164275 ⎘
Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization
Sub-classes:IMAGING ELLIPSOMETER FOR AREAL LAYER THICKNESS MEASUREMENT OF A SAMPLE AND METHOD USING AN IMAGING ELLIPSOMETER
#2FILM THICKNESS MEASUREMENT DEVICE
#3SEMICONDUCTOR PROCESS DEVICE AND METHOD OF MONITORING SEMICONDUCTOR PROCESS
#4COMBINATION OF MULTIWAVELENGTH RAMAN AND SPECTROSCOPIC ELLIPSOMETRY TO MEASURE A FILM STACK
#5ANGLE-RESOLVED SPECTROSCOPIC ELLIPSOMETER USING SPATIAL LIGHT MODULATOR AND THICKNESS MEASURING METHOD FOR THIN FILM
#6Apparatus to characterize substrates and films
#7Contactless method for polymer coating thickness measurement
#8Systems and methods for augmentation of sensor systems and imaging systems with polarization
#9SUBSTRATE PROCESSING APPARATUS AND METHOD OF MEASURING FILM THICKNESS
#10Spectroscopic Reflectometry And Ellipsometry Measurements With Electroreflectance Modulation
#11Device and method for measuring the profile of flat objects comprising unknown materials
#12Systems and methods for surface normals sensing with polarization
#13Optical metrology models for in-line film thickness measurements
#14THICKNESS MEASUREMENT DEVICE AND METHOD FOR MEASURING THICKNESS OF FIRST LAYER OF PLANT LEAF
#15Laser absorptivity measurement device
#16LAMINATED COATING LAYER, METHOD FOR MANUFACTURING SAME, AND METHOD FOR DETERMINING LAMINATED STRUCTURE
#17Ellipsometer
#18Scatterometry based methods and systems for measurement of strain in semiconductor structures
#19In-situ full wafer metrology system
#20Two-degree-of-freedom heterodyne grating interferometry measurement system
#21MULTILAYER STRUCTURE INSPECTION APPARATUS AND METHOD, AND SEMICONDUCTOR DEVICE FABRICATING METHOD USING THE INSPECTION METHOD
#22Optical monitor
#23Ellipsometer and method for estimating thickness of film
#24Rapid measurement method for ultra-thin film optical constant
#25Multi-dimensional model of optical dispersion
#26Methods and systems for measurement of thick films and high aspect ratio structures
#27Scatterometry based methods and systems for measurement of strain in semiconductor structures
#28Optical metrology device for measuring samples having thin or thick films
#29Phase revealing optical and X-ray semiconductor metrology
#30Ellipsometer and method for estimating thickness of film
#31System and method for use in high spatial resolution ellipsometry
#32HALFWAY CUTTER CHANGING METHOD FOR LARGE-AREA MICROSTRUCTURE CUTTING BASED ON IN-SITUATION FILM THICKNESS MEASUREMENT
#33IN-SITU ELLIPSOMETRY FOR ELECTRIC VEHICLE BATTERY CELL LITHIUM PLATING CHARACTERIZATION
#34Prism coupling methods of characterizing stress in glass-based ion-exchanged articles having problematic refractive index profiles
#35Thin film analysis apparatus and method for a curved surface
#36Measurement methodology of advanced nanostructures
#37Optimizing computational efficiency by multiple truncation of spatial harmonics
#38Detection and measurement of dimensions of asymmetric structures
#39Multilayer film metrology using an effective media approximation
#40Method for measuring thickness variations in a layer of a multilayer semiconductor structure
#41Methods and systems for measurement of thick films and high aspect ratio structures
#42Inspection apparatus and inspection method using the same
#43Control wafer making device
#44Achromatic rotating-element ellipsometer and method for measuring mueller-matrix elements of sample using the same
#45Method And System For Real-Time In-Process Measurement Of Coating Thickness
#46Compensation for Goos-Hanchen error in autofocus systems
#47Optical technique for coating characterization
#48Laminate substrate measurement method, laminate substrate and measurement apparatus
#49Critical dimension measurements with gaseous adsorption
#50METHOD OF AUTHENTICATING A POLYMER FILM BY THICKNESS MEASUREMENT WITH A WHITE LIGHT INTERFEROMETER
#51Control wafer making device and method for measuring and monitoring control wafer
#52Methods and apparatus for measuring height on a semiconductor wafer
#53Optimizing computational efficiency by multiple truncation of spatial harmonics
#54Method and device for determining the position and orientation of a specular surface forming a diopter
#55Method and device for measuring large-area and massive scattered field in nanoscale
#56Prism-coupling systems and methods for characterizing ion-exchanged waveguides with large depth-of-layer
#57Film thickness measuring device and film thickness measuring method
#58Substrate target for in-situ lithography metrology, metrology method for in-situ lithography, and method of manufacturing integrated circuit device by using in-situ metrology
#59Method and system for real-time in-process measurement of coating thickness
#60FILM THICKNESS MEASUREMENT DEVICE AND METHOD
#61Integrated system, integrated system operation method and film treatment method
#62Automatic selection of sample values for optical metrology
#63Metrology systems and methods
#64Atmospheric molecular contamination control with local purging
#65Electronic component thickness measurement method, method for manufacturing a series of electronic components using the measurement method, a series of electronic components manufactured by the manufacturing method, and electronic component inspection apparatus
#66Metrology system optimization for parameter tracking
#67Defect inspecting apparatus and defect inspecting method
#68Measurement device and method for vapour deposition applications
#69Apparatus and method for optical metrology with optimized system parameters
#70METHOD OF AUTHENTICATING A POLYMER FILM
#71Metrology systems and methods
#72Optical metrology using targets with field enhancement elements
#73Layer Thickness Measurement
#74Film thickness monitor
#75Optical characteristic measuring apparatus and optical characteristic measuring method
#76MODULATED ELLIPSOMETER FOR THE DETERMINATION OF THE PROPERTIES OF OPTICAL MATERIALS
#77Atmospheric molecular contamination control with local purging
#78Reconfigurable spectroscopic ellipsometer
#79PATTERN INSPECTION METHOD AND DEVICE FOR SAME
#80Multiple measurement techniques including focused beam scatterometry for characterization of samples
#81POSITION-SENSITIVE METROLOGY SYSTEM
#82High resolution monitoring of CD variations
#83Methods and apparatus for the measurement of film thickness
#84Method of manufacturing eyeglass lens
#85Spectroscopic Scatterometer System
#86Inspection apparatus for lithography
#87Goos-Hanchen compensation in autofocus systems
#88Metrology systems and methods
#89Method of authenticating a polymer film by thickness measurement with a white light interferometer
#90System and method for performing ellipsometric measurements on an arbitrarily large or continuously moving sample
#91Single polarizer focused-beam ellipsometer
#92Method and apparatus for phase-compensated sensitivity-enhanced spectroscopy (PCSES)
#93Spectroscopic scatterometer system
#94Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
#95Sample analyzing method, sample analyzing apparatus, manufacturing method of organic EL element, manufacturing equipment, and recording medium
#96Film Thickness Measuring Method and Substrate Processing Apparatus
#97Methods and apparatus for wavefront manipulations and improved 3-D measurements
#98Virtual measuring device and method
#99Method and apparatus for determining liquid crystal cell parameters from full mueller matrix measurements
#100Modeling conductive patterns using an effective model
#101High resolution monitoring of CD variations
#102Characterizing films using optical filter pseudo substrate
#103Optical metrology systems and methods
#104Spectroscopic ellipsometer and ellipsometry
#105Method for the in-situ and real-time determination of the thickness, optical properties and quality of transparent coatings during their growth onto polymeric substrates and determination of the modification, activation and the modification depth of polymeric materials surfaces
#106Detector configurations for optical metrology
#107SPECTROSCOPIC ELLIPSOMETER AND FILM THICKNESS MEASURING APPARATUS
#108Apparatus for detecting position of substrate, ellipsometer, and film thickness measuring apparatus
#109Systems and methods for characterizing thickness and topography of microelectronic workpiece layers
#110Apparatus and method for removing organic contamination adsorbed onto substrate, and apparatus and method for measuring thickness of thin film formed on substrate
#111Optical inspection system for a wafer
#112Optical Monitoring Apparatus and Method of Monitoring Optical Coatings
#113Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
#114Purge gas flow control for high-precision film measurements using ellipsometry and reflectometry
#115Systems and methods for immersion metrology
#116Detector configurations for optical metrology
#117Method and apparatus for the treatment of a semiconductor wafer
#118Metrological characterisation of microelectronic circuits
#119Extracting ordinary and extraordinary optical characteristics for critical dimension measurement of anisotropic materials
#120High resolution monitoring of CD variations
#121PULSED ELLIPSOMETER DEVICE
#122Sample analyzing method, sample analyzing apparatus, manufacturing method of organic EL element, manufacturing equipment, and recording medium
#123Spectroscopic scatterometer system
#124Methods for characterizing semiconductor material using optical metrology
#125Method for monitoring film thickness using heterodyne reflectometry and grating interferometry
#126Combined use of oscillating means and ellipsometry to determine uncorrelated effective thickness and optical constants of material deposited from a fluid
#127Heterodyne reflectometer for film thickness monitoring and method for implementing
#128Method and apparatus for optically measuring the topography of nearly planar periodic structures
#129Determining wafer orientation in spectral imaging
#130Method and system for measuring overcoat layer thickness on a thin film disk
#131Double sided optical inspection of thin film disks or wafers
#132Method and system for on-line measurement of thickness and birefringence of thin plastic films
#133Multiple angle of incidence spectroscopic scatterometer system
#134Spectrometric measuring instrument
#135Surface inspection apparatus
#136Dew point measurement method and device for carrying out said method
#137Film forming condition determination method, film forming method, and film structure manufacturing method
#138Detector configurations for optical metrology
#139Method of polishing thin film formed on substrate
#140Imaginary polarizing measuring method for simultaneously measuring the optical crystal thickness and the optic axis direction
#141Method and apparatus for measuring thickness of thin film formed on substrate
#142Measuring method, analyzing method, measuring apparatus, analyzing apparatus, ellipsometer, and computer program
#143Apparatus and method for removing organic contamination adsorbed onto substrate, and apparatus and method for measuring thickness of thin film formed on substrate
#144Systems and methods for immersion metrology
#145Method and apparatus for high-speed thickness mapping of patterned thin films
#146Circularly polarized light method and device for determining wall thickness and orientations of fibrils of cellulosic fibres
#147Detector configurations for optical metrology
#148Method of detecting and classifying scratches, particles and pits on thin film disks or wafers
#149Apparatus and method for measuring each thickness of a multilayer stacked on a substrate
#150Scatterometry to simultaneously measure critical dimensions and film properties
#151Reference calibration of metrology instrument
#152Polarization analyzing method
#153Film forming apparatus and film forming method
#154Method of measuring thickness of thin films using diffraction of polarized light through a thin film
#155Ellipsometer apparatus having measurement compensation
#156Apparatus and methods for measuring properties in a TSV structure using beam profile reflectometry