Process for the electrochemical deposition of a semiconductor material

Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby

SUPER CONFORMAL METAL PLATING FROM COMPLEXED ELECTROLYTES

Devices, systems and methods for coating surfaces

Electrolyte concentration control system for high rate electroplating

Miniature RF and microwave components and methods for fabricating such components

SHROUDED SINGLE CRYSTAL DUAL ALLOY TURBINE DISK

Guide plate for a probe card and probe card provided with same

Copper plating bath composition

Methods and apparatus for depositing a metal layer on a semiconductor device

METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING

Homogeneous solid metallic anode for thin film microbattery

Cathode for thin film microbattery

Thin, flexible microsystem with integrated energy source

Anodized electroplated aluminum structures

Through substrate vias and device

Method for the nanostructuring and anodization of a metal surface

Systems and methods for forming nanowires using anodic oxidation

Printed circuit board and manufacturing method therefor

Integrated transformer

Chip electronic component and manufacturing method thereof

TIN OR TIN ALLOY ELECTROPLATING BATH AND PROCESS FOR PRODUCING BUMPS USING SAME

Electroplating of metals on conductive oxide substrates

Laser metal deposition welding of automotive parts

Substrate holder, plating apparatus, and plating method

METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER USING CATION PERMEABLE BARRIER

Wiring substrate and method of manufacturing wiring substrate

Capacitive touch sensitive housing and method for making the same

Pattern-forming method for forming a conductive circuit pattern

FLIP-CHIP PACKAGING SUBSTRATE, FLIP-CHIP PACKAGE AND FABRICATION METHODS THEREOF

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Method of fabricating connection structure for a substrate

Plating method and plating apparatus

Electronic device and casing thereof

Method of manufacturing zinc oxide thin film, method of manufacturing thin film transistor, zinc oxide thin film, thin film transistor, and transparent oxide wiring

Wetting pretreatment for enhanced damascene metal filling

COMPOSITION FOR FORMING A SEED LAYER

Additives for electroplating baths

Producing method of suspension board with circuit

Method for manufacturing printed wiring board

Alkaline pretreatment for electroplating

Electro plating device

MEMS microphone with dual-back plate and method of manufacturing the same

CIRCUIT SUBSTRATE AND METHOD FOR MAKING THE SAME

ALUMINUM ALLOYS, ALUMINUM ALLOY PRODUCTS AND METHODS FOR MAKING THE SAME

CHEMICAL PLATING PRODUCT AND METHOD FORMING THEREOF

Partially carbonitriding heat treated stainless steel ferrule and manufacturing method thereof

METHODS FOR ELECTROPLATING COPPER

Apparatus for wetting pretreatment for enhanced damascene metal filling

Wiring board and method of manufacturing wiring board

METAL-ELECTRODEPOSITED INSULATOR SUBSTRATE AND METHOD OF MAKING THE SAME

Methods of forming borided down hole tools

Methods of forming borided down-hole tools

Piston ring with chromium solid particle wear-prevention layer and corrosion-resistant flank surface

Optical encoder light shielding plate, producing method therof, and optical encoder provided therewith

System and method for electropolishing or electroplating conveyor belts

STAMPER, METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING MOLDED MATERIAL, AND PROTOTYPE ALUMINUM MOLD FOR STAMPER

INDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE METAL ENHANCED WITH CONDUCTIVE NANOMATERIAL

Method of manufacturing multi-layer coil and multi-layer coil device

Pattern transfer mold and pattern formation method

Film formation device and film formation method for forming metal film

PERPENDICULAR WRITE HEAD WITH LAMINATED SIDE SHIELDS

Plated instrumentation probes and sensors

Method for Marking a Tool

METHOD FOR FORMING A COMPOSITE FILM

ANTI-VIRUS ALUMINUM MEMBER AND METHOD FOR PRODUCING SAME

Biocompatible implantable electrode

ALTERNATIVE MANUFACTURING PROCESSES FOR ALUMINUM ENCLOSURES

Dual anodized coating

Production method and device of surface roughened copper plate, and surface roughened copper plate

Manufacturing method of electronic component

Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks

Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers

Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure

Structure and method of manufacture

Fabrication of tunneling junction for nanopore DNA sequencing

Fabrication of tunneling junction for nanopore DNA sequencing

Method of metalizing surface and article obtainable

Metallic materials with embedded luminescent particles

MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE

Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby

METHOD OF FILLING THROUGH-HOLES

Method of filling through-holes

Electro chemical plating process

Electrochemical fabrication method including elastic joining of structures

Methods for fabrication of orthodontic appliances and orthodontic appliances made thereby

Methods of fabricating electronic and mechanical structures

Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes

PLASTIC PART WITH SELECTIVE METALLIZATION AND CORRESPONDING MANUFACTURING PROCESS

Metal structural body-containing polymer film, method for manufacturing metal structural body-containing polymer film, and method for manufacturing patterned structural body

Method of controlling silicon oxide film thickness

Method for the treatment, by percolation, of a felt element by means of electrode-position

DEPOSITING NANO-DOTS ON A SUBSTRATE

Cosmetic and protective metal surface treatments

Heat dissipating substrate and method of manufacturing the same

Method to prewet wafer surface

Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids

Process for selective isolation of CFRP parts by electrodeposition coatings

Aqueous Acidic Bath for Electrolytic Deposition of Copper

Process for filling vias in the microelectronics

One-piece decorative trim bezel having plural unpainted finishes

Non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate

Electrode and method of forming the master electrode

Selective plating apparatus and method

Non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate

Electrofill vacuum plating cell

Supporting unit, substrate treating device including the same, and method of manufacturing the supporting unit

Method of forming channel layer of electric device and method of manufacturing electric device using the same

PATTERN FORMING DEVICE AND PATTERN FORMING METHOD

METHOD FOR FABRICATING ONE-DIMENSIONAL METALLIC NANOSTRUCTURES

Electroplating method and electroplating apparatus for through-hole

Selectively coated CRP components and process for the production thereof

Metallization mixtures and electronic devices

METHOD FOR FORMING METAL MEMBER ON CASING

Three-dimensional (3D) porous device and method of making a 3D porous device

METAL MEMBER AND METHOD OF MANUFACTURING SAME

MANUFACTURING METHOD OF CIRCUIT PATTERN

Paddle for electroplating for selectively depositing greater thickness

Method and apparatus for electroplating

Electrolytic copper plating solution and method of electrolytic copper plating

METHOD OF FORMING INTERFERENCE FILM ON SURFACE OF ALUMINUM ALLOY SUBSTRATE

Method to realize flux free indium bumping

Plated terminations

Through-hole substrate and method of producing the same

METHOD FOR SHRINKING LINEWIDTH OF EXTREME DIMENSION

Device for fixedly securing a metallic inlay

COPPER FILLING OF THROUGH SILICON VIAS

Device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment

METHODS FOR FABRICATING GAS TURBINE ENGINES

Method for Marking a Tool

Nanostructured films and related methods

Dual anodization surface treatment

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

PATTERN-FORMING COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME

Antenna structures with molded and coated substrates

METHOD FOR TREATING THE SURFACE OF A DEVICE FOR DISPENSING A FLUID PRODUCT

Treating a metal implant with a rough surface portion so as to incorporate biocidal material

Method for refurbishing PtAl coating to turbine hardware removed from service

Composition for metal electroplating comprising leveling agent

Localized, in-vacuum modification of small structures

PLATING SYSTEM AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing an electrochromic article

Enhanced methods for fabricating solar cells with textured surfaces

SURFACE TREATMENT APPARATUS

Tool for galvanically coating sliding bearings

ELECTROLYTIC PLATING METHOD AND ELECTROSTATIC DEFLECTING DEVICE

Methods for forming electroplated aluminum structures

Method for depositing a metal onto a porous carbon layer

ELECTROPLATED LEAD-FREE BUMP DEPOSITION

METHOD OF PRODUCING BODY HAVING FLOW PATH FORMED THEREIN, AND BODY HAVING FLOW PATH FORMED THEREIN

METHOD FOR PRODUCING A CORROSION-RESISTANT, WORKABLE SHEET METAL WITH FULL-SURFACE COATING OF THE JOINED, THERMALLY TREATED STEEL SHEETS

APPARATUS AND METHOD FOR ELECTROCHEMICAL PROCESSING OF THIN FILMS ON RESISTIVE SUBSTRATES

APPARATUS AND METHOD FOR ELECTROCHEMICAL PROCESSING OF THIN FILMS ON RESISTIVE SUBSTRATES

Electrode and method of forming the master electrode

ELECTROPLATING APPARATUS AND METHOD

APPARATUS AND METHOD FOR ELECTROPLATING FOR SEMICONDUCTOR SUBSTRATE

METHOD FOR PRODUCING METAL COATINGS ON PLASTICS MATERIAL PARTS

METHOD OF FORMING A MULTILAYER STRUCTURE

CONTINUOUS MICRO ANODE GUIDED ELECTROPLATING DEVICE AND METHOD THEREOF

CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING THE SAME

MASTER ELECTRODE AND METHOD OF FORMING IT

Wiring board, semiconductor device, and method for manufacturing wiring board

Anti-fuse device structure and electroplating circuit structure and method

Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids

Method of controlling silicon oxide film thickness

Housing and manufacturing method

Fabricating method of flexible circuit board

ONE-PIECE DECORATIVE TRIM BEZEL HAVING PLURAL UNPAINTED FINISHES

Nickel-plated steel sheet for manufacturing pipe having corrosion resistance against fuel vapors, pipe which uses the steel sheet, and fuel supply pipe which uses the steel sheet

Method and electrode for defining and replicating structures in conducting materials

Methods of multi-shot injection molding and metal-plated polymeric articles made therefrom

GALVANIC ELEMENT AS A DEVICE BATTERY

Apparatus and method for electroplating

Electro chemical deposition systems and methods of manufacturing using the same

Methods for electroplating copper

Structures for improving current carrying capability of interconnects and methods of fabricating the same

METAL FOAMS

Printed wiring board having through-hole and a method of production thereof

METHODS OF MULTI-SHOT INJECTION MOLDING AND DURABLE POLYMERIC ASSEMBLIES MADE THEREFROM

SEED LAYER DEPOSITION IN MICROSCALE FEATURES

METHODS FOR FORMING BARRIER/SEED LAYERS FOR COPPER INTERCONNECT STRUCTURES

Selective seed layer treatment for feature plating

Method of forming single-layer photonic crystal structure

Electrochemical fabrication method including elastic joining of structures

Molded Interconnect Device (MID) with Thermal Conductive Property and Method for Production Thereof

Electrochemical Fabrication Methods for Producing Multilayer Structures Including the use of Diamond Machining in the Planarization of Deposits of Material

Electrocurtain coating process for coating solar mirrors

Package substrate and fabrication method thereof

Forming Through-Substrate Vias by Electrofilling

MANUFACTURING METHOD OF CIRCUIT BOARD

Barrier layers

Perpendicular write head with laminated side shields

Methods of creating probe structures from a plurality of planar layers

Methods of creating probe structures from a plurality of planar layers

Replication tools and related fabrication methods and apparatus

Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers

Methods of creating probe structures from a plurality of planar layers

Method of fabricating electrode structures on substrate

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

BACK ELECTRODE-TYPE SOLAR CELL AND METHOD OF MANUFACTURING THE SAME

Metallization processes, mixtures, and electronic devices

Methods for forming barrier/seed layers for copper interconnect structures

Method for manufacturing a printed wiring board having a through-hole conductor

Plating apparatus, plating method and multilayer printed circuit board

Sensors for analyte detection and methods of manufacture thereof

Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks

PLATING METHOD

Method for separating nanomaterials

METALLIC MATERIALS WITH EMBEDDED LUMINESCENT PARTICLES

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Thermoplastic product and method for the production of a composite product

Non-deleterious technique for creating continuous conductive circuits

Integrated transformer

METHOD FOR PATTERNING MAGNETIC FILMS

PATTERNING USING ELECTROLYSIS

MICROMETER-SCALE OR NANOMETER=SCALE SPATIALLY CONTROLLED INCORPORATION OF PARTICLES IN A CONDUCTING SURFACE LAYER OF A SUPPORT

FABRICATION OF CONDUCTIVE NANOSTRUCTURES ON A FLEXIBLE SUBSTRATE

Partial Surface treatment apparatus

High dielectric permittivity materials from composites of low dimensional metallic systems

Methods of forming electrically conductive structures

ADDITIVE MANUFACTURING PROCESSES

Polymer-based high surface area multi-layered three-dimensional structures and method of making same

Composition for printing a seed layer and process for producing conductor tracks

METHOD OF MANUFACTURING A MAGNETIC RECORDING MEDIUM HAVING A DISCRETE TRACK STRUCTURE

Microstructure manufacturing method and microstructure

Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes

Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes

PLATING METHOD AND PLATING APPARATUS

Anti-fuse device structure and electroplating circuit structure and method

Method of forming a micro-electromechanical system device

Cylinder block plate processing apparatus and sealing mechanism of the same

Flexible Substrate Having Electrical And Optical Functions

Cooling systems and methods for grazing incidence EUV lightography collectors

MULTILAYER BUILD PROCESSSES AND DEVICES THEREOF

Heat dissipating substrate and method of manufacturing the same

Rejuvenation method for ruthenium plating seed

Composite material for electric/electronic part, production method thereof, and electric/electronic part

NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Methods for multi-step copper plating on a continuous ruthenium film in recessed features

METHOD FOR MANUFACTURING HIGH POROSITY GRAPHITE CAPILLARY STRUCTURE

Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath

METHOD OF MANUFACTURING PRINTED WIRING BOARD

Printed circuit board and method of manufacturing the same

HOUSING FOR ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME

Solar cells with textured surfaces

In situ Plating And Soldering Of Materials Covered With A Surface Film

VERTICALLY-ALIGNED NANOPILLAR ARRAY ON FLEXIBLE, BIAXIALLY-TEXTURED SUBSTRATES FOR NANOELECTRONICS AND ENERGY CONVERSION APPLICATIONS

Electrode structure adapted for high applied voltage and fabrication method thereof

Electro-deposition of nano-patterns

Process for selecting surrogate part

Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids

Dual anodization surface treatment

Method and electrode for defining and replicating structures in conducting materials

Wetting pretreatment for enhanced damascene metal filling

APPARATUS FOR WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING

Methods of Reducing Interlayer Discontinuities in Electrochemically Fabricated Three-Dimensional Structures

Method for producing a surface roughened copper plate

CONTINUOUS MICRO ANODE GUIDED ELECTROPLATING DEVICE AND METHOD THEREOF

Copper deposition for filling features in manufacture of microelectronic devices

REEL-TO-REEL PLATING OF CONDUCTIVE GRIDS FOR FLEXIBLE THIN FILM SOLAR CELLS

Substrates for Electronic Circuitry Type Applications

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Metal plating using seed film

Copper filling-up method

Electroplating on ultra-thin seed layers

Silicon-metal composite micromechanical component and method of manufacturing the same

METHOD OF FABRICATING CIRCUIT BOARD

Stamper, Method for Producing the Same, Method for Producing Molded Material, and Prototype Aluminum Mold for Stamper

Method for manufacturing substrate with metal film

Method for manufacturing laminated electronic component

Solid electrolytic capacitor and method of manufacturing the same

Method of fabricating a nozzle plate of a spray apparatus

Process for improving the oxidation resistance of carbon nanotubes

PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV)

Method of manufacturing a magnetic recording medium

Method and apparatus for workpiece surface modification for selective material deposition

METHOD FOR COATING A CONSTRUCTION MATERIAL WITH A FUNCTIONAL METAL AND THE PRODUCT MANUFACTURED BY THE METHOD

Aluminum alloys, aluminum alloy products and methods for making the same

COPPER CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes

Chip-type antenna for receiving FM broadcasting signal and a manufacturing method thereof

Printed wiring board and a method of production thereof

System for modifying small structures

STRUCTURE HAVING ORGANIC-INORGANIC COMPOSITE LAYER AND METHOD OF MANUFACTURING THE SAME

METAL STRUCTURAL BODY-CONTAINING POLYMER FILM, METHOD FOR MANUFACTURING METAL STRUCTURAL BODY-CONTAINING POLYMER FILM, AND METHOD FOR MANUFACTURING PATTERNED STRUCTURAL BODY

High aspect ratio electroplated metal feature and method

Method for preparing a conductive feature on a substrate

Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers

Method of forming front contacts to a silicon solar cell without patterning

Method and apparatus for electroplating

Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP)

NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Sheet glass for microscopy and manufacturing method thereof

Cu surface plasma treatment to improve gapfill window

Fabrication of topical stopper on head gasket by active matrix electrochemical deposition

Printed wiring board and a method of production thereof

Stainless steel plumbing fixtures with resistant coatings

Medical implant and production thereof

Minimizing plating stub reflections in a chip package using capacitance