemical depositions of nanotwin copper materials

Electrochemical depositions of ruthenium-containing materials

HIGH-SPEED 3D METAL PRINTING OF SEMICONDUCTOR METAL INTERCONNECTS

TSV process window and fill performance enhancement by long pulsing and ramping

METHOD FOR PLATING OF TUBULAR WORKPIECE

Electrochemical three-dimensional printing and soldering

Apparatus and methods for determining horizontal position of substrate using lasers

High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes

METHOD FOR MANUFACTURING WIRING SUBSTRATE

Apparatus and methods for determining horizontal position of substrate using lasers

Composition for Cobalt Electroplating Comprising Leveling Agent

Method for optimized filling hole and manufacturing fine line on printed circuit board

INSULATION LAYER FORMATION METHOD, MEMBER WITH INSULATION LAYER, RESISTANCE MEASUREMENT METHOD AND JUNCTION RECTIFIER

Electrochemical polymer pen lithography

Selective screen electroplating

Electrochemical treatment system

PHOTORESIST RESOLUTION CAPABILITIES BY COPPER ELECTROPLATING ANISOTROPICALLY

SOLID-STATE SUBSTRATE-INTEGRATED REFERENCE ELECTRODE AND COUNTER ELECTRODE

Building liquid flow-through plates

Manufacturing method for laser chip and laser chip

Cobalt chemistry for smooth topology

ELECTRODEPOSITION OF COBALT TUNGSTEN FILMS

Semiconductor package, redistribution structure and method for forming the same

Composition and method for fabrication of nickel interconnects

SELECTIVE CHROME PLATING WITH FLUSH INTERFACE

Method for producing package substrate for loading semiconductor device

Method and device for plating a recess in a substrate

Method for producing wiring substrate

Localized electrochemical deposition

Method for producing wiring substrate

Injector component having a coating, injector, as well as a device for coating

Cobalt filling of interconnects

METHOD FOR MANUFACTURING AN ELECTRO-ACOUSTIC RESONATOR AND ELECTRO-ACOUSTIC RESONATOR DEVICE

Methods for forming a flat surface MIO structure

Flat cable and method of manufacturing flat cable

Selective metallized translucent automotive components by laser ablation

Method for manufacturing decorative parts

Method for producing an interconnection comprising a via extending through a substrate

Antireflective synthetic brochosomal coatings

Cobalt chemistry for smooth topology

Plating method and plating apparatus

Systems and methods of forming power electronic assemblies with cooling channels and integrated electrodes

Methods of forming electronic assemblies with inverse opal structures using variable current density electroplating

Copper electrofill on non-copper liner layers

Printed circuit board and method for manufacturing printed circuit board

Single step electrolytic method of filling through holes in printed circuit boards and other substrates

CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME

Composite array electrode, preparation method thereof and use thereof

Composition for tin or tin alloy electroplating comprising suppressing agent

Reference electrodes formed prior to performance of measurements

Customized patient-specific surgical instruments and method

Method for producing a metal decoration on a dial and dial obtained according to this method

Sample support, and manufacturing method of sample support

Composition for tin-silver alloy electroplating comprising a complexing agent

Electrochemical deposition systems

Wiring Substrate, Method Of Manufacturing Wiring Substrate, Inkjet Head, MEMS Device, And Oscillator

Facility and method for localized surface treatment for industrial components

Light-directed electrochemical patterning of copper structures

Metallic terminal and manufacturing method thereof

Composition for cobalt electroplating comprising leveling agent

BATHLESS METAL-COMPOSITE ELECTROPLATING

Bathless metal-composite electroplating

Aqueous formulation for creating a layer of gold and silver

Electro-oxidative metal removal in through mask interconnect fabrication

Manufacturing method of concave diffraction grating, concave diffraction grating, and analyzer using the same

Semiconductor device, substrate for semiconductor device and method of manufacturing the semiconductor device

HIGH ASPECT RATIO ELECTROPLATED STRUCTURES AND ANISOTROPIC ELECTROPLATING PROCESSES

Composition for metal electroplating comprising leveling agent

Selective plating of three dimensional surfaces to produce decorative and functional effects

Systems and methods for forming nanowires using anodic oxidation

Piston having an undercrown surface with coating and method of manufacture thereof

Composition for tin or tin alloy electroplating comprising leveling agent

Electrocatalyst for water electrolysis

High-aspect ratio electroplated structures and anisotropic electroplating processes

Apparatus and methods for controlled electrochemical surface modification

METHOD OF REPAIRING A NON-LINE OF SIGHT FEATURE VIA A MULTI-LAYER COATING

PRODUCING METHOD OF MODULE

Panel to be plated, electroplating process using the same, and chip manufactured from the same

Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite

Composite materials having a coated edge and methods thereof

Formation of fine pitch traces using ultra-thin PAA modified fully additive process

METHOD FOR FORMING PLATING

Wired circuit board and production method thereof

Formation of terminal metallurgy on laminates and boards

Injector component having a coating, injector, as well as a device for coating

Nano-catalyst filter and production method for same

LOW COST CHIP SLAPPER DETONATOR

Manufacturing method of wire grid polarizer

Sensors for analyte detection and methods of manufacture thereof

Fabrication of metallic optical metasurfaces

Semiconductor device having electrode pad and electrode layer intervening semiconductor layer inbetween and manufacturing method thereof

Electrolytic plating apparatus

Process for forming a transition zone terminated superconformal filling

Microarray electrodes useful with analyte sensors and methods for making and using them

Method for preparing a compound-based film for use in a solar cell by photo-electrodeposition

Electroplating device

Stabilization of metallic nanowire meshes via encapsulation

Formation of fine pitch traces using ultra-thin PAA modified fully additive process

Plating method and plating apparatus

Method and device for plating a recess in a substrate

CHEMICAL TREATMENT STEEL SHEET, AND METHOD FOR PRODUCING CHEMICAL TREATMENT STEEL SHEET

METHOD OF PRODUCING METAL MESH TYPE TRANSPARENT CONDUCTING FILM USING PHOTORESIST ENGRAVED PATTERN AND SURFACE MODIFICATION AND TRANSPARENT CONDUCTING FILM PRODUCED BY THE SAME

Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate

Ceramic device and manufacturing method thereof

Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same

Electroplating repair machine for tack expansion and seal welding region, electroplating repair system, and operating method

Microfabricated magnetostrictive resonator

Apparatus and method of contact electroplating of isolated structures

Plating apparatus

Superconformal filling composition and superconformally filling a recessed feature of an article

Film forming method for metal film and film forming apparatus for metal film

Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same

CONNECTOR TERMINAL WIRE ROD AND CONNECTOR INCLUDING THE SAME

Method of forming Cu plating, method of manufacturing Cu-plated substrate, and Cu-plated substrate

Integrated elastomeric lipseal and cup bottom for reducing wafer sticking

Laser metal deposition welding of automotive parts

Electro-oxidative metal removal in through mask interconnect fabrication

Method of forming a homogeneous solid metallic anode for a thin film microbattery

Three-dimensional crystalline, homogeneous, and hybrid nanostructures fabricated by electric field directed assembly of nanoelements

Electrochemical three-dimensional printing and soldering

METHOD OF MANUFACTURING NANOWIRE GRID POLARIZER

Cobalt filling of interconnects

Copper filling of through silicon vias

METHOD FOR PRODUCING A LITHIUM FILM

Conductive substrate and method for manufacturing same

Separation of alpha emitting species from plating baths

PROCESS FOR METALIZATION OF COPPER PILLARS IN THE MANUFACTURE OF MICROELECTRONICS

METHOD FOR PRESERVING A MARK ON A METALLIC WORKPIECE

Cathode for thin film microbattery

METHODS OF FABRICATING ELECTRONIC AND MECHANICAL STRUCTURES

Selective partitioning of via structures in printed circuit boards

Metallized plastic component having a transilluminable structure in day and night design; method for producing the plastic component

Process for forming a transition zone terminated superconformal filling

Antireflective synthetic brochosomal coatings

Plastic part with selective metallization and corresponding manufacturing process

Two-shot molding for selectively metalizing parts

Producing method of wired circuit board

Floating metallized element assembly and method of manufacturing thereof

Filling plating system and filling plating method

Customized patient-specific surgical instruments and method

PLATING APPARATUS, PLATING METHOD AND COMPUTER READABLE RECORDING MEDIUM

Lost wax cast vapor chamber device

Separation of alpha emitting species from plating baths

Chip electronic component and manufacturing method thereof

High aspect ratio electroplated structures and anisotropic electroplating processes

Formation of copper layer structure with self anneal strain improvement

Wetting pretreatment for enhanced damascene metal filling

Selective solder plating

Cathode for thin film microbattery

Vehicle components having deep mesh plated features

Nanogrid electrochemical sensor for detection of biochemical species by electrochemical impedance spectroscopy

Apparatus and method of contact electroplating of isolated structures

Self-aligned spatial filter

Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate

Multilayer build processes and devices thereof

Metallization of the wafer edge for optimized electroplating performance on resistive substrates

Method for modifying an electrically conductive oxide surface, use for electrodeposition of copper on said surface

Microscale three-dimensional electric devices and methods of making the same

PROCESS FOR METALLIZING PLASTIC PARTS

Plating method

Capacitive touch sensitive housing and method for making the same

Method for producing surface discharge electrodes and semifinished product for carrying out the method

Chemical treatment steel sheet, and method for producing chemical treatment steel sheet

Method of filling through-holes to reduce voids and other defects

ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME

Method of forming metal coating

Method of applying an electroplated layer to a polymeric composite material

Systems, methods and apparatus for electroplating photovoltaic cells

SELECTIVE SOLDER PLATING

High-conductivity bonding of metal nanowire arrays

De-bouncing keypad and preparation method thereof

Electrodeposition electrode for use in the interior of a pipe

Dissymetric particles (Janus particles) and their method of synthesis by bipolar electrochemistry

Method of electroplating copper into a via on a substrate from an acid copper electroplating bath

Method for preserving a mark on a metallic workpiece

Systems and methods for forming nanowires using anodic oxidation

Plated terminations

Guide plate for a probe card and probe card provided with same

ELECTROPLATING APPARATUS, ELECTROPLATING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Stabilization of metallic nanowire meshes via encapsulation

Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control

HIGH-SPEED FILLING METHOD FOR COPPER

STRUCTURE OF DUAL-COLOR ELECTROPLATED ARTICLE

Integrated elastomeric lipseal and cup bottom for reducing wafer sticking

Nebulizer mesh and production method thereof

High-conductivity bonding of metal nanowire arrays

Interposer fabricating process

Semiconductor package and method of manufacturing thereof

METHOD OF FORMING METAL AND METAL ALLOY FEATURES

POLARIZATION STABILIZER ADDITIVE FOR ELECTROPLATING

Method for creating multiple electrical current pathways on a work piece

Replication tools and related fabrication methods and apparatus

Galvanically decorated decorative element with contour light

Two-stage method for dip-coating electrically conductive substrates using a Bi (III)-containing composition

Hydrogel-mediated electropolymerization of conducting polymers

Method of forming wiring pattern and etching apparatus for forming wiring pattern

Electroplating method and electroplating device

Coating forming device and coating forming method for forming metal coating

Film forming apparatus and film forming method

Curved grating structure manufacturing method, curved grating structure, grating unit, and x-ray imaging device

Copper electroplating method

Metallization of the wafer edge for optimized electroplating performance on resistive substrates

Process for filling vias in the microelectronics

High-conductivity bonding of metal nanowire arrays

INTERPOSER AND METHOD FOR PRODUCING THE SAME

Selective chroming

Electrochemical Sensor for a Bandage Type of Continuous Glucose Monitoring System

System and method for selective plating of interior surface of elongated articles

Substrate via filling

Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalogens

Film deposition device of metal film and metal film deposition method

Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe Structures Incorporating Dielectrics

Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon

Localized, in-vacuum modification of small structures

Plated terminations

Metal-film forming apparatus and metal-film forming method

Making a flat no-lead package with exposed electroplated side lead surfaces

Film deposition device of metal film and film deposition method

SYSTEM AND METHOD FOR ELECTROPLATING OF HOLE SURFACES

Electrolyte, method of forming a copper layer and method of forming a chip

PRODUCING A NANOPORE FOR SEQUENCING A BIOPOLYMER

WINDING APPARATUS FOR WAVEGUIDE PROTOTYPE MOULD AND WAVEGUIDE MANUFACTURING METHOD

ELECTROPLATING SOLUTION FOR TIN OR TIN ALLOY, AND USE FOR SAME

Substrate via filling

Substrate processing method and template

Manufacturing method of casing of electronic device

ALUMINUM DEPOSITION DEVICES AND THEIR USE IN SPOT ELECTROPLATING OF ALUMINUM

Filling through-holes

LOW COPPER/HIGH HALIDE ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL

Method for focused electric-field imprinting for micron and sub-micron patterns on wavy or planar surfaces

Rough Copper for Noise Reduction in High Speed Circuits

Circuit substrate having a circuit pattern and method for making the same

Method of forming a composite material and apparatus for forming a composite material

Method for manufacturing multilayer wiring substrate

Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer

Tin alloy electroplating solution for solder bumps including perfluoroalkyl surfactant

Metallic materials with embedded luminescent particles

Structure, method for manufacturing the same, and talbot interferometer

Self-aligned spatial filter

Selective partitioning of via structures in printed circuit boards

Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit

Process for treating steel alloys for gears

Method of forming metallic pattern on polymer substrate

Plating method

Electrochemical fabrication process for forming multilayer multimaterial microprobe structures

Nebulizer mesh and production method thereof

Lighting tiles

Conductive substrate and method for manufacturing same

Touch module and method of fabricating the same

Interposer fabricating process and wafer packaging structure

Metallization of the wafer edge for optimized electroplating performance on resistive substrates

METHOD OF MANUFACTURING MICROSTRUCTURES OF METAL LINES

PRINTED CIRCUIT BOARD, METHOD FOR MAUFACTURING THE SAME AND PACKAGE ON PACKAGE HAVING THE SAME

SAME LAYER MICROELECTRONIC CIRCUIT PATTERNING USING HYBRID LASER PROJECTION PATTERNING (LPP) AND SEMI-ADDITIVE PATTERNING (SAP)

Thermal management for high-power optical fibers