120993 ⎘
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces Electroplating with more than one layer of the same or of different metals
Method for Electrochemical Fabrication
#602COMPOSITE METALLIC MATERIALS, USES THEREOF AND PROCESS FOR MAKING SAME
#603Silicon-metal composite micromechanical component and method of manufacturing the same
#604METHODS OF FORMING COATINGS ON SUBSTRATES
#605SILVER-COATED COMPOSITE MATERIAL FOR MOVABLE CONTACT AND METHOD FOR MANUFACTURING THE SAME
#606Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board
#607Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite
#608SOLUTION DEPOSITION METHOD AND APPARATUS WITH PARTIPHOBIC SUBSTRATE ORIENTATION
#609Enhanced plating chemistries and methods for preparation of group IBIIIAVIA thin film solar cell absorbers
#610Method for electrochemical fabrication
#611Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors
#612Connector and metallic material for connector
#613OUT-OF-PLANE SPRING STRUCTURES ON A SUBSTRATE
#614PROCESS FOR THE PREPARATION OF ELECTRODES FOR USE IN A FUEL CELL
#615Silver-coated stainless steel strip for movable contacts and method of producing the same
#616CONTACT STRUCTURE FOR A SEMICONDUCTOR AND METHOD FOR PRODUCING THE SAME
#617Amperometric sensor electrodes
#618Multi-cell Masks and Methods and Apparatus for Using Such Masks To Form Three-Dimensional Structures
#619STAINLESS STEEL SUBSTRATE WITH CONDUCTIVE METAL LAYER, HARD DISK SUSPENSION MATERIAL AND HARD DISK SUSPENSION MANUFACTURED BY USING THE MATERIAL
#620Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
#621SELENIUM CONTAINING ELECTRODEPOSITION SOLUTION AND METHODS
#622Braze assembly with beryllium diffusion barrier and method of making same
#623SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#624CONTROL OF ELECTROMAGNETIC SIGNALS OF COINS THROUGH MULTI-PLY PLATING TECHNOLOGY
#625Gallium electroplating methods and electrolytes employing mixed solvents
#626Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#627BARRIER LAYER AND METHOD FOR MAKING THE SAME
#628METHODS AND MATERIALS FOR CONTROLLING THE ELECTROCHEMISTRY OF ANALYTE SENSORS
#629COPPER ELECTROLYTIC SOLUTION AND TWO-LAYER FLEXIBLE SUBSTRATE OBTAINED USING THE SAME
#630Threaded joint for steel tubes
#631METHODS FOR FABRICATING THIN FILM SOLAR CELLS
#632CARBON NANOTUBE COMPOSITES
#633Plating member
#634Method and Apparatus for Maintaining Parallelism of Layers and/or Achieving Desired Thicknesses of Layers During the Electrochemical Fabrication of Structures
#635Methods of forming thin layers of photovoltaic absorbers
#636Electro-formed sheath for use on airfoil components
#637Electrochemical Fabrication Method for Producing Compliant Beam-Like Structures
#638Electrodeposited film having sliding function and coated article therewith
#639METHOD FOR SURFACE TREATING PLASTIC PRODUCTS
#640Method of producing body having flow path formed therein, and body having flow path formed therein
#641Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe Structures
#642Slide member
#643Electroplating method for depositing continuous thin layers of indium or gallium rich materials
#644Electrode Grid
#645Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks
#646FORMATION OF NANOSTRUCTURES COMPRISING COMPOSITIONALLY MODULATED FERROMAGNETIC LAYERS BY PULSED ECD
#647Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, and surface-treated copper foil with carrier sheet
#648Metal Cord, Rubber-Cord Complex and Pneumatic Tire Using the Same
#649Electrolytic plating method and semiconductor device manufacturing method
#650Semiconductor device manufacturing method
#651METHOD FOR SURFACE TREATING A SUBSTRATE
#652Method for monitoring patterning integrity of etched openings and forming conductive structures with the openings
#653ELECTRONCHEMICAL DEPOSITION OF TANTALUM AND/OR COPPER IN IONIC LIQUIDS
#654Cu-Zn alloy strip superior in thermal peel resistance of Sn plating and Sn plating strip thereof
#655Methods For Providing Composite Asperities
#656ELECTRODE AND METHOD OF FORMING THE ELECTRODE
#657Master Electrode and Method of Forming the Master Electrode
#658ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE
#659Electrode and method of forming the electrode
#660Method of surface treatment for the inhibition of whiskers
#661Method of Forming a Multilayer Structure
#662METHOD OF PRODUCING ELECTRONIC COMPONENT
#663Method of manufacture of composite armor material
#664Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed Layers That Are Partially Removed Via Planarization
#665Novel Composite Chemical Conversion Coating Film, Multiple Layered Coating Film Using the Same and Process for Forming Multiple Layered Coating Film
#666Anti-fuse device structure and electroplating circuit structure and method
#667METHOD OF FORMING A MULTILAYER STRUCTURE
#668Metal plating composition and method for the deposition of copper—zinc—tin suitable for manufacturing thin film solar cell
#669ELECTROPLATED DEVICE AND PREPARATION METHOD THEREOF
#670Electrochemical Fabrication Methods Including Use of Surface Treatments to Reduce Overplating and/or Planarization During Formation of Multi-layer Three-Dimensional Structures
#671METHOD OF FORMING A MULTILAYER STRUCTURE
#672CORROSION DETECTION METHOD AND MONITORING PATTERN USED THEREIN
#673Sn-Plated Cu-Ni-Si Alloy Strip
#674Forming electroplated inductor structures for integrated circuits
#675Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil
#676Variable property electrodepositing of metallic structures
#677Tin-plated steel sheet
#678Iron-gold barcode nanowire and manufacturing method thereof
#679Nano-metal bicycle frame and related components
#680Method for Electrochemically Fabricating Three-Dimensional Structures Including Pseudo-Rasterization of Data
#681MULTILAYER WIRING BOARD AND METHOD FOR PRODUCING THE SAME
#682Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion
#683Plating apparatus and plating method
#684Sn-plated copper alloy strip having improved fatigue characteristics
#685Compositionally modulated composite materials and methods for making the same
#686MULTIPLE-STEP ELECTRODEPOSITION PROCESS FOR DIRECT COPPER PLATING ON BARRIER METALS
#687NANOSTRUCTURES WITH ELECTRODEPOSITED NANOPARTICLES
#688Method for forming multilayer coating film and coated article
#689Material for electric contact and method of producing the same
#690Method of enabling selective area plating on a substrate
#691MASTER ELECTRODE AND METHOD OF FORMING IT
#692Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers
#693Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion
#694EFAB Methods Including Controlled Mask to Substrate Mating
#695PRODUCTION METHOD FOR WIRING AND VIAS
#696Metal Cord, Rubber-Cord Complex and Pneumatic Tire Using the Same
#697Substrate processing method and substrate processing apparatus
#698Electrochemical Fabrication Methods for Producing Multilayer Structures Including the use of Diamond Machining in the Planarization of Deposits of Material
#699Fretting and whisker resistant coating system and method
#700METHOD OF MAKING PHASE CHANGE MATERIALS ELECTROCHEMICAL ATOMIC LAYER DEPOSITION
#701Coated Copper, Method for Inhibiting Generation of Whisker, Printed Wiring Board and Semiconductor Device
#702METHOD OF MANUFACTURING ELECTRICALLY CONDUCTIVE STRIPS
#703Copper-tin-oxygen alloy plating
#704Metal hand tool and method for manufacturing the same
#705PALLADIUM-CONTAINING PLATING SOLUTION AND ITS USES
#706Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization
#707Method for Electrochemical Fabrication
#708Threaded joint for steel pipes
#709Method for Electrochemical Fabrication
#710Magnetic head and method of producing the same
#711Formation of nanostructures comprising compositionally modulated ferromagnetic layers by pulsed ECD
#712Clad tube for nuclear fuel
#713SURFACE TREATMENT PROCESS FOR COLORING METAL ARTICLES
#714Mold, method for producing the same and magnetic recording medium
#715Method of forming yttrium-modified platinum aluminide diffusion coating
#716Integrated Circuit Packaging Using Electrochemically Fabricated Structures
#717Electrodeposition technique and apparatus to form selenium containing layers
#718Method for imparting hydrogen resistance to articles
#719METHOD OF METALLIZING A SOLAR CELL SUBSTRATE
#720Method of electrochemical fabrication
#721Component with a coating for reducing the wettability of the surface and method for production thereof
#722SEMICONDUCTOR DEVICE MANUFACTURED USING AN ELECTROCHEMICAL DEPOSITION PROCESS FOR COPPER INTERCONNECTS
#723Method of Electrochemical Fabrication
#724Method for electrochemical fabrication
#725Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization
#726Multi-layered bearing
#727Method for Electrochemical Fabrication
#728Roll-To-Roll Electroplating for Photovoltaic Film Manufacturing
#729TECHNIQUE FOR PLATING SUBSTRATE DEVICES USING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL AND LIGHT ASSISTANCE
#730Method for manufacturing magnetic film and magnetic film
#731Tin-Based Plating Film and Method for Forming the Same
#732Flat cable
#733Selective electroplating onto recessed surfaces
#734Tool holder with vibration damping means and a method for manufacturing the same
#735Silver layer formed by electrosilvering substrate material
#736Method For Silver Plating
#737Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor Device
#738Composition control for photovoltaic thin film manufacturing
#739Methods and materials for controlling the electrochemistry of analyte sensors
#740Substrate plating method and apparatus
#741Composition control for roll-to-roll processed photovoltaic films
#742Plating apparatus, plating method and manufacturing method for semiconductor device
#743Composite copper foil and method for production thereof
#744Out-of-plane spring structures on a substrate
#745Method For Electrochemical Fabrication
#746Electromagnetic wave shielding film and method for producing the same
#747Method of electrolytically depositing materials in a pattern directed by surfactant distribution
#748Magnetic structures, methods of fabricating magnetic structures and micro device incorporating such magnetic structures
#749Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
#750Ultrathin copper foil with carrier and printed circuit board using same
#751METHOD FOR FORMING A COPPER METAL INTERCONNECTION OF A SEMICONDUCTOR DEVICE
#752Method of depositing materials on full face of a wafer
#753COPPER INTERCONNECTION STRUCTURE AND METHOD FOR FORMING SAME
#754Method for electroplating metal wire
#755Method of direct plating of copper on a substrate structure
#756Method for filling recessed micro-structures with metallization in the production of a microelectronic device
#757Method of preparing copper plating layer having high adhesion to magnesium alloy using electroplating
#758Multi-cell masks and methods and apparatus for using such masks to form three-dimensional structures
#759Protective coating for monocrystalline superalloy
#760Method for fabricating metal wires
#761Pretreatment of magnesium substrates for electroplating
#762Multi-layer interconnect structure for semiconductor devices
#763Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures
#764Plating method
#765Silver barrier layers to minimize whisker growth in tin electrodeposits
#766Substrate with alloy finish and method of making
#767Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
#768Method of direct plating of copper on a ruthenium alloy
#769Methods of and apparatus for making high aspect ratio microelectromechanical structures
#770MULTIPLE CHEMISTRY ELECTROCHEMICAL PLATING METHOD
#771Adherent metal oxide coating forming a high surface area electrode
#772Method, apparatus and system for electro-deposition of a plurality of thin layers on a substrate
#773Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon
#774Method for forming a metal layer in multiple steps
#775Method and process for improved uniformity of electrochemical plating films produced in semiconductor device processing
#776Technique for electrochemically depositing an alloy having a chemical order
#777Sliding member
#778Method for filling recessed micro-structures with metallization in the production of a microelectronic device
#779Method for fabricating multi-layer, hub-less blade
#780Method to improve palanarity of electroplated copper
#781Silver-coated stainless steel strip for movable contacts and method of producing the same
#782Method for manufacturing optical element
#783Plain or zinc-plated steel plate coated with a zinc or zinc alloy layer comprising a polymer, and method for making same by electroplating
#784Single pass, dual thickness electroplating system for head suspension components
#785Metal capped copper interconnect
#786Anode for nonaqueous secondary battery, process of producing the anode, and nonaqueous secondary battery
#787Highly corrosion-resistant/highly workable plated steel wire, plating bath composition, method for producing the plated steel wire and wire netting product
#788Method for constructing contact formations
#789Process for forming a composite Ni and Cu alloy plating film
#790Bearing having embedded hard particle layer and overlay and method of manufacture
#791Method and apparatus for copper film quality enhancement with two-step deposition
#792Metal plating coating film having sliding function and article coated therewith
#793Differentially metal doped copper damascenes
#794Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data
#795Chip interconnect and packaging deposition methods and structures
#796Electroplated metals with silvery-white appearance and method of making
#797Electroplated metals with silvery-white appearance and method of making
#798Method of manufacturing electrical parts
#799Radially layered nanocables and method of fabrication
#800Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
#801Copper conductor
#802Hot press forming method
#803Copper plating of semiconductor devices using single intermediate low power immersion step
#804Copper foil for high-density ultra-fine printed wiring board
#805Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#806Electrolytic gold plating method of printed circuit board
#807Electrochemical methods for the formation of protective features on metallized features
#808Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#809Method for electrochemically processing a workpiece
#810Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#811Flat cable conductor, method of making the same and flat cable using the same
#812EFAB methods including controlled mask to substrate mating
#813Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material
#814Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#815Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#816Integrated circuit packaging using electrochemically fabricated structures
#817Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
#818Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data
#819Method for depositing nickel- and chromium (VI) -free metal matte layers
#820Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#821Flexible printed circuit board and process for producing the same
#822Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#823Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
#824Method to improve planarity of electroplated copper
#825Nanostructures with electrodeposited nanoparticles
#826Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
#827Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
#828Plating method and plating apparatus
#829Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
#830Multi-layer three-dimensional structures having features smaller than a minimum feature size associated with the formation of individual layers
#831Electrolytic process for depositing a graduated layer on a substrate, and component
#832Fretting and whisker resistant coating system and method
#833Substrate plating method and apparatus
#834Conductive sheet having metal layer formed on at least a portion of surface of insulating substrate, product using the same, and manufacturing method thereof
#835Method of electrolytically depositing materials in a pattern directed by surfactant distribution
#836Protective coating for turbine engine component
#837Electrochemical fabrication method for producing compliant beam-like structures
#838Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
#839Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
#840Method to improve copper electrochemical deposition
#841Electrochemical fabrication process using directly patterned masks
#842Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
#843Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures
#844Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
#845Electrochemical fabrication methods using transfer plating of masks
#846Electrochemical fabrication method for producing multi-layer three-dimensional structures on a porous dielectric
#847Methods and apparatus for forming multi-layer structures using adhered masks
#848Multiple-step electrodeposition process for direct copper plating on barrier metals
#849Bonding copper wire plated with palladium and gold and electroplating process thereof
#850Ductile coatings on additive manufactured components
#851Neutral radical etching of dielectric sacrificial material from reentrant multi-layer metal structures
#852High temperature corrosion resistant composite structure consisting of ruthenium and its alloys
#853Curved high temperature alloy sandwich panel with a truss core and fabrication method
#854Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures